JPS6099535U - 半導体リ−ドフレ−ムと樹脂タブレツトの同時搬送供給装置 - Google Patents
半導体リ−ドフレ−ムと樹脂タブレツトの同時搬送供給装置Info
- Publication number
 - JPS6099535U JPS6099535U JP19267283U JP19267283U JPS6099535U JP S6099535 U JPS6099535 U JP S6099535U JP 19267283 U JP19267283 U JP 19267283U JP 19267283 U JP19267283 U JP 19267283U JP S6099535 U JPS6099535 U JP S6099535U
 - Authority
 - JP
 - Japan
 - Prior art keywords
 - resin tablet
 - conveyance
 - lead frame
 - supply device
 - supply section
 - Prior art date
 - Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
 - Granted
 
Links
- 239000011347 resin Substances 0.000 title claims description 10
 - 229920005989 resin Polymers 0.000 title claims description 10
 - 239000004065 semiconductor Substances 0.000 title claims 4
 - 238000001125 extrusion Methods 0.000 claims description 2
 - 238000001721 transfer moulding Methods 0.000 claims description 2
 - 238000003780 insertion Methods 0.000 claims 3
 - 230000037431 insertion Effects 0.000 claims 3
 
Landscapes
- Special Conveying (AREA)
 - Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
 - Lead Frames For Integrated Circuits (AREA)
 
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| JP19267283U JPS6099535U (ja) | 1983-12-13 | 1983-12-13 | 半導体リ−ドフレ−ムと樹脂タブレツトの同時搬送供給装置 | 
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| JP19267283U JPS6099535U (ja) | 1983-12-13 | 1983-12-13 | 半導体リ−ドフレ−ムと樹脂タブレツトの同時搬送供給装置 | 
Publications (2)
| Publication Number | Publication Date | 
|---|---|
| JPS6099535U true JPS6099535U (ja) | 1985-07-06 | 
| JPH0142343Y2 JPH0142343Y2 (enEXAMPLES) | 1989-12-12 | 
Family
ID=30414586
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date | 
|---|---|---|---|
| JP19267283U Granted JPS6099535U (ja) | 1983-12-13 | 1983-12-13 | 半導体リ−ドフレ−ムと樹脂タブレツトの同時搬送供給装置 | 
Country Status (1)
| Country | Link | 
|---|---|
| JP (1) | JPS6099535U (enEXAMPLES) | 
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| JPH02174238A (ja) * | 1988-12-27 | 1990-07-05 | Yamada Seisakusho:Kk | 半導体封止装置 | 
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| JPS5638219A (en) * | 1979-09-07 | 1981-04-13 | Matsushita Electric Ind Co Ltd | Method and device for adhering tablet | 
| JPS5821344A (ja) * | 1981-07-29 | 1983-02-08 | Matsushita Electric Ind Co Ltd | 樹脂ペレツト供給装置 | 
- 
        1983
        
- 1983-12-13 JP JP19267283U patent/JPS6099535U/ja active Granted
 
 
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| JPS5638219A (en) * | 1979-09-07 | 1981-04-13 | Matsushita Electric Ind Co Ltd | Method and device for adhering tablet | 
| JPS5821344A (ja) * | 1981-07-29 | 1983-02-08 | Matsushita Electric Ind Co Ltd | 樹脂ペレツト供給装置 | 
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| JPH02174238A (ja) * | 1988-12-27 | 1990-07-05 | Yamada Seisakusho:Kk | 半導体封止装置 | 
Also Published As
| Publication number | Publication date | 
|---|---|
| JPH0142343Y2 (enEXAMPLES) | 1989-12-12 | 
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