JPS6099535U - Simultaneous conveyance and supply device for semiconductor lead frames and resin tablets - Google Patents
Simultaneous conveyance and supply device for semiconductor lead frames and resin tabletsInfo
- Publication number
- JPS6099535U JPS6099535U JP19267283U JP19267283U JPS6099535U JP S6099535 U JPS6099535 U JP S6099535U JP 19267283 U JP19267283 U JP 19267283U JP 19267283 U JP19267283 U JP 19267283U JP S6099535 U JPS6099535 U JP S6099535U
- Authority
- JP
- Japan
- Prior art keywords
- resin tablet
- conveyance
- lead frame
- supply device
- supply section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Special Conveying (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図及び第２図は、ロアープランジャー型トランスフ
ァ成形機め金型要部を示す概略縦断面図及びその作用説
明図である。第３図乃至第７図は本考案の実施例を示す
ものであり、第３図及び第４図はその一部切欠平面図及
び一部切欠縦断面図、第５図及び第６図はいずれもその
作用の説明図、第７図は本考案の他の実施例を示す一部
切欠縦断面図である。
２・・・リードフレーム、３・・・チャック機構、ｓｘ
・・・チャック、４・・・リードフレーム搬送供給部、
５・・・金型、６・・・往復移動機構、７・・・樹脂タ
ブレット搬送供給部、７□・・・嵌入孔、８・・・樹脂
タブレット、９・・・ストッパー機構、１０・・・押出
機構。
↑ ↑ ↑
、ローー電
一一−−用一”１ ｒｌｒＴ −
■ １ 目
Ａ、′ＸＡ４Ａ３方２．−
１１ り２＆ｄト・２．−
日へ８７− ↓
↓
、。ｙｙ、 、２．−”Ｘ、、 ３．３．バ一対
１３Ｅ６
Ｊ＼ −１／ｐFIGS. 1 and 2 are a schematic longitudinal sectional view showing the main part of a mold of a lower plunger type transfer molding machine and an explanatory view of its operation. 3 to 7 show an embodiment of the present invention, FIGS. 3 and 4 are a partially cutaway plan view and a partially cutaway vertical cross-sectional view, and FIGS. 5 and 6 are respectively. FIG. 7 is a partially cutaway vertical sectional view showing another embodiment of the present invention. 2...Lead frame, 3...Chuck mechanism, sx
...Chuck, 4...Lead frame conveyance supply section,
5... Mold, 6... Reciprocating mechanism, 7... Resin tablet conveyance and supply section, 7□... Fitting hole, 8... Resin tablet, 9... Stopper mechanism, 10...・Extrusion mechanism. ↑ ↑ ↑ , Low Den 11--Use 1 "1 rlrT - ■ 1 Eye A,' X,, 3.3. A pair of bars
13E6 J\-1/p
Claims (3)
えたリードフレーム搬送供給部と、該リードフレーム搬
送供給部をロアープランジャー型トランスファ成形機に
おけるトランスファモールド金型側へ往復社動させる往
復移動機構と、上記リードフレーム搬送供給部の所要位
置に配設した樹脂タブレットの嵌入孔を備えた樹脂タブ
レット搬送供給部とから構成されていることを特徴とす
る半導体リードフレームと樹脂タブレットの同時搬送供
給装置。(1) A lead frame transport and supply section equipped with a chuck mechanism for engaging and disengaging semiconductor lead frames, and a reciprocating mechanism that moves the lead frame transport and supply section back and forth toward the transfer mold die side of a lower plunger type transfer molding machine. and a resin tablet conveyance and supply section provided with a hole for inserting a resin tablet arranged at a predetermined position of the lead frame conveyance and supply section. .
閉ストッパー機構を配設したことを特徴とする実用新案
登録請求の範囲第（１）項に記載の半導体リードフレー
ムと樹脂タブレットの同時搬送供給装置。(2) Simultaneous operation of the semiconductor lead frame and the resin tablet according to claim (1) of the utility model registration, characterized in that an opening/closing stopper mechanism for the resin tablet insertion hole is disposed on the bottom side of the insertion hole. Conveyance supply device.
トの押出機構を配設したことを特徴とする実用新案登録
請求の範囲第（１）項又は第（２）項に記−載の半導体
リードフレームと樹脂タブレットの同時搬送供給装置。(3) The semiconductor lead according to claim 1 or 2 of the utility model registration claim, characterized in that a resin tablet extrusion mechanism is disposed on the upper side of the resin tablet insertion hole. Simultaneous conveyance and supply device for frames and resin tablets.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19267283U JPS6099535U (en) | 1983-12-13 | 1983-12-13 | Simultaneous conveyance and supply device for semiconductor lead frames and resin tablets |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19267283U JPS6099535U (en) | 1983-12-13 | 1983-12-13 | Simultaneous conveyance and supply device for semiconductor lead frames and resin tablets |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6099535U true JPS6099535U (en) | 1985-07-06 |
| JPH0142343Y2 JPH0142343Y2 (en) | 1989-12-12 |
Family
ID=30414586
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19267283U Granted JPS6099535U (en) | 1983-12-13 | 1983-12-13 | Simultaneous conveyance and supply device for semiconductor lead frames and resin tablets |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6099535U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02174238A (en) * | 1988-12-27 | 1990-07-05 | Yamada Seisakusho:Kk | Semiconductor sealing device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5638219A (en) * | 1979-09-07 | 1981-04-13 | Matsushita Electric Ind Co Ltd | Method and device for adhering tablet |
| JPS5821344A (en) * | 1981-07-29 | 1983-02-08 | Matsushita Electric Ind Co Ltd | Supplying device for resin pellet |
-
1983
- 1983-12-13 JP JP19267283U patent/JPS6099535U/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5638219A (en) * | 1979-09-07 | 1981-04-13 | Matsushita Electric Ind Co Ltd | Method and device for adhering tablet |
| JPS5821344A (en) * | 1981-07-29 | 1983-02-08 | Matsushita Electric Ind Co Ltd | Supplying device for resin pellet |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02174238A (en) * | 1988-12-27 | 1990-07-05 | Yamada Seisakusho:Kk | Semiconductor sealing device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0142343Y2 (en) | 1989-12-12 |
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