JPS6097307A - Photoelectric composite packaging circuit board - Google Patents
Photoelectric composite packaging circuit boardInfo
- Publication number
- JPS6097307A JPS6097307A JP20649883A JP20649883A JPS6097307A JP S6097307 A JPS6097307 A JP S6097307A JP 20649883 A JP20649883 A JP 20649883A JP 20649883 A JP20649883 A JP 20649883A JP S6097307 A JPS6097307 A JP S6097307A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- signal
- optical
- printed circuit
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
Abstract
Description
【発明の詳細な説明】 〔技術分野〕 本発明は集積回路を実装したプリント基板に関する。[Detailed description of the invention] 〔Technical field〕 The present invention relates to a printed circuit board on which an integrated circuit is mounted.
プリント基板における集積回路の相互間の配線は、従来
、第１図に示すように、プリント基板１上に配置した集
積回路２．３の端子間を、導体パターン４で接続してい
た。しかし、このような方法では、導体パターン４の近
くに発振器、電源等の雑音源５が存在すると、導体パタ
ーン４に雑音が重畳し、上記集積回路２．３間の信号伝
達に悪影響を及ぼすことがあった。Conventionally, wiring between integrated circuits on a printed circuit board is such that, as shown in FIG. 1, terminals of integrated circuits 2.3 arranged on a printed circuit board 1 are connected by a conductor pattern 4. However, in such a method, if a noise source 5 such as an oscillator or a power supply is present near the conductor pattern 4, the noise will be superimposed on the conductor pattern 4, which will adversely affect the signal transmission between the integrated circuits 2 and 3. was there.
本発明は上記の点を改善するために成したものであって
、その目的とするところは、プリント基板上において、
雑音源からの影響を受けることなく１．正確な信号伝達
を行なえるような光電複合実装基板を提供することにあ
る。The present invention has been made to improve the above points, and its purpose is to:
1. without being affected by noise sources; The object of the present invention is to provide a photoelectric composite mounting board that allows accurate signal transmission.
以下本発明を実施例として掲げた図面に基づいて説明す
る。The present invention will be explained below based on the drawings shown as examples.
（実施例−１）
第２図において、プリント基板ｌ上に実装した集積回路
２．３の端子６．７間を接続する場合、集積回路２の端
子６からの電気信号を、上記集積回路２の近くに配置し
た、電気−光変換器８に入力し、電気信号を光信号に変
換し、その光信号を、光ファイバ９によシ、集積回路３
０近くに配置した光−電気変換器！０まで伝達し、ここ
で光信号を電気信号に変換し、集積回路３の端子７に上
記電気信号を入力する。このように、集積回路２．３間
の接続を光ファイバを用いて光信号で行なうことにより
、雑音源５による配線への悪影響をなくすことができる
。(Example-1) In FIG. 2, when connecting the terminals 6 and 7 of the integrated circuit 2 and 3 mounted on the printed circuit board l, the electric signal from the terminal 6 of the integrated circuit 2 is connected to the integrated circuit 2. The electrical signal is input to an electrical-to-optical converter 8 placed near the integrated circuit 3, which converts the electrical signal into an optical signal.
Optical-electrical converter placed near 0! 0, the optical signal is converted into an electrical signal, and the electrical signal is input to the terminal 7 of the integrated circuit 3. In this way, by connecting the integrated circuits 2 and 3 with optical signals using optical fibers, it is possible to eliminate the negative influence of the noise source 5 on the wiring.
（実施例−２）
第３図において、１１は従来の集積回路の機能に電気−
光変換機能を付加した集積回路、臣は従来の集積回路の
機能に光−電気変換機能を付加した集積回路である。上
記集積回路１１から下方に出射した光信号を、プリント
基板ｌの下方から挿入した光伝達ロッド口で伝達し、上
記伝達ロッドｌを集積回路圧に下方から入射させて光信
号伝達を行なう。このように信号の伝達に光信号を用い
ているので、プリント基板１上に雑音源５が存在しても
、雑音に影響されることなく、正確な信号伝達ができる
。前記集積回路１１ 、１２の具体例を第４図に示す。(Example-2) In Fig. 3, 11 is an electric circuit that has the function of a conventional integrated circuit.
An integrated circuit with an optical conversion function is an integrated circuit with an optical-to-electrical conversion function added to the function of a conventional integrated circuit. An optical signal emitted downward from the integrated circuit 11 is transmitted through an optical transmission rod port inserted from below the printed circuit board 1, and the optical signal is transmitted by making the transmission rod 1 enter the integrated circuit pressure from below. Since optical signals are used for signal transmission in this way, even if a noise source 5 is present on the printed circuit board 1, accurate signal transmission can be performed without being affected by the noise. A specific example of the integrated circuits 11 and 12 is shown in FIG.
１４は集積回路１１ 、１２の金属リードで、従来の集
積回路２．３とほぼ同一寸法で、セラミックあるいは合
成樹脂から成る集積回路本体１５から出ており、プリン
ト基板１の部品挿入孔１６に挿入し、半田等により導体
゛パターン１７に接続する。譲は集積回路の半導体チッ
プで、集積回路本体１５内部の金属リード１４上に固定
しである。半導体チップ摺は、従来機能の集積部分と、
電気−光変換機能あるいは光−電気変換機能の集積部分
とから成っており、従来機能部の出力を電気−光変換機
能部の入力に接続し、光信号出力を得たり、逆に光信号
から光−電気変換機能部で電気信号に変換し、従来機能
部の入力に接続している。１９は光（赤外光を含むンを
通過する合成樹脂又はガラスから成聞
り、光を入出射する窓で、本体１５下部に希いた穴に位
置する。光伝達ロッドＢは、プリント基板１に開けたロ
ッド種人孔すに下方から押入し、半導体チップ１８の光
電変換部に対向した状態に固定する。なお、集積回路１
１ 、１２には、１本の光伝達ロッドだけではなく、複
数本の光伝達ロッドを挿入する場合もある。光入出射窓
１９はレンズ状になる場合もあるし、第５図のように、
光入出射窓１９を円筒状にして光伝達ロッド０を接続固
定する場合もある。第６図は上記光伝達ロッドＢの具体
例を示したものである。第６図（旬はロッドの曲折部２
１を斜めに切断し、そこに反射膜を施して曲折部２１で
の光損失を減少させたものであり、第６図１ｂｌは分岐
部ρを備え、２か所に光伝達することを可能にしたもの
である。この他にも種々の形状が考えられる。また材質
は光を透過する合成樹脂又はガラスであり、光伝達に適
当な屈折率分布を持たせである。Reference numeral 14 denotes metal leads for the integrated circuits 11 and 12, which have approximately the same dimensions as conventional integrated circuits 2.3, protrude from the integrated circuit main body 15 made of ceramic or synthetic resin, and are inserted into the component insertion hole 16 of the printed circuit board 1. Then, it is connected to the conductor pattern 17 by soldering or the like. This is a semiconductor chip of an integrated circuit, which is fixed on a metal lead 14 inside an integrated circuit main body 15. Semiconductor chip sliding has a conventional function integrated part,
It consists of an integrated part with an electric-to-optical conversion function or an optical-to-electrical conversion function.The output of the conventional function part is connected to the input of the electric-to-optical conversion function part to obtain an optical signal output, or vice versa. The optical-to-electrical conversion function unit converts it into an electrical signal and connects it to the input of the conventional function unit. 19 is a window made of synthetic resin or glass that allows light (including infrared light) to pass through, and is located in a hole cut in the lower part of the main body 15. The rod is inserted into the hole drilled in the hole from below and fixed in a position facing the photoelectric conversion section of the semiconductor chip 18. Note that the integrated circuit 1
1 and 12, not only one light transmission rod but also a plurality of light transmission rods may be inserted. The light input/output window 19 may be lens-shaped, or as shown in FIG.
In some cases, the light input/output window 19 is formed into a cylindrical shape and the light transmission rod 0 is connected and fixed thereto. FIG. 6 shows a specific example of the light transmission rod B. Figure 6 (The bending part of the rod is 2
1 is cut diagonally and a reflective film is applied thereto to reduce light loss at the bending part 21. Figure 6 1bl is equipped with a branching part ρ, making it possible to transmit light to two locations. This is what I did. Various other shapes are also possible. The material is synthetic resin or glass that transmits light, and has an appropriate refractive index distribution for light transmission.
木夾施例では、実施例−１の場合と比べると、電気−光
変換機能あるいは光−電気変換機能を集積回路自体に持
たせることにより、実施例−１での効果に加えてプリン
ト基板１での実装面積を少なくすることができる。Compared to the case of Example-1, in the Mogami Example, by providing the integrated circuit itself with an electrical-to-optical conversion function or an optical-to-electrical conversion function, in addition to the effects of Example-1, the printed circuit board 1 The mounting area can be reduced.
上記のように本発明によれば、プリント基板ｌ上の集積
回路２．３間を、電気−光変換機能あるいは光−電気変
換機能を備え九光電変換部を介して光ファイバ９で結合
し、光伝送することによシ、基板ｌ上の発振器、電源等
の雑音ｆｉ５からの影響を受けることなく、正確な信号
伝送が可能になるという効果がある。As described above, according to the present invention, the integrated circuits 2 and 3 on the printed circuit board 1 are coupled by the optical fiber 9 via nine photoelectric conversion units each having an electrical-to-optical conversion function or an optical-to-electrical conversion function, Optical transmission has the effect of enabling accurate signal transmission without being affected by noise fi5 from the oscillator on the substrate l, the power supply, etc.
第１図は従来のプリント基板上の配線を示す斜視図、第
２図は本発明の第１の実施例を示す斜視図、第３図は本
発明の第２の実施例を示す断面図、第４図は本発明の第
２の実施例に係る集積回路を示す断面図、第５図は本発
明の第２の実施例に係る集積回路を示す断面図、第６図
は本発明の第２の実施例に係る光伝達ロッドの斜視図。
１・・・プリント基板、２．３・・・集積回路、８・・
・電気−光変換器、９・・・光ファイバ、ｌＯ・・・光
−電気変換器。
特許出願人
松下電工株式会社
代理人弁理士 竹 元 敏 丸
（ほか２名）FIG. 1 is a perspective view showing wiring on a conventional printed circuit board, FIG. 2 is a perspective view showing a first embodiment of the present invention, and FIG. 3 is a sectional view showing a second embodiment of the present invention. FIG. 4 is a sectional view showing an integrated circuit according to a second embodiment of the invention, FIG. 5 is a sectional view showing an integrated circuit according to a second embodiment of the invention, and FIG. 6 is a sectional view showing an integrated circuit according to a second embodiment of the invention. FIG. 2 is a perspective view of a light transmission rod according to a second embodiment. 1...Printed circuit board, 2.3...Integrated circuit, 8...
- Electrical-optical converter, 9... Optical fiber, lO... Optical-electrical converter. Patent applicant Matsushita Electric Works Co., Ltd. Representative patent attorney Toshimaru Takemoto (and 2 others)
Claims (1)
において、上記集積回路間を、光電変換部を介して、光
ファイバで結合したことを特徴とする光電複合実装基板
。(1; A photoelectric composite mounting board characterized in that, in signal transmission between a plurality of integrated circuits on a printed circuit board, the integrated circuits are coupled by an optical fiber via a photoelectric conversion section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20649883A JPS6097307A (en) | 1983-10-31 | 1983-10-31 | Photoelectric composite packaging circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20649883A JPS6097307A (en) | 1983-10-31 | 1983-10-31 | Photoelectric composite packaging circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6097307A true JPS6097307A (en) | 1985-05-31 |
Family
ID=16524363
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20649883A Pending JPS6097307A (en) | 1983-10-31 | 1983-10-31 | Photoelectric composite packaging circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6097307A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0349207A2 (en) * | 1988-06-29 | 1990-01-03 | AT&T Corp. | An opto-electronic interface arrangement |
-
1983
- 1983-10-31 JP JP20649883A patent/JPS6097307A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0349207A2 (en) * | 1988-06-29 | 1990-01-03 | AT&T Corp. | An opto-electronic interface arrangement |
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