JPS6094868U

JPS6094868U - Electronic circuit board

Info

Publication number: JPS6094868U
Application number: JP18601283U
Authority: JP
Inventors: 若林　守光; 剛中田
Original assignee: 北陸電気工業株式会社
Priority date: 1983-12-01
Filing date: 1983-12-01
Publication date: 1985-06-28
Also published as: JPH0311904Y2

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of the drawing]

第１図、第３図、及び第４図はそれぞれ本考案、の異な
る実施例の構造を示す断面図、第２図は第１図つ実施例
の要部の平面図、第５図乃至第７図は本考案と従来のも
のとを比較するために行った試験の結果を示す線図であ
る。１・・・・・・基板、２・・・・・・平坦な導電部、３
・・・・・・貫通孔、４・・・・・・導電塗料層゛、５
・・・・・・接着材料層、６・・・・・・中間導電層、
７・・・・・・延長部、８・・・・・・メッキ層。1, 3, and 4 are sectional views showing the structures of different embodiments of the present invention, FIG. 2 is a plan view of the main parts of the embodiment shown in FIG. 1, and FIGS. FIG. 7 is a diagram showing the results of a test conducted to compare the present invention and the conventional one. 1...Substrate, 2...Flat conductive part, 3
...Through hole, 4...Conductive paint layer, 5
...Adhesive material layer, 6...Intermediate conductive layer,
7...Extension portion, 8...Plating layer.

Claims

[Scope of utility model registration request]

(1) In an electronic circuit board in which both sides of a board having a flat conductive part made of metal foil on at least one surface are electrically connected by a through-hole conductive part formed through a through hole provided in the board, the through-hole The hole conductive part includes a conductive paint layer formed to cover the inner surface of the through hole of the substrate and the vicinity of openings at both ends of the through hole, and at least one end of which is in contact with the flat conductive part, and the conductive paint layer. an adhesive material layer formed to cover a portion of the layer that is in contact with the flat conductive portion; and an intermediate conductive layer made of a powdery conductive material adhered to the conductive paint layer by the adhesive material layer. An electronic circuit board comprising: a conductive plating layer formed to cover the surface of the intermediate conductive layer and the surface of the conductive paint layer not covered by the intermediate conductive layer.

(2) The conductive through-hole of the electronic circuit board according to claim 1, wherein the adhesive material layer is provided with a radial pattern on the flat conductive part. Department.