JPS6094868U - Electronic circuit board - Google Patents

Electronic circuit board

Info

Publication number
JPS6094868U
JPS6094868U JP18601283U JP18601283U JPS6094868U JP S6094868 U JPS6094868 U JP S6094868U JP 18601283 U JP18601283 U JP 18601283U JP 18601283 U JP18601283 U JP 18601283U JP S6094868 U JPS6094868 U JP S6094868U
Authority
JP
Japan
Prior art keywords
conductive
layer
hole
circuit board
electronic circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18601283U
Other languages
Japanese (ja)
Other versions
JPH0311904Y2 (en
Inventor
若林 守光
剛 中田
Original Assignee
北陸電気工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 北陸電気工業株式会社 filed Critical 北陸電気工業株式会社
Priority to JP18601283U priority Critical patent/JPS6094868U/en
Publication of JPS6094868U publication Critical patent/JPS6094868U/en
Application granted granted Critical
Publication of JPH0311904Y2 publication Critical patent/JPH0311904Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図、第3図、及び第4図はそれぞれ本考案、の異な
る実施例の構造を示す断面図、第2図は第1図つ実施例
の要部の平面図、第5図乃至第7図は本考案と従来のも
のとを比較するために行った試験の結果を示す線図であ
る。 1・・・・・・基板、2・・・・・・平坦な導電部、3
・・・・・・貫通孔、4・・・・・・導電塗料層゛、5
・・・・・・接着材料層、6・・・・・・中間導電層、
7・・・・・・延長部、8・・・・・・メッキ層。
1, 3, and 4 are sectional views showing the structures of different embodiments of the present invention, FIG. 2 is a plan view of the main parts of the embodiment shown in FIG. 1, and FIGS. FIG. 7 is a diagram showing the results of a test conducted to compare the present invention and the conventional one. 1...Substrate, 2...Flat conductive part, 3
...Through hole, 4...Conductive paint layer, 5
...Adhesive material layer, 6...Intermediate conductive layer,
7...Extension portion, 8...Plating layer.

Claims (2)

【実用新案登録請求の範囲】[Scope of utility model registration request] (1)少なくとも一面に金属箔からなる平坦な導電部を
有する基板の両面を該基板に設けた貫通孔を通して形成
したスルーホール導電部により電気的に接続してなる電
子回路用基板において、前記スルーホール導電部は、前
記基板の貫通孔の内面と該貫通孔の両端開口部周辺とを
覆うように形成されて少なくとも一端が前記平坦な導電
部に接触している導電塗料層と、前記導電塗料層の前記
平坦な導電部に接触している部分を覆うように形成され
た接着材料層と、前記接着材料層により前記導電塗料層
に対して接着された粉状導電物質からなる中間導電層と
、前記中間導電層の表面と該中間導電層により覆われて
いない導電塗料層の表面とを覆うように形成された導電
メッキ層とを具備したことを特徴とする電子回路用基板
(1) In an electronic circuit board in which both sides of a board having a flat conductive part made of metal foil on at least one surface are electrically connected by a through-hole conductive part formed through a through hole provided in the board, the through-hole The hole conductive part includes a conductive paint layer formed to cover the inner surface of the through hole of the substrate and the vicinity of openings at both ends of the through hole, and at least one end of which is in contact with the flat conductive part, and the conductive paint layer. an adhesive material layer formed to cover a portion of the layer that is in contact with the flat conductive portion; and an intermediate conductive layer made of a powdery conductive material adhered to the conductive paint layer by the adhesive material layer. An electronic circuit board comprising: a conductive plating layer formed to cover the surface of the intermediate conductive layer and the surface of the conductive paint layer not covered by the intermediate conductive layer.
(2)前記接着材料層は前記平坦な導電部の上に放射状
のパターンマ設けられていることを特徴とする実用新案
登録請求の範囲第1項に記載の電子回路用′基板のスル
ーホール導電部。
(2) The conductive through-hole of the electronic circuit board according to claim 1, wherein the adhesive material layer is provided with a radial pattern on the flat conductive part. Department.
JP18601283U 1983-12-01 1983-12-01 Electronic circuit board Granted JPS6094868U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18601283U JPS6094868U (en) 1983-12-01 1983-12-01 Electronic circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18601283U JPS6094868U (en) 1983-12-01 1983-12-01 Electronic circuit board

Publications (2)

Publication Number Publication Date
JPS6094868U true JPS6094868U (en) 1985-06-28
JPH0311904Y2 JPH0311904Y2 (en) 1991-03-20

Family

ID=30401899

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18601283U Granted JPS6094868U (en) 1983-12-01 1983-12-01 Electronic circuit board

Country Status (1)

Country Link
JP (1) JPS6094868U (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS519143A (en) * 1974-07-15 1976-01-24 Matsushita Electric Works Ltd Netsukasoseijushitairumoyotsukeyo chitsupuseikeihoho
JPS5247824A (en) * 1975-10-15 1977-04-16 Hodogaya Chem Co Ltd Method for solubilizing copper phthalocyanine dyes into hydrocarbon so lvents
JPS5544398U (en) * 1979-10-04 1980-03-22
JPS5874097A (en) * 1981-10-29 1983-05-04 松下電器産業株式会社 Method of producing printed circuit board

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS519143A (en) * 1974-07-15 1976-01-24 Matsushita Electric Works Ltd Netsukasoseijushitairumoyotsukeyo chitsupuseikeihoho
JPS5247824A (en) * 1975-10-15 1977-04-16 Hodogaya Chem Co Ltd Method for solubilizing copper phthalocyanine dyes into hydrocarbon so lvents
JPS5544398U (en) * 1979-10-04 1980-03-22
JPS5874097A (en) * 1981-10-29 1983-05-04 松下電器産業株式会社 Method of producing printed circuit board

Also Published As

Publication number Publication date
JPH0311904Y2 (en) 1991-03-20

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