JPS6094233A - Remadying system for inferior packaging of electronic part - Google Patents

Abstract

PURPOSE:To carry out the packaging of electronic parts in an efficient and labour-saving manner, by checking inferior packaging with the use of a checker after the electronic parts are packaged on a substrate to which a code mark is applied, and reading the code mark on the substrate so that the substrate is sorted out and is sent to a remedying process system. CONSTITUTION:After chip parts are attached to a part of the surface of a substrate to which a code mark is previously applied, by means of a chip loading machine 2 under instructions from a control box 1, inferior packaging such as, for example, attachment of erroneous parts, is detected by a characteristic checker 3, and as well another inferior packaging such as, for example, positional shift of electronic parts, is checked by a positional shift checker 4. Further, when arrival of a substrate having inferior packaging at a separate conveyor 5 is detected by a code reader 12, this substrate is transferred to an inferior position indicating machining 17 by means of a inferior substrate transferring conveyor 8, thereby the worker remedies the inferior position on the substrate in accordance with the content of the inferior packaging which is displayed by the machine 17.

Description

DETAILED DESCRIPTION OF THE INVENTION Technical Field The present invention relates to a mounting defect recycling system in which boards with electronic component mounting defects are sorted and transported to a recycling process, and the defective parts are repaired.

BACKGROUND ART Conventionally, in a production line in which various chip components are mounted on an assembly board (hereinafter simply referred to as "substrate") using an automatic chip mounting machine, a A regeneration system is adopted in which the mounting status of parts is inspected using a checker, and if there is a mounting defect, it is artificially removed from the production line and placed in a rain bath, and the rain is collected and the defective parts are repaired in a separate process. Normal.

However, in this recycling system, boards with mounting defects must be manually removed, and workers individually mark the defective parts of the extracted boards and store them in a dry place. It is time-consuming, and furthermore, there are various problems such as when the desired capacity or characteristics are not installed at the pre-programmed location due to mounting defects, or when the two positions are misaligned due to the mounting orientation, so the remanufacturing process Extremely inefficient work is forced as the defective state must be confirmed again using a checker and then repaired.

DISCLOSURE OF THE INVENTION In view of the above-mentioned circumstances, the present invention provides a system for regenerating defective mounting of electronic components, which can automatically sort boards with defective mounting and repair defective parts efficiently and intensively. With the goal.

That is, in the reproduction system according to the present invention.

A code mark is placed on the board surface, and when a checker detects a mounting defect in an electronic component, a code league reads the code mark on the board surface, and according to the code, only the board with the mounting defect is automatically removed on a separate conveyor. The sorting is carried out to the remanufacturing process, and the code of the mark read by the code league along with the defect data detected by the checker is sent to the defect data editing controller, and the board with the mounting defect is identified by code comparison with the editing controller. By transporting the sorted items to the recycling process and displaying defective data on a defective location indicator, defective locations can be repaired extremely efficiently.

Example The following will be described with reference to the drawings.

In the illustrated embodiment, the chip is mounted in response to predetermined program instructions from the control box l; 7a2
Chip components are mounted on the board P.

A code mark M is provided on each board surface of a board P on which chip components are mounted. This code mark M is /
It can be formed by pasting a label as a hew coat or by printing an 8-code. It is also possible to provide code marks by magnetic printing, and the coat marks M are used to manage each board (each board) as described below.

A characteristic checker 3 is incorporated in the chip mounting a2, and the characteristic checker 3 automatically detects mounting defects such as when a chip component with a capacity and characteristics other than those specified in advance is mounted 71 at a predetermined point on the board P. Can be detected.

In addition, the IQ Tazure Checker 4 is installed behind the chip [2].
is located. This positional misalignment checker 4 is designed to detect defective mounting of chip parts B (6M 1', and the quality of the chip parts). This device has a function of checking the mounting status of electronic components from a wide range of angles.A separate conveyor 5 is provided behind the positional deviation checker 4.
9 The conveyor 6.7 from the position deviation checker 4 and the board with mounting defects detected by each checker 3.4 (
Hereinafter referred to as "defective board") and board with no mounting defects (hereinafter referred to as "defective board").
Hereinafter, this will be referred to as a "good board." ).

Further, the separate conveyor 5 branches into a defective substrate conveyor 8 and a good substrate conveyor 9, and the defective substrate conveyor 8 is arranged so as to continue to the recycling process.

A series of mechanisms up to the stamen, the chip mounting machine 21 position shift and red 4. Code league 10 for separate conveyor 5
, 11 and 12 are installed internally.

Each of the readers 10, 11, 12 functions to read a code mark M attached to the surface of the board P. Ma? - rise j#
The control boxes 1, 14, and 1q are connected to each other via control boxes 1, 14, and 15. In the chip mounting machine 2, when the characteristic checker 3 detects a mounting defect, the defect data and the code read from the board by the code reader 10 are sent from the control box l.
4 controller 13. When the positional deviation checker 4 detects another mounting defect, the code reader 11
The code mark on the board is read and a coat signal is sent from the control box 14 to the editing controller 13 along with the defective data. On the other hand, edit controller 1
3, the defect data sent from each control box is edited and stored by accumulating it with the code 6
In addition, the coat mark 12 of the separate conveyor 5 reads each coat mark on the boards that are sequentially fed in, and collates it with the editing controller 13 via the control box 15 to see if it is a manually entered code along with defective data. . If the code mark of the currently sent board matches the code stored in the editing controller 13, the board is classified as a defective board and transported to a recycling process by the defective board conveyor 8. On the other hand, when the code mark read by the code reader 12 does not exist in the storage coat of the editing controller 13, the board is sent backward along the non-defective conveyor 9. Therefore, by reading the code mark attached to the board surface of the board P with the code reader 12, the separate conveyor 5 can automatically sort and transport only defective boards to the recycling process.

A defective location indicating device 17 having a built-in code reader 16 is arranged in the regeneration process. Similar to the separate conveyor 5, this defective point indicator 17 is connected to the editing controller 13 so as to be able to collate coats. When a defective board is sent to the recycling process, the code mark on each board is read by the code reader 16, and the editing controller 1 is activated according to the code.
3, and the contents of this defective data are specifically displayed on the defective location indicator 17. Therefore, in the remanufacturing process, a worker can efficiently repair mounting defects according to the details of the defect displayed on the defect location indicator 17.

The repaired board can be sent to the non-defective conveyor 19 by the recycled conveyor 8 following the iIf raw process, and carried out to the rear together with the non-defective board.

Effects of the Invention According to the recycling system for mounting defects according to the present invention, it is possible to automatically sort defective boards and good substrates without relying on human hands, and the recycling process can be carried out according to the specific content of the defect. Therefore, it is possible to perform extremely rational and efficient mounting and assembly of electronic components.

[Brief explanation of the drawing]

FIG. 1 is an 11-sided view of a board applied to the regeneration system for mounting defects according to the present invention, and FIG. 2 is an explanatory diagram without showing flowchart 1 of the regeneration system. P: board, M : Coat mark, 22 Electronic component mounting machine, 3
, 4: Chain force, 5: Separate conveyor, 10, 11
, 12: Code reader, 13: Defective data editing controller, 16: Code reader, 17・Defective location indicator・

Claims (4)

[Claims] (1) Labels on the surface of the board on which various electronic components are mounted.
A code mark is attached by printing, etc., and after mounting electronic components on the board, a checker detects a mounting defect, and a code league reads the code mark from the board with the mounting defect, and detects a mounting defect according to the code. A remanufacturing system for defective mounting of electronic components, characterized in that defective parts can be repaired by sorting and transporting only boards with defects to a reprocessing process. (2) Labels on the surface of the board on which various electronic components are mounted.
Coat marks are printed, etc., and after mounting electronic components on the board, a checker detects a mounting defect, and along with the defective data, a code league reads the code mark from the board and sends it to the defect data editing controller. After checking the code with the controller, only the boards with mounting defects are sorted and transported to the recycling process on a separate conveyor, and then checking the code with the defective data editing controller and displaying the defective data on the defective place display to identify the defective parts. A remanufacturing system for defective mounting of electronic components, which is characterized by being repairable. (3) The mounting defect reproduction system according to claim 1 or 2, wherein the code mark is formed of a bar code. (4) The mounting defect recovery system according to claim 1 or 2, wherein after the defective portion is repaired, boards with no mounting defects are fed together onto the conveyor.