JPS6092635A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS6092635A
JPS6092635A JP20147283A JP20147283A JPS6092635A JP S6092635 A JPS6092635 A JP S6092635A JP 20147283 A JP20147283 A JP 20147283A JP 20147283 A JP20147283 A JP 20147283A JP S6092635 A JPS6092635 A JP S6092635A
Authority
JP
Japan
Prior art keywords
wirings
wiring
signal
type
diffusion regions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP20147283A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0151057B2 (enExample
Inventor
Hideo Kikuchi
菊池　秀夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP20147283A priority Critical patent/JPS6092635A/ja
Publication of JPS6092635A publication Critical patent/JPS6092635A/ja
Publication of JPH0151057B2 publication Critical patent/JPH0151057B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP20147283A 1983-10-27 1983-10-27 半導体装置 Granted JPS6092635A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20147283A JPS6092635A (ja) 1983-10-27 1983-10-27 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20147283A JPS6092635A (ja) 1983-10-27 1983-10-27 半導体装置

Publications (2)

Publication Number Publication Date
JPS6092635A true JPS6092635A (ja) 1985-05-24
JPH0151057B2 JPH0151057B2 (enExample) 1989-11-01

Family

ID=16441643

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20147283A Granted JPS6092635A (ja) 1983-10-27 1983-10-27 半導体装置

Country Status (1)

Country Link
JP (1) JPS6092635A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62111450A (ja) * 1985-11-08 1987-05-22 Matsushita Electronics Corp 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62111450A (ja) * 1985-11-08 1987-05-22 Matsushita Electronics Corp 半導体装置

Also Published As

Publication number Publication date
JPH0151057B2 (enExample) 1989-11-01

Similar Documents

Publication Publication Date Title
US5220199A (en) Semiconductor integrated circuit device in which a semiconductor chip is mounted with solder bumps for mounting to a wiring substrate
US5216280A (en) Semiconductor integrated circuit device having pads at periphery of semiconductor chip
JP3898350B2 (ja) 半導体装置
JPH0338043A (ja) 半導体集積回路装置
US6407460B1 (en) Multilayer circuit board
JPS6092635A (ja) 半導体装置
JP2664485B2 (ja) セラミック多層配線板
JPH01214048A (ja) 半導体集積装置
JPS59144171A (ja) 半導体集積回路装置
CN220173720U (zh) 一种衬底结构及超导量子芯片
JPH0526738Y2 (enExample)
JPS61225842A (ja) 半導体装置
JP2961728B2 (ja) 半導体チップ搭載用基板
JPH1075146A (ja) ノイズフィルタ
JPS63255941A (ja) 半導体集積回路
JP2681425B2 (ja) 半導体集積回路装置
JP3128572B2 (ja) 超伝導集積回路チップ用ボンディングパッドの構造
JPS62237746A (ja) 半導体集積回路
JPH0283953A (ja) 半導体集積回路
JPH04373151A (ja) 半導体装置
JPH0786281A (ja) 半導体装置および半導体装置の製造方法
KR101035594B1 (ko) 콘택홀 간을 연결하는 연결부와 비아홀 간을 연결하는연결부가 서로 수직하게 배치된 반도체 집적 소자
JPH04186828A (ja) 半導体装置
JP3520649B2 (ja) 半導体装置
JPH04133431A (ja) 半導体回路