JPS6091695A - Method of producing small-sized electronic device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a method of manufacturing a small electronic counter.

[Technical background of the invention]

Recently, small electronic type! ! Compact electronic devices such as electronic devices have become so thin that they can be called card-shaped.

However, the small electronic devices that have been commercialized in the past,
The case frame is manufactured by incorporating electronic components such as a liquid crystal display cell, wiring boards, etc. into the case frame, and screwing a case front plate and a case back plate onto the top and bottom of the case frame. It is necessary to make the front panel and case back panel thicker to a certain extent in order to secure them with screws, and for this reason, even though conventional small electronic devices are thin, their thickness is far more than 1 mm. Therefore, it was considered difficult to make the device even thinner.

[Purpose of the invention]

This invention was made in view of the above-mentioned circumstances, and its purpose is to create a small electronic device that is significantly thinner than conventional small electronic devices. The purpose is to provide a manufacturing method.

[Summary of the invention]

In other words, the present invention includes a step of disposing a film-like electronic component and a wiring board thereon while intermittently feeding a strip-shaped film material that becomes a surface material of an electronic device, and a step of disposing the film-like electronic component and the wiring board on the belt-like film material, which is a surface material of an electronic device. A step of applying a filler material onto the placed film material 4J and polymerizing and adhering a back panel, which will become the back surface material of the electronic device, onto the filler material, and a step of cutting the film material to match the outer shape of the product. With this, small electronic devices can be manufactured without the need for screws at all.

[Embodiments of the invention]

An embodiment of the present invention will be described below with reference to the drawings.

Now, the tFi structure of a small electronic device manufactured by Komei's manufacturing method will be explained.

Figure 1 shows the external appearance of a small electronic control device manufactured by the manufacturing method of the present invention. A battery section 4 is formed.

Figure 2 is an exploded perspective view of the above-mentioned small electronic A1 calculator,
The figure is also an enlarged sectional view taken along the line A-A in Figure 1,
The main body 1 of this small electronic meter sieve includes a frame 11 having a shape as shown in FIG. and pack film 15 are formed into an ffi layer.

Inside the main body 1, wiring 21.21 is printed on both sides of a synthetic resin film, and an insulating material 22.21 is formed on the wiring.
22, a film-like liquid crystal display cell 30, and a film-like solar cell 40 are arranged.
A synthetic resin film spacer 50 having approximately the same external shape as 0 is polymerized.

An LSI chip 23 and chip components 24 and 24 such as capacitors and diodes are attached to the wiring board 20 by fitting into through holes drilled in the wiring board 20. There are multiple sets of split-type fixed contacts 25.2 that are short-circuited by movable contacts to be described later.
5 are formed in an array.

The spacer 50 is provided with a large number of partial openings 51.51 surrounding each of the fixed contacts 25.25 on the wiring board 20, and the LSI chip 23 and chip components 24.24 are formed on the lower surface thereof. A through hole 52.53 is provided as an escape for the portion of the wiring board 20 that protrudes from the wiring board 20, and this spacer 50 is inserted into the through hole 52.53 so that the LS
The I-chip 23 and chip components 24 and 24 are fitted and bonded onto the wiring board 20.

The wiring board 20 and the spacer 50 are arranged in the frame 11, and the film-like liquid crystal display cell 30 and the film-like solar cell 40 are also arranged in the frame 11 in parallel with the wiring board 20, The liquid crystal display cell 30 is connected to the wiring board 20 by a film-like heat seal connector 31. ! 40 is also connected to a film-like heat seal connector 411 [therefore, the wiring board 20].

Note that the frame 11 is made of stainless steel tM (StJ
The frame 11 is formed by punching out a thin metal plate such as S), and the frame 11 is provided as a reinforcing material.

As shown in the cross section of FIG. 3, the film-like liquid crystal display cell 30 has a transparent display electrode 33 and an alignment film (not shown) on a synthetic resin film surface such as polysulfone.
A pair of upper and lower transparent film groups 132a and 3 formed with
2b is adhered via a sealing material 34, and liquid crystal is filled between the upper and lower film substrates 32a and 3211, and this liquid crystal display cell 30 is of the T-N type (twisted type).
The polarizing films 35a and 35b disposed on the upper and lower surfaces of the polarizing films 35a and 35b are of the nematic type.
A reflective plate 3 is attached to the outer surface of the polarizing film 32a and 32b with a transparent adhesive 36, and a reflective plate 3 is attached to the lower surface of the lower polarizing film 35b.
7 is adhered with a transparent adhesive 36. In addition, 3
3a is a terminal portion of the electrode 33, and the heat seal connector 31 is connected to this terminal portion 33a by heat compression bonding. The total thickness of this film-like liquid crystal display cell 30 including the polarizing films 35a and 35b and the reflecting plate 31 is approximately 55 mm.
0μ (0.55M).

Further, as the cross section of the film solar cell 40 is shown in FIG.
A metal film substrate 42 with a transparent electrode 4 formed on the bottom surface
Amorphous silicon 45 is sandwiched between an epoxy resin-based transparent film 45 formed with 6, and the thickness of this film solar cell 40 is 202μ (approximately 0.2#).
).

The liquid crystal display cell 30 has its upper surface, that is, the upper surface of the upper polarizing plate 35a, bonded to the lower surface of the display section 2 of the front film 13 using a transparent adhesive 60 applied to the lower surface of the front film 13. Although not shown, the upper surface of the solar cell 40 is also bonded to the lower surface of the solar cell portion 4 of the front film 13 with the transparent adhesive 60.

On the other hand, the front panel 12 and the pack panel 14 are each made of a thin metal plate (stainless steel, etc.) with a thickness of about 100 μm. 51 and the liquid crystal display cell 30.
a frontage 122 into which the upper part of the solar cell 40 is fitted;
Further, recesses 124 and 125 are formed by half-etching on the lower surface of the front panel 12 to receive the portions of the LSI chip 23 and chip components 24 and 24 that protrude above the spacer 50. has been done.

The front panel 12 is integrated with the frame 11 by bonding its lower surface to the upper surface of the frame 11, and the spacer 50, which is referred to as the wiring board 20, is attached to the lower surface of the front panel 12. bonded, and further the LSI
Chips 23 and chip components 24.24 are also glued into the recesses 124, 125 of this front panel 12.

In addition, the front film 13 and the pack film 15
The pack film 15 is laminated to the lower surface of the back panel 14 to constitute the back material of the small electronic device, and the front film 13 is made of a polyester synthetic resin film with a thickness of about 70μ. It is laminated on the upper surface of the front panel 12 to constitute the surface material of the small electronic device.

The front film 13 has a mask printed on the lower surface of the transparent film except for the display section 2 and the solar cell section 4, and each key section 3a of the keyboard section 3.

The surface material is made by laminating the front panel 12 and the front film 13, and each key portion 3a, 3a of the keyboard portion 3 is printed with numbers, symbols, etc. on the front panel 3a. This key part 3a has a single layer structure only for the front film 13.
, 3a can be elastically deformed.

Then, each key portion 3 of the front film 13
A, 3a has a movable film-like movable film on the lower surface thereof, which is opposed to each of the fixed contacts 25, 25 on the surface of the wiring board 20, and is brought into contact with the fixed contacts 25 by pressing the key portions 3a, 3a of the front film 13. A contact 26 is provided. This movable contact 20 is made by adhering carbon Ig 128 to the lower surface of the double-sided adhesive film 27 and cutting it into a predetermined size. C
It is adhesively fixed to the front film 13.

In addition, in FIG. 3, 16 is the front panel 12.
The wiring board 20. LSI chip23. Chip parts 24. This is a filler for fixing the liquid crystal display cell 30, the solar cell 40, etc., and this filler 1G is filled with a quick-drying liquid adhesive (for example, an acrylic or epoxy two-component adhesive) by dropping it. The back panel 14 is formed by applying pressure to the quick-drying liquid adhesive before it hardens, thereby curing the filler material 16.
It is glued with. The filler cap 1 also covers the outer periphery of the frame 11, and the outer periphery of the filler 16 (the portion that becomes the outer periphery of the main body 1) is finished into a flat surface by finishing cutting.

That is, in the above-mentioned small electronic calculator, the front film 13 and the front panel 12 constituting the surface material are adhered to the frame 11, and the wiring board 20 is attached to the underside of the front panel 12. A 30° film-like liquid crystal display, a film-like solar cell 40, etc. are placed and bonded, and these are filled with 16 tons of filler material.
- In addition to being fixed, the back panel 14 and pack film 15, which serve as backing materials, are adhered to this filler material 16. This small electronic measuring machine does not require any screws, so its thickness is The thickness can be significantly reduced. The thickness of this small electronic calculator is approximately 0.8m.
It is m.

Next, a method for manufacturing the above-mentioned small electronic calculator will be explained.

The manufacturing method of this embodiment is as shown in the outline in FIG.
The front panel 12 is laminated on the film material 13a while intermittently feeding the strip-shaped film material 13a to form the surface material of the small electronic calculation example, and a film-like electronic component (film-like liquid crystal display cell) is laminated on the film material 13a. 3
0, a film solar cell 40), a wiring board 20, etc., and apply the filler 16 thereon.
On top is the back panel 1 which is the back material of the small electronic calculator.
4 is polymerized and bonded with a pack film 15 laminated thereon, and then the film material 13a is cut along with the outer circumferential portion of the filler 16 to match the external shape of the product, thereby completing a small electronic calculator. This manufacturing method will be specifically explained as follows.

FIG. 6 shows the film material 13a, which has a width of 7. This film material 13a is in the form of a band slightly wider than the front film 13, and the front film 13 is arranged at regular intervals on its lower surface. Display section 2. Keyboard part 3. Printing that will become the solar cell section 4 is applied.

Note that each front film 13.13 formed on this film material 13a is cut along the cutting line shown by a two-dot chain line in FIG. 6 in a laser beam cutting process to be described later.

Also, the front film 13 of this film material 13a
A transparent adhesive 60 (see Fig. 3) is applied to the entire lower surface of the part, except for the movable contact adhesive parts of the Freon 1 to film 13.
is applied, and this adhesive-applied surface is film material 1.
It is covered with a band-shaped separator (release paper) 13b having the same width as 3a. This strip-shaped film material 13a is wound into a roll, and is unwound from this roll and sent to an assembly line with the adhesive coated side facing upward.

FIG. 7 shows the feeding mechanism of the film material 13a, and the film material 13a fed out from the roll is
A pair of upper and lower movable grips 7 move back and forth with the separator 13b covering the adhesive applied surface being peeled off.
1.71, the data is sent intermittently. Note that the separator 13b is wound around a winding shaft 70 and peeled off from the film material 13a. The movable grip 71.71 moves forward by a certain distance by gripping the film material 13a from above and below, and then releases the film material 13a and retreats to the original position, as shown by the broken line arrow in the figure. The film element 113a is moved, and the film element 113a is intermittently fed a fixed distance by repeating the reciprocating movement of the movable grip 71.degree.11. Also, in Figure 7,
Reference numeral 72.72 denotes a fixed grip that pinches and grips the film material 13a to prevent the film material 13a from shifting from its stop position when the movable grip 71.71 is not gripping the film material 11113a. 72, the movable grip 71.71 feeds the film material 13a by a certain distance, and the film material 1
The movable grip 71.degree. 11 grips the film material 13a when the grip 3a is released, and when the movable grip 71.degree. 11 returns to its original position and grips the film material 13a again, it releases the film material 13a. The movable grip 71.71 and the fixed grip 72.72 are arranged so as to grip the part of the film material 13a to which the adhesive 60tfi is not applied (the part of the front film 13 and the next front film 13). Therefore, when the movable grip 71.71 and the fixed grip 72.72 release the film material 13a, the film material 13a is not pulled up by the upper grip. Further, this film material feeding mechanism is provided at appropriate intervals at a plurality of locations on the assembly line.

Therefore, the film material 13a that is intermittently fed through the assembly line with the adhesive coated side facing upward is first assembled with the front panel 12, the film-like liquid crystal display cell 30, and the film-like solar cell 4.゜ are placed and glued at the same time.

The front panel 12 is formed of a large number of strip-shaped metal films 12a as shown in FIG. 8 at regular intervals and wound into a roll (see FIG. 5). The sheet is punched out along the outline indicated by the two-dot chain line in FIG. 8, and is once placed on the front panel positioning portion of the positioning table 80 shown in FIG. 11 by vacuum suction means (not shown).

On the other hand, as shown in FIG. 9, the film-like liquid crystal display cell 30 includes an upper film base material 32a and a polarizing plate 35a.
By making the lower film base material 32b and the polarizing plate 35b, and the reflecting plate 31 on the lower surface thereof, into a band shape,
A large number of liquid crystals are formed on this band 30a at regular intervals (this display cell band 30a is also wound into a roll as shown in FIG. 5), and each film-like liquid crystal formed on this display cell band 30a is The display cell 30.30 is also punched out along the outline indicated by the two-dot chain line in FIG. 9, and is once placed on the liquid crystal display cell positioning portion of the positioning table 80 by vacuum suction means (not shown).

In addition, as shown in FIG. 10, the film solar cells 40 are formed by forming a large number of solar cells at regular intervals by forming a metal film substrate 42 having an insulating layer 43 on its upper surface into a band shape. The band 40a is also wound into a roll as shown in FIG.
It is punched out along the outline indicated by the two-dot chain line in the figure, and is once mounted on the solar cell positioning portion (not shown) of the positioning table 80 shown in FIG. 11 by vacuum suction means. In addition, in FIG. 10, 38 is a terminal portion of the solar cell 40, and 49 is a sealing material for sealing the periphery between the metal film substrate 42 and the upper film 45 of the solar cell 40.

As shown in FIG. 11, the front panel 12, liquid crystal display cell 30, and solar cell 40 are placed on the positioning table 80 with their back surfaces (lower surfaces) facing upward. . Further, the liquid crystal display cell 30 and the solar cell 40 may be placed on the positioning table 80 by inserting and placing them from the openings 122 and 123 after placing the front panel 1 to the panel 12, or by placing the liquid crystal display cell 30 and the solar cell 40 on the positioning table 80. It may be placed before the panel 12 is placed.

The front panel suction jig 81 shown in FIG.
, a liquid crystal display cell suction jig 82 and a solar cell suction jig (
(not shown), is carried onto the film material 13a whose feeding has been stopped, is positioned and placed on the front film 13 portion, and the transparent adhesive 60 is
is adhered to the portion of the front film 13 coated with. The front panel 12, the liquid crystal display cell 30, and the solar cell 40 are bonded to the film material 13a by rolling the film material 13a with a rolling pressure roller 84 while supporting the film material 13a on a support base 83, as shown in FIG. This is done by pressing, whereby the front panel 12 is laminated on the surface of the film material 13a, and the liquid crystal display cell 30 and the solar cell 40 are adhered to the surface of the film material 138. The rolling roller 84 moves while rolling the front panel 1-panel 12, etc. on the film material 13a as shown by the arrow in FIG. 12, and after rolling, is pulled upward and returned to its original position.

The film material 13a on which the front panel 12, liquid crystal display cell 30, and solar cell 40 are arranged and bonded in this way is
The assembly line is sent again and stopped at the next component assembly position, where the film-like movable contact 26 and the spacer 5 are assembled.
0 and frame 11 are incorporated.

The film-like movable contact 2G is made by cutting a double-sided adhesive film 27 with a carbon film 28 adhered to one side to a predetermined size as described above. 13 each of the key portions 3a, the same number of each of the key portions 3a as the number of 3a,
They are arranged in one set corresponding to the arrangement of 3a, and a large number of sets are attached to the strip separator 85 (see FIGS. 13 and 14) at regular intervals (attached on the surface to which the carbon film 28 is not bonded). has been done. The contact band 26a, which has a large number of sets of movable contacts 26, 26 attached to the band-shaped separator 85, is wound into a roll as shown in FIG. 5 and is unwound from the roll.
The film-like movable contacts 26, 26 are peeled off from the separator 85 one set at a time and removed from the film material 13.
It is designed to be incorporated into a.

13 and 14 show an example of a method for peeling off the movable contacts 26.26 from the separator 85. In the figures, 86.86 indicates 1 arranged in a position corresponding to the key portions 3a, 3a. A separator presser 87.87 for pressing the separator 85 from above around each movable contact 26.26 of the set is disposed below the separator 85 so as to face approximately the center of each movable contact 26.2G. The movable contact 26.213 is a contact push-up needle.
As shown in FIG. 13, when each movable contact 26.2G is above the contact push-up needle 87.87, the contact band 26
a stops feeding, and then the separator presser 86.
110 and the contact push-up needle 87.87
By raising the contact push-up needles 87 and 87, which break through the separator 85 and rise as shown in FIG.
It is peeled off from the separator 85. The movable contact 26.2G peeled off from the separator 85 is sucked by the vacuum suction jig 88.88 that descends between the separator holders 86.86 and carried onto the film material 13a. The film-like movable contacts 2 are positioned at the key portions 3a, 3a of the front film 13 portion.
It is adhered to the film material 13a by adhesive 27a (see FIG. 3) on six sides. Although only two movable contacts are shown in FIGS. 13 and 14, the movable contacts 26.
Peeling from separator 85 of 26 and film material 13
The adhesion to a is carried out for one set at a time using the same number of contact push-up needles 87 and suction jig 88 as the number of movable contacts for one set.

Further, the spacer 50 has an adhesive 61a on both sides thereof.
, 61b (see Fig. 3), and this spacer 50 is made of a double-sided adhesive film coated with two strip-shaped separators 89a, 89b (see Fig. 15 and 1).
(see Figure 6) are held at regular intervals. The spacer band 50a, in which the spacer 50 is sandwiched between the separators 89a and 89b, is also wound into a roll as shown in FIG.
It is designed to be rolled out with the back side facing upward.

The spacer band 50a let out from the roll is the first
As shown in FIG. 5, the upper separator 89b is first peeled off to expose the spacers 50 and 50 and sent to the spacer extraction position, and the lower separator 89a is folded back at the tip of the moving table 90. It is then wound up into a roll via rollers 91. To take out the spacer 50 from the lower separator 89a, feeding of the spacer band 50a is stopped when the spacer 50 reaches the take-out position, and in this state, spacers are placed on the upper surface of the spacer 50 and on the outer edge of the lower surface. After lowering the spacer take-out jig 92 with the adhesive parts 92a and 92a protruding from it and bonding the spacer take-out jig 92 to the adhesive 61b on the upper surface (back surface) of the spacer, the supply side of the separator band 50a is moved from the supply side of the separator band 50a to the spacer band 50a. The lower separator 89a is peeled off from the spacer 50 by moving the movable table 90 as shown by the arrow in FIG. 16 while winding up the lower separator 89a. It is done. In FIGS. 15 and 16, reference numeral 92b is a vent hole 5 for letting air between the spacer extraction jig 92 and the spacer 50 escape to the outside when the spacer extraction jig 92 is bonded to the spacer 50. The spacer 50 that has been adhered to and taken out by the spacer take-out jig 92 is carried onto the film material 13a by the spacer take-out jig 92, and is then placed on the front panel 12 laminated to the film material 13a. The spacer is positioned and bonded with the adhesive 61a on the surface of the spacer.

Note that the spacer take-out jig 92 is pulled upward after adhering the spacer 50 to the film material 13a, but the spacer take-out jig 92 is
As shown in the figure, a spacer adhesive part 92a on the outer edge,
Whereas the spacer 50 is bonded only with 92a,
Since the spacer 50 is adhered to the film material 13a on its entire surface, even if the spacer take-out jig 92 is pulled up, the spacer 50 will not be pulled up together with the spacer take-out jig 92 and peeled off from the front panel 12.

Further, the frame 11 is coated with an adhesive 62 (see FIG. 3) on its surface, and a first
As shown in FIG. 7, it is attached to a strip separator 93. A large number of frames 11 are arranged at regular intervals on this band-like separator 93, and the frame band 11a in which a large number of frames 11 are arranged on the band-like separator 93 is also arranged as shown in FIG. It is rolled into a roll.

Then, the frame 11 is attached to the frame band 11a that is unrolled from the roll using a vacuum suction jig (not shown).
(The separator 93 is removed from the frame 11 in the same manner as the separator 89a is removed from the spacer 50, for example), and is carried onto the film material 13a by this suction jig. Then, it is positioned and adhesively bonded to the front panel 12 (attached with the adhesive 62 applied to the surface of the frame 11).

The order in which the film-like fixed contacts 2G, 26, spacer 50, and frame 11 are bonded may be arbitrarily determined.

The film material 13a to which the movable contacts 26, 26, spacers 50, etc. have been adhered is again sent to the next component assembly position and stopped, and at this position, the wiring board 20 and chip components 24 such as diodes and capacitors are assembled. .24
will be incorporated.

As shown in FIG. 18, a large number of wiring boards 20 are formed at regular intervals on a band-shaped film carrier 20a, and LSI chips 23 are pre-installed on this wiring board 20.
However, the wiring and the hardware are connected and attached, and this LSI chip 23 is resin molded. The film carrier 20a is also wound into a roll as shown in FIG. 5, and is unwound from this roll. Then, the wiring board 20 is punched out from the film carrier 20a along the outline indicated by the two-dot chain line in the figure, and the film material 13a is punched out using a vacuum suction jig.
It is carried upward and is positioned and brought into contact with the spacer 50 (adhered with the adhesive 61b on the surface of the spacer 50).

The film-like liquid crystal display cell 30 and the film-like solar cell 40 that were assembled on the film element 1J13a in the previous step are removed after the wiring board 20 is assembled.
Film-like heat seal connector 31 shown in FIG.
It is connected to the wiring board 20 by 41.

In addition, the chip components 2 such as the diodes and capacitors
4 are attached to the strip-shaped base film at regular intervals.

FIG. 19 shows the chip component band 24a with a diode attached, and the diode 94 has a copper foil on its upper surface. ! ! !
Leads 96 and 96 are formed by etching, and through holes 95a and 95a are formed in the portions corresponding to the wiring board connecting terminal portions of the leads 9[3 and 96. It is attached and connected to the other glue 96 by wire bonding before the resin arrives.

FIG. 20 shows a capacitor (for example, a tantalum capacitor) installed (J3 shows the chip component band 24b). The capacitor 97 is mounted between the leads 96.9G of the strip-shaped base film 95, which is substantially similar to the base film for mounting the diode. It is directly attached to and sealed with resin.

These chip component bands 24a and 24b are also wound on rolls as shown in FIG. 5, and the chip components 24 and 24 attached to these chip component bands 24a and 24b are , 24b
The film material 13a is punched out along the punching lines shown by dashed lines in FIGS. 19 and 20, and is carried into the form of the film material 13a by a vacuum suction jig and assembled into the wiring board 20.

FIG. 21 shows a chip component 24 having the diode 94.
The chip component 24 is fitted into a through hole drilled in the wiring board 20, and its leads 96, 96 are connected to the wiring (the third wire) of the wiring board 20. Wiring on the bottom surface of the wiring board 20 in the figure) 21.
It is soldered to the terminal section of 21.

After assembling all the parts onto the film material 13a as described above, the film material 13a is fed intermittently and a function test is first performed as shown in FIG. An adhesive is applied dropwise, and a backing material in which a back panel 14 and a pack film 15 are laminated is stacked on top of the adhesive, and pressure is applied from above to assemble the whole as a whole.

The back panel 14 is formed by punching out a band-shaped metal film 14a as shown in FIG.
A is wound into a roll (see FIG. 5), and punching of the pack panel 14 is performed by drawing out the band-shaped metal film 14a from the roll.

The pack film 15 is obtained by cutting out a belt-shaped resin film 15a as shown in FIG. 98 is made, and this notch 98 is made in multiple places (
(4 locations in Fig. 23) have a slight width connecting portion 98a.
, 98a are provided around the entire circumference of the pack film 15. Further, on one side of the belt-shaped resin film 15a (the side to be laminated with the back panel 14),
An adhesive 63 (see FIG. 3) is applied to the entire surface, and this adhesive applied surface is covered with a band-shaped separator 99. The band-shaped resin film 15a, which becomes the pack film 15, is also wound into a roll as shown in FIG. 5, and is unwound from this roller.

The strip-shaped resin film 15a is unrolled from the roll, and the separator 99 is peeled off to form the filler material 1.
It is fed onto the film material 13a coated with G as shown in FIG. The back panel 14 punched out from the band-shaped metal film 14a is, as shown in FIG.
Adhesive 63 on the surface of the laminated (?!) resin film 15a is applied to the portion of the band-shaped resin film 15a that is sent upward to the film 1Q 113a and becomes the pack film 15.
laminated), and the strip-shaped S + fat film 15
It is sent onto the film material 13a together with the filler material 1G, and is rolled onto the filler material 1G by a rolling roller (not shown).

When this rolling pressure is performed to harden the liquid adhesive that will become the filler 16, the wiring board 20. Liquid crystal display cell 30.
Solar cell40. Built-in components such as chip components 24 are fixed by the filler 16, and the back panel 14
is also adhesively fixed to the filler 16.

After performing the above-mentioned total assembly, first, while feeding the film material 13a, the strip-shaped resin film 15a that becomes the pack film 15 is wound upward from the film material 13a, and the strip-shaped resin film 1
The connecting portions 98a, 98a (see FIG. 23) connecting the pack film 15 and the pack film 15 are torn off by pulling the waste film 15a, and the pack film 15 is cut along the cut 98 into the belt-shaped resin film 1.
Separate from 5a.

After this, as shown in FIG. 5, the outer periphery of the pack film 15 and filler 16 and the front film 13 portion of the film material 13a are cut according to the product external shape by laser beam cutting. 1J13a
The product is taken out, and the film material 13a after being taken out is wound up and disposed of.

FIG. 24 is a plan view showing the state in which each part is assembled into the film material 13a that is sent intermittently through the assembly line in the manufacture of the above-mentioned small electronic calculator.
) The figure shows the state of the film material 13a before parts are assembled, and the (river) figure shows the front panel 12 and the film-like liquid crystal display cell 3.
0 and a state in which the film solar cell 40 is incorporated, (1)
The figure shows a state in which the film-like movable contact 26, 26, spacer and frame 11 are assembled, and (IV) figure shows a state in which the wiring board 20 is assembled and the liquid crystal display cell 30, solar cell 40 and P1-seal connector 31, 41 are assembled. The state connected by (
v) The figure shows the state in which the filler 16 is applied.

That is, in this method of manufacturing the small electronic device sieve n, the film-like liquid crystal display cell 30 is placed on the strip-shaped film material 13a, which is the surface material of the small-sized electronic calculator, while being fed intermittently.
A film-like electronic component such as a film-like solar cell 40 or a wiring board 20 is placed, and a filler 16 is applied onto the film material 13a on which the film-like electronic component and the wiring board 20 are placed. A small electronic type I consisting of a back panel 14 laminated with a pack film 15
By polymerizing and adhering the back material of the i1 calculating machine, and cutting the film material 13a to match the external shape of the product, a small electronic calculator is manufactured without the need for any screws. For example, it is possible to obtain a compact electronic device that is much thinner than conventional compact electronic devices.

In the above embodiment, the back film 15 is laminated to the back panel 14 to serve as the back material, but the back film 15 may be composed of only the back panel 14. Also,
In the above embodiment, the film material 13a, which becomes the front film 13, is fed and laminated with the front panels 1 to 12. However, the front panel 12 may be laminated on the film material 13a in advance, or it may be movable. Contact point 2G.

26 may also be formed in advance on the film material 13a by means such as printing. Further, in the above embodiment, the spacer 50 and the wiring board 20 are assembled in separate steps, but the wiring board 20 may be bonded to the spacer 50 in advance and then assembled together with the spacer 50. Further, in the above embodiment, the product outer shape is finished with one laser beam cut, but the product is finished by first separating the product from the film element 1J13a by rough cutting, and then finishing the product outer shape. It may depend on the method. In addition, in the above embodiment, the film material 1
Cutting out the front film 13 from the film material 13a is performed in the final step.
This step may be performed at any time after the film solar cell 40 is assembled and arranged. It should be noted that the manufacturing method of the present invention is of course applicable not only to the manufacturing of the above-mentioned small-sized electronic calculator but also to the manufacturing of other small-sized electronic devices.

[Effect of idea]

According to the present invention, it is possible to manufacture a small electronic device that is much thinner than conventional small electronic devices.

[Brief explanation of the drawing]

Figures 1 to 4 show a small electronic calculator manufactured by the manufacturing method of the present invention, with Figure 1 being an external perspective view, Figure 2 being an exploded perspective view, and Figure 3 being the same as Figure 1. FIG. 4 is an enlarged sectional view of a portion of the film solar cell. Figures 5 to 24 show an embodiment of the present invention, in which Figure 5 is a schematic diagram of the manufacturing process, Figure 6 is a perspective view of the film material, and Figure 7 is an intermittent feeding method for the film material. 8 is a perspective view of a band-shaped metal film forming a front panel, FIG. 9 is a perspective view of a display cell band in which film-shaped outer cells are formed, and FIG. 10 is a perspective view of a band-shaped metal film formed on a front panel. Fig. 11 is a cross-sectional view of the positioning stand and suction jig for the front panel, liquid crystal display cell, and solar cell, and Fig. 12 shows the adhesion of the front panel, liquid crystal display cell, and solar cell to the film material. 13 and 14 are sectional views showing the method for peeling off the film-like movable contact from the contact strip. FIGS. 15 and 16 are schematic diagrams showing the method for removing the spacer from the spacer strip. 17 is a perspective view of a frame band, FIG. 18 is a perspective view of a film carrier on which a wiring board is formed, and FIG. 19 is a sectional view of a chip component band with a diode attached. Figure 20 is a cross-sectional view of a chip component strip with capacitors attached, Figure 21 is a cross-sectional view showing a state in which a chip component with a diode is incorporated into a wiring board, and Figure 22 is a perspective view of a strip-shaped metal film that will become the back panel. Figure, 2nd
FIG. 3 is a perspective view of a belt-shaped resin film that becomes the front film, and FIG. 24 is a plan view showing the state in which each component is assembled into a film material that is intermittently fed through an assembly line. 11...Frame, lla...Frame band, 12.
...Front panel, 12a...band-shaped metal film,
13... Front film, 13a... Film material, 14... Back panel, 14a... Band-shaped metal film, 15... Pack film, 15a... Band-shaped resin film, 20... Wiring board , 20a... Film carrier, 30... Film-like liquid crystal display cell, 3
Qa... Display cell band, 40... Film solar cell, 40a... Battery band, 16... Filler. Applicant's representative Patent attorney Takehiko Suzue Figure 11 Figure 12 Figure 13 Figure 15 Figure 22 Figure 24 Figure 23 Continued from page 1 0 Inventor Kazuya Hara [Partner] Inventor Tatsuo Shimazaki Tokyo Nishijin Co., Ltd. 5 Tokyo Nishiσ Co., Ltd. 2-

Claims (1)

[Claims] A step of disposing a film-like electronic component and a wiring board on the strip-shaped film material that will become the surface material of the electronic equipment while intermittently feeding it, and a step of placing the film-like electronic component and the wiring board on the film material on which the film-like electronic component and the wiring board are arranged. The present invention is characterized by comprising the steps of applying a filler material and polymerizing and adhering a back panel, which is the back material of the electronic fishing device, onto the filler material, and cutting the film material to fit the outer shape of the product. A method for manufacturing small electronic devices.