JP2016045568A - Information display medium and manufacturing method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an information display medium formed by laminating resin on a display section, while preventing reduction in visibility due to the resin laminated on the display section.SOLUTION: A module 10, a cushioning material 50, and a frame 40 are arranged on a surface substrate 60 via an adhesion curable resin 30. A rear substrate 20 is arranged on the module 10, the cushioning material 50, and the frame 40 via the adhesion curable resin 30. When pressure is applied from the side of the rear substrate 20, air bubbles included in the adhesion curable resin 30, between the surface substrate 60 and a display section 13, are extruded. Specific gravity of the module 10 is smaller than that of the adhesion curable resin 30 before curing. The surface substrate 60 is set at the top for curing, to prevent a distance between the surface substrate 60 and a surface of the display section 13 from being increased.SELECTED DRAWING: Figure 4

Description

  The present invention relates to an information display medium having a module with a display unit, and more particularly to a technique for avoiding a decrease in visibility due to resin being laminated on a display unit.

  Conventionally, information is recorded on a card, and information management, settlement, and the like using the card are performed. Cards used for such information management and settlement can be as simple as information printed on the surface, embossed on the surface, and information can be recorded electromagnetically. There are magnetic cards and IC cards.

  In recent years, such a card with a function of variably displaying information has been considered, and is disclosed in Patent Document 1, for example.

  FIG. 5 is a diagram showing an example of a card to which a function for variably displaying information is added, and shows a cross section thereof.

  In the card of this example, as shown in FIG. 5, a module in which a plurality of electronic circuit components 112 and a display element component 113 for variably displaying information are mounted on a circuit board 111 is covered with a mold resin 120. It is configured. And the display element component 113 is covered with the transparent resin 114, and the display part 115 is comprised.

  In the card configured as described above, the display element component 113 is covered with the transparent resin 114, so that the information displayed by the display element component 113 is visible while protecting the display element component 113. Yes.

  Below, the manufacturing method of the card | curd mentioned above is demonstrated.

  FIG. 6 is a diagram showing a manufacturing method of the card shown in FIG.

  First, with respect to a module in which a plurality of electronic circuit components 112 and a display element component 113 for variably displaying information are mounted on the circuit board 111, the surface on which the display element component 113 is mounted is the top side. In this state, a casting mold 131 matching the shape of the display element component 113 is mounted on the display element component 113, and a transparent resin 114 is injected into the casting mold 131 (FIGS. 6A and 6B). ).

  After the injected transparent resin 114 is cured at normal temperature and under no pressure, the injection mold 131 is removed. As a result, a display unit 115 is formed in which the display element component 113 is covered with the transparent resin 114 (FIG. 6C).

  Next, a casting mold 132 is attached to the surface side where the display unit 115 is formed so as to cover the entire module, and a molding resin 120 made of an opaque material is injected into the casting mold 132 (FIG. 6 ( d)). The plurality of electronic circuit components 112 mounted on the circuit board 111 are different from each other in height from the circuit board 111. Therefore, the casting mold 132 is the electronic circuit component 112 having the highest height. And the height on the circuit board 111 in a state where the injected mold resin 120 is subsequently cured is the same as the height on the circuit board 111 of the display unit 115.

  After the injected mold resin 120 is cured at normal temperature and in a non-pressurized state, the injection mold 132 is removed. As a result, the surface of the module on the display unit 115 side is covered with the mold resin 120 except for the display unit 115 (FIG. 6E).

  Next, the module is inverted so that the surface on which the display element component 113 of the circuit board 111 is mounted is the ground side, and the casting mold is formed so that the entire surface of the module is covered on the surface opposite to the display unit 115. A mold 133 is attached, and a mold resin 120 made of an opaque material is injected into the casting mold 133 (FIG. 6F). As described above, since the plurality of electronic circuit components 112 mounted on the circuit board 111 are different in height from the circuit board 111, the casting mold 133 has the highest height. The electronic circuit component 112 is covered.

  After the injected mold resin 120 is cured at normal temperature and in a non-pressurized state, the injection mold 133 is removed. As a result, the entire module is covered with the mold resin 120 except for the display unit 115, and the card is completed (FIG. 6G).

JP 2008-129621 A

  By the way, as described above, an information display medium such as a card having a display unit is required to have good visibility of information displayed on the display unit.

  However, in the case where a casting mold is mounted on the display element component and the transparent resin is injected into the casting mold in order to cover the display element component with resin as in the card described above, When bubbles are mixed in, it is difficult to remove the bubbles, and the visibility of information displayed on the display unit is lowered by the bubbles.

  The present invention has been made in view of the problems of the conventional techniques as described above, and in an information display medium in which a resin is laminated on a display portion, the resin is laminated on the display portion. An object of the present invention is to provide an information display medium capable of avoiding a decrease in visibility and a method for manufacturing the information display medium.

In order to achieve the above object, the present invention provides:
Frame,
A module having a display on one side of the substrate and an electronic component mounted on the other side; and a module installed in the frame;
Comprising a through hole corresponding to the electronic component, and a buffer material placed on the other surface of the module so that the electronic component enters the through hole;
A pair of base materials that sandwich the frame, the module, and the cushioning material, and at least a region facing the display unit is made of a transparent material;
The module and the cushioning material, the frame, and the adhesive curable resin filled between the base material,
The specific gravity of the module is smaller than the specific gravity before curing of the adhesive curable resin, and the interval between the display portion side substrate of the module and the surface of the display portion of the module among the pair of substrates, It is larger than 0 and 25 μm or less.

  When manufacturing the information display medium according to the present invention configured as described above, first, the adhesive cured resin before curing is placed on the first substrate on the display unit side of the module among the pair of substrates. Apply and place the frame. Next, the module is placed inside the frame and placed on the first base material coated with the adhesive curable resin so that the display unit is on the first base material side. Next, the cushioning material is placed on the module so that the electronic component enters the through-hole of the cushioning material, and the cured adhesive resin before curing is applied onto the cushioning material and the module. Then, the second base material, which is opposite to the display part of the module among the pair of base materials, is placed on the cushioning material and module coated with the adhesive curing resin, and the frame, and the second base material is placed. Pressurize from the material side. Thereby, even if bubbles are mixed in the adhesive curable resin between the first base and the display unit, the bubbles are pushed out from the periphery of the module by pressurization. Further, after the module and the buffer material are placed on the first base material via the adhesive curing resin, the second substrate is placed on the buffer material via the adhesive curing resin applied on the module and the buffer material. By placing the material and applying pressure from the second substrate side, the space between the first substrate and the display unit is stabilized to be uniform, and then the pressure is applied. It is avoided that the distance between the base material and the display unit becomes non-uniform. After that, when the first base material is placed on the top side and cured to cure the adhesive curing resin, the specific gravity of the module is smaller than the specific gravity before curing of the adhesive curing resin. Even if the module moves in the adhesive curable resin before the curable resin is cured, the module will move to the first substrate side, and the first substrate and the surface of the display unit For example, it is narrower than 0 to 25 μm or less. Thereby, although the adhesive curable resin is interposed between the first base material and the display unit, it is avoided that the visibility of information displayed on the display unit is deteriorated by the adhesive curable resin.

  According to the present invention, in the information display medium in which the adhesive curable resin is laminated on the display unit, even if bubbles are mixed in the adhesive curable resin between the first base material and the display unit, Due to the pressure, bubbles are pushed out from the periphery of the module, and the specific gravity of the module is smaller than the specific gravity of the adhesive curing resin before curing, so the module is installed in the frame and cured for adhesion on the front and back of the module When the first substrate is placed and cured so that the resin is present, the module is moved to the first substrate side even if the module moves through the cured adhesive resin before curing. The distance between the first base material and the surface of the display unit does not increase, for example, the width is larger than 0 and narrower to 25 μm or less, so that the resin is formed on the display unit. To be laminated It is possible to avoid the visibility drop that.

It is a figure which shows one Embodiment of the module used for the information display medium of this invention, (a) is the figure seen from the back surface, (b) is AA 'sectional drawing shown to (a), (c) ) Is a view from the surface. It is a figure which shows one Embodiment of the information display medium of this invention, (a) is the figure seen from the back surface, (b) is AA 'sectional drawing shown to (a), (c) is (a) The figure which shows the state which removed the back surface base material and the hardening resin for adhesion from the structure shown in (), (d) is a figure which shows the structure of a shock absorbing material, (e) is the figure seen from the surface, (f) is (e) It is a figure which shows the state which removed the surface base material and the hardening resin for adhesion | attachment from the structure shown to). 3 is a flowchart for explaining a method of manufacturing the information display medium shown in FIG. It is a figure which shows each process in the manufacturing method by FIG. It is a figure which shows an example of the card | curd which added the function to variably display information. It is a figure which shows the manufacturing method of the card | curd shown in FIG.

  Embodiments of the present invention will be described below with reference to the drawings.

  First, the module used for the information display medium of the present invention will be described.

  1A and 1B are diagrams showing an embodiment of a module used in an information display medium of the present invention, where FIG. 1A is a view seen from the back side, and FIG. 1B is a cross-sectional view taken along line AA ′ shown in FIG. FIG. 3C is a view as seen from the surface.

  As shown in FIG. 1, the module in this embodiment is configured by mounting a plurality of electronic components 12 a to 12 f on the back surface of the electronic circuit board 11 and providing a display unit 13 on the surface of the electronic circuit board 11. .

  A wiring pattern and land portions (not shown) are formed on the electronic circuit board 11 by printing using a conductive paste, and the electronic components 12a to 12f are appropriately connected via the wiring pattern. It is mounted on the land part.

  The display unit 13 is made of electronic paper or the like having a display layer whose state changes depending on a potential difference between the electrode layers between a pair of opposing electrode layers, and has a shape slightly smaller than the electronic circuit board 11. . Thereby, when the module 10 is viewed from the surface, the electronic circuit board 11 appears in a frame shape around the display unit 13. Note that electronic paper has a memory property, and thus can maintain display even after the power is turned off.

  Next, an information display medium using the module 10 configured as described above will be described.

  2A and 2B are diagrams showing an embodiment of the information display medium of the present invention, where FIG. 2A is a view seen from the back side, FIG. 2B is a cross-sectional view taken along line AA ′ shown in FIG. ) Is a diagram showing a state in which the back substrate 20 and the cured adhesive resin 30 are removed from the configuration shown in (a), (d) is a diagram showing the configuration of the cushioning material 50, and (e) is a diagram seen from the surface. (F) is a figure which shows the state which removed the surface base material 60 and the hardening resin 30 for adhesion | attachment from the structure shown to (e).

  As shown in FIG. 2, the information display medium in this embodiment uses the module 10 shown in FIG.

  A cushioning material 50 is placed on the surface of the module 10 on which the electronic components 12a to 12f are mounted. The buffer material 50 is made of, for example, silicone rubber that is self-supporting and has few dents when pressed, and has an outer shape that is slightly smaller than the electronic circuit board 11. For example, the vertical and horizontal lengths are shorter than those of the electronic circuit board 11. It is shorter by 2 mm. The thickness of the buffer material 50 is substantially the same as the height of the electronic component 12e having the highest height from the electronic circuit board 11 among the electronic components 12a to 12f. Moreover, the buffer material 50 has through-holes 51a to 51f penetrating front and back. The through-holes 51a to 51f enter the electronic components 12a to 12f at positions corresponding to the electronic components 12a to 12f when the cushioning material 50 is placed on the surface on which the electronic components 12a to 12f of the module 10 are mounted. Each is provided with a sufficient size.

  The module 10 on which the cushioning material 50 is placed is installed in the frame 40. The frame 40 is made of, for example, an opaque resin material such as polyvinyl chloride, and has a through-hole 42 having the same shape as the outer shape of the electronic circuit board 11 and has a frame shape. The module 10 on which the cushioning material 50 is placed enters the through hole 42 and is installed in the frame 40. The through hole 42 does not have to have the same shape as the outer shape of the electronic circuit board 11 as long as the module 10 on which the buffer material 50 is placed is large enough to enter. The thickness of the frame 40 is slightly thicker than the thickness of the module 10 on which the cushioning material 50 is placed. The frame 40 is formed with pin holes 41 penetrating front and back for alignment at the two corners.

  The module 10, the cushioning material 50, and the frame 40 arranged as described above are sandwiched between the front and back surfaces 60 and 20, which are a pair of base materials, from the front and back.

  The back substrate 20 is a second substrate and is made of transparent or opaque PET (polyethylene terephthalate) or the like, has the same outer shape as the frame 40, and the cushioning material 50 of the module 10 is placed thereon. The module 10, the cushioning material 50, and the frame 40 are arranged so as to overlap each other on the surface side. Further, a pin hole 21 penetrating front and back is formed in a region facing the pin hole 41 when arranged in this way.

  The surface base material 60 is a first base material, which is made of transparent PET or the like, has the same outer shape as the frame 40, and has a module on the surface side where the display unit 13 of the module 10 is provided. 10 and the frame 40 so as to overlap each other. Further, a pin hole 61 penetrating front and back is formed in a region facing the pin hole 41 when arranged in this way. When the surface base material 60 is arranged so as to be superimposed on the module 10 and the frame 40, a region facing the periphery of the display unit 13 is a concealing unit 63 by printing, and the module 10 The outer peripheral portion of the display unit 13 is not visible from the outside. The area other than the concealing part 63 is not printed and is a transparent part 62, and the display part 13 is visible from the surface base material 60 side. In the surface base material 60, the concealing portion 63 is not necessarily provided if the region facing the display portion 13 is the transparent portion 62. Moreover, the space | interval of the surface base material 60 and the surface of the display part 13 is larger than 0, and is 25 micrometers or less.

  In addition, on the surface side of the module 10 on which the cushioning material 50 is placed, the cured resin 30 for adhesion is filled between the module 10 and the cushioning material 50, the frame 40, and the back surface base material 20. The module 10, the buffer material 50, the frame 40, and the back substrate 20 are bonded by the cured resin 30.

  Also, on the surface side of the module 10 where the display unit 13 is provided, the adhesive curable resin 30 is filled between the module 10, the frame 40, and the surface base material 60. The module 10, the frame 40, and the surface base material 60 are bonded together.

  Further, the specific gravity that is the weight per unit volume of the module 10 is smaller than the specific gravity of the adhesive cured resin 30.

  Below, the manufacturing method of the information display medium comprised as mentioned above is demonstrated.

  FIG. 3 is a flowchart for explaining a method of manufacturing the information display medium shown in FIG. FIG. 4 is a diagram showing each step in the manufacturing method according to FIG. 3, and shows a cross-sectional view of the information display medium.

  When the information display medium shown in FIG. 2 is manufactured, as shown in FIG. 4A, first, the adhesive cured resin 30 before curing is applied to the entire surface of the surface base material 60 placed on the metal plate 71. Is applied uniformly, and the frame 40 is placed thereon (step 1). At this time, an alignment pin (not shown) is installed on the metal plate 71 and the pin is inserted into the pin holes 41 and 61 so that the surface base 60 and the frame 40 can be easily aligned. Can do. Accordingly, the adhesive curable resin 30 is interposed between the surface base material 60 and the frame 40, and then the adhesive curable resin 30 is cured, whereby the surface base material 60 and the frame 40 are Will be glued.

  Next, as shown in FIG. 4B, the module 10 is installed in the frame 40 so as to be aligned with the through hole 42 so that the display unit 13 is on the surface base material 60 side. The module 10 is placed on the coated surface base material 60 (step 2). At this time, since the through hole 42 has the same shape as the outer shape of the electronic circuit board 11 as described above, when the module 10 is installed in the frame 40 so as to be aligned with the through hole 42, the alignment pin is attached to the frame 40. The relative position between the surface base material 60 and the module 10 that are aligned is determined in advance, so that only the display unit 13 of the module 10 faces the transparent portion 62 of the surface base material 60, and the surface base The display unit 13 is visible from the material 60 side, and the part other than the display unit 13 of the module 10 is in a state invisible by the concealing unit 63.

  Next, as shown in FIG.4 (c), it buffers on the surface in which the electronic components 12a-12f of the module 10 were mounted so that the electronic components 12a-12f each enter the through-holes 51a-51f of the buffer material 50, respectively. The material 50 is placed (step 3). At this time, as described above, the cushioning material 50 is slightly smaller than the electronic circuit board 11 having the same shape as the through hole 42 of the frame 40, but the cushioning material 50 is mounted on the electronic components 12 a to 12 f of the module 10. Through holes 51a to 51f are provided at positions corresponding to the electronic components 12a to 12f when placed on the formed surfaces, and these through holes 51a to 51f enter the electronic components 12a to 12f. Since the buffer material 50 is placed on the module 10 so that the electronic components 12a to 12f enter the through holes 51a to 51f, the buffer material 50, the frame 40, and the module are provided. The cushioning material 50 can be easily placed on the module 10 so that the relative position with respect to 10 becomes a predetermined position.

  Next, as shown in FIG. 4 (d), the cured adhesive resin 30 before curing is applied on the cushioning material 50 and the module 10. At this time, since the electronic components 12a to 12f have different heights as described above, the adhesive curing resin 30 enters the through holes 51a to 51f, and in this state, further adheres to the entire surface of the cushioning material 50. A sufficient amount of the cured resin 30 for adhesion is applied so that the cured resin 30 is exposed.

  Next, as shown in FIG. 4E, the back surface base material 20 is placed on the buffer material 50 and the module 10 to which the adhesive curing resin 30 is applied, and the frame 40 (step 4). Pressure is applied from the 20 side by the pressure plate 80 (step 5). At this time, as described above, the back base material 20 has the pin hole 21 penetrating front and back in the region facing the pin hole 41 when arranged so as to overlap the module 10, the cushioning material 50 and the frame 40. Since it is formed, the surface base material 60, the module 10, the cushioning material 50, and the frame are installed on the metal plate 71 and the alignment pins inserted into the pin holes 41 and 61 are inserted into the pin holes 21. 40 and the back surface base material 20 can be easily aligned.

  When pressure is applied from the back substrate 20 side by the pressure plate 80, as shown in FIG. 4 (f), on the surface substrate 60 side of the module 10, the adhesive curing resin 30 before curing is the module 10 and the surface substrate. When the module 10 is placed on the surface base material 60, bubbles are mixed into the adhesive curable resin 30 between the surface base material 60 and the display unit 13. Even if it is, the bubbles are pushed out from the periphery of the module 10 by pressurization. In addition, after the module 10 and the buffer material 50 are placed on the surface base material 60 via the adhesive curing resin 30, the buffer material 50 is applied via the adhesive curing resin 30 applied on the module 10 and the buffer material 50. Since the back surface base material 20 is placed on the back surface and the pressure is applied by the pressure plate 80 from the back surface base material 20 side, the space between the front surface base material 60 and the display unit 13 is stabilized as being uniform, and then the pressure is applied. Therefore, it is avoided that the space between the surface base material 60 and the display unit 13 becomes non-uniform due to pressurization. The module 10, the frame 40, and the surface base material 60 are bonded to each other by curing the adhesive curable resin 30.

  Further, on the back substrate 20 side of the module 10, as shown in FIG. 4 (f), when pressure is applied from the back substrate 20 side by the pressure plate 80, the adhesive cured resin 30 before curing is the module 10 and the buffer. The module 10 and the back surface base material 20 are thinly and evenly extended, enter the space between the back surface base material 20 and the frame 40, and then the adhesive curing resin 30 is cured. The buffer material 50, the back surface base material 20, and the frame 40 are bonded together.

  In this way, the adhesive cured resin 30 is spread by pressurization, whereby the thickness of the entire information display medium becomes constant with respect to the thickness of the frame 40.

  Thereafter, curing is performed to cure the adhesive curing resin 30 (step 6).

  In the curing, as shown in FIG. 4G, it is conceivable to install a metal plate 72 on the back substrate 20 and cure the adhesive curable resin 30 while applying a load by the metal plate 72. However, in that case, the module 10 is in the adhesive curable resin 30 in a state before the adhesive curable resin 30 is cured because the specific gravity of the module 10 is smaller than the specific gravity before the adhesive curable resin 30 is cured as described above. The distance between the front substrate 60 and the display unit 13 is increased, and the thickness of the adhesive cured resin 30 interposed between the front substrate 60 and the display unit 13 is increased. Become thicker. Then, especially when the adhesive curable resin 30 is colored, the visibility of information displayed on the display unit 13 is lowered by the adhesive curable resin 30.

  Therefore, as shown in FIG. 4 (h), the top and bottom of the information display medium is reversed so that the surface base material 60 is placed on the top side, and the metal plate is placed on the surface base material 60. The adhesive curing resin 30 is cured while applying a load of 71. At this time, as described above, the specific gravity of the module 10 is smaller than the specific gravity before the curing of the adhesive curable resin 30, so that the module 10 passes through the adhesive curable resin 30 in a state before the adhesive curable resin 30 is cured. Even if it does, the module 10 will move to the surface base material 60 side, and the space | interval of the surface base material 60 and the surface of the display part 13 will become narrow. In this embodiment, the distance between the surface base material 60 and the surface of the display unit 13 is as narrow as 0 to 25 μm. In addition, if the adhesive resin 30 having a specific gravity smaller than that of the module 10 is used, it is not necessary to invert the top of the information display medium so that the surface base material 60 becomes the top side for curing. However, since the specific gravity of the adhesive cured resin 30 is generally larger than that of the module 10 of this embodiment having a display portion, the specific gravity of the adhesive cured resin 30 is not limited. In order to prevent the space between the surface base material 60 and the surface of the display unit 13 from being widened when the adhesive curable resin 30 is cured without adjustment, as described above, the top and bottom of the information display medium is inverted. It is necessary to install and cure so that the surface base material 60 is on the top side.

  After the adhesive curing resin 30 is cured by the above curing, the product is completed by cutting with a blade shape into a shape corresponding to the size of the product of the information display medium (step 7).

  Thus, in this embodiment, even if air bubbles are mixed in the adhesive curable resin 30 between the surface base material 60 and the display unit 13, the air bubbles are moved outward from the periphery of the module 10 by pressurization. It will be pushed out and the visibility fall by a bubble will be avoided.

  In addition, since the specific gravity of the module 10 is smaller than the specific gravity of the adhesive curing resin 30 before curing, the module 10 is installed in the frame 40 and the adhesive curing resin 30 exists on the front and back of the module 10. Even if the module 10 is moved in the adhesive curing resin 30 before being cured by setting the base material 60 to be on the top side and curing the adhesive curing resin 30, the module 10 is not limited to the surface base material 60. The distance between the surface base material 60 and the surface of the display unit 13 does not increase. For example, the distance between the surface base material 60 and the surface of the display unit 13 is larger than 0 and narrower to 25 μm or less. It is possible to avoid a decrease in visibility due to the resin being laminated. Even if the adhesive curable resin 30 is opaque, the thickness is more than 0 and not more than 25 μm, so that the information displayed on the display unit 13 cannot be visually recognized. Is avoided.

DESCRIPTION OF SYMBOLS 10 Module 11 Electronic circuit board 12a-12f Electronic component 13 Display part 20 Back surface base material 21,41,61 Pin hole 30 Adhesive cured resin 40 Frame 42,51a-51f Through-hole 50 Buffer material 60 Surface base material 62 Transparent part 63 Concealing part 71, 72 Metal plate 80 Pressure plate

Claims (2)

Frame,
A module having a display on one side of the substrate and an electronic component mounted on the other side; and a module installed in the frame;
Comprising a through hole corresponding to the electronic component, and a buffer material placed on the other surface of the module so that the electronic component enters the through hole;
A pair of base materials that sandwich the frame, the module, and the cushioning material, and at least a region facing the display unit is made of a transparent material;
The module and the cushioning material, the frame, and the adhesive curable resin filled between the base material,
The specific gravity of the module is smaller than the specific gravity before curing of the adhesive curable resin, and the interval between the display portion side substrate of the module and the surface of the display portion of the module among the pair of substrates, An information display medium that is larger than 0 and 25 μm or less. A method for manufacturing the information display medium according to claim 1,
Applying a cured resin for bonding before curing on the first substrate on the display unit side of the module of the pair of substrates, and placing the frame;
Placing the module on the first base on which the adhesive curable resin is applied, placing the module in the frame so that the display unit is on the first base, and
Placing a cushioning material on the other surface of the module so that the electronic component enters the through-hole, and applying an adhesive curing resin before curing on the cushioning material and the module;
Place the second base material on the opposite side to the display part of the module among the pair of base materials on the cushioning material and the module coated with the adhesive curable resin, and the frame; Pressing from the second substrate side;
A method of manufacturing an information display medium, comprising: setting the first base material to be on the top side and curing the first base material to cure the adhesive curable resin.