JP6163405B2 - Substrate support case and case with substrate - Google Patents

Substrate support case and case with substrate Download PDF

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JP6163405B2
JP6163405B2 JP2013224954A JP2013224954A JP6163405B2 JP 6163405 B2 JP6163405 B2 JP 6163405B2 JP 2013224954 A JP2013224954 A JP 2013224954A JP 2013224954 A JP2013224954 A JP 2013224954A JP 6163405 B2 JP6163405 B2 JP 6163405B2
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substrate
substrate support
support
case
supports
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JP2015088873A (en
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知彦 桑原
知彦 桑原
敏嗣 矢嶋
敏嗣 矢嶋
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信越ポリマー株式会社
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Description

  The present invention relates to a substrate support case for supporting a transparent substrate, and a case with a substrate having a transparent substrate.

  Mobile electronic devices typified by mobile phones, smartphones, tablet PCs, and the like include a display area for displaying information such as characters and images, and a substrate made of transparent glass or resin on the outer surface of the display area. . Recently, devices such as smartphones and tablet PCs that display areas are not just parts that display information but also serve as operation units are increasing, and accordingly, display areas are becoming larger. . The substrate is fixed to the case of the portable electronic device by a method such as fitting or adhesion. There is always a gap between the substrate and the case regardless of the width. For this reason, when providing high waterproofness or dustproofness with respect to a portable electronic device, the method of attaching the rubber-made frame body to the circumference | surroundings of a board | substrate is known so that this clearance gap may be filled up completely.

  In particular, when the substrate is made of glass, there is a risk of the substrate being damaged by vibration or impact applied to the substrate during the manufacturing process or during use of the portable electronic device. Therefore, in order to improve impact resistance in addition to waterproofness and dustproofness, instead of the above-described method of placing a rubber frame on the outer periphery of a glass substrate, the substrate is set in a mold, A method is known in which an annular rubber-like elastic body is insert-molded on all sides of a substrate (see, for example, Patent Document 1).

International Publication WO2012 / 115140

  For example, when an annular rubber-like elastic body is insert-molded on all side surfaces of a substrate made of glass, burrs are generated on the surface of the substrate if the sandwiching of the substrate with a mold is weak. As described above, when burrs are generated on the substrate surface, there is a possibility that damage is generated on the substrate surface when the process of removing the burrs is performed. On the other hand, if the sandwiching of the substrate in the mold is strong, the sandwiched substrate itself may be damaged.

  In recent years, the thickness of the substrate has become, for example, about 0.5 mm, and the difficulty of the process of insert-molding an annular rubber-like elastic body on all side surfaces of the substrate has increased. Furthermore, in recent years, substrates made of curved glass have been adopted, and it has become difficult to arrange the substrates at appropriate positions in the mold.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a technique capable of supporting a substrate so as to easily have high impact resistance.

  In order to achieve the above object, a substrate support case according to an embodiment of the present invention includes a placement portion for placing a peripheral portion of the back surface of a transparent substrate, and a placement portion for placing the substrate of the placement portion. A substrate support case having a peripheral wall portion formed so as to stand up from a surface in a first direction for mounting the substrate and surrounding a side surface of the substrate mounted on the mounting portion. A substrate support portion that is made of a rubber-like elastic body and supports the substrate is formed on at least a part of the inner peripheral surface of the substrate, and the substrate support portion contacts the chamfered portion on the surface side of the substrate, and the substrate is It has the 1st press part formed so that it might press in the 2nd direction opposite to 1 direction.

  In the substrate support case according to another embodiment, the substrate support portion is further formed in an annular shape around the entire inner peripheral surface of the peripheral wall portion.

  In the substrate support case according to another embodiment, the substrate support portion is in contact with at least one of the chamfered portion on the back surface side of the substrate or the back surface of the substrate, and presses the substrate in the first direction. It further has a pressing part.

  In the substrate support case according to another embodiment, the substrate support portion is formed on the peripheral wall portion by an insert molding method.

  In the substrate support case according to another embodiment, the substrate is a substantially rectangular plate, and the substrate support portion is between the side surface of the substrate and the substrate support portion in a portion that supports the corner portion of the substrate. The width of the space is formed so as to be narrower than the width of the space between the side surface of the substrate and the substrate support portion in the portion that supports the linear portion of the substrate.

  In the substrate support case according to another embodiment, the substrate is a substantially rectangular plate, and the side surface of the substrate and the substrate in a portion of the substrate support portion that supports the vicinity of the corner portion of the linear portion of the substrate. The space between the support portion and the support portion is formed so as to be narrower than the space between the side surface of the substrate and the substrate support portion in the portion that supports the other portion of the linear portion of the substrate.

  In the substrate support case according to another embodiment, the rubber-like elastic body is an elastic body made of silicone rubber.

  In addition, a case with a substrate according to another embodiment includes any of the above-described substrate support cases and a substrate supported by the substrate support case.

  According to the present invention, it is possible to easily obtain a substrate support case or the like that can support a substrate so as to have high impact resistance.

FIG. 1 is a partially exploded perspective view of a portable electronic device including a substrate support case according to the first embodiment and an overall perspective view of the portable electronic device. 2 is a cross-sectional perspective view taken along line AA and a cross-sectional perspective view taken along line BB of the portable electronic device of FIG. 1. FIG. 3 is a cross-sectional view of the portable electronic device of FIG. 4 is a cross-sectional view of the portable electronic device according to the second embodiment at a position corresponding to the line CC in FIG. FIG. 5 is a partial cross-sectional view of the substrate and the substrate support portion of the portable electronic device according to the third embodiment. FIG. 6 is a partial cross-sectional view of the substrate and the substrate support portion of the portable electronic device according to the fourth embodiment. FIG. 7 is a cross-sectional view of a display panel for a portable electronic device including a substrate according to the fifth embodiment at a position corresponding to the line AA in FIG.

  Embodiments of the present invention will be described with reference to the drawings. The embodiments described below do not limit the invention according to the claims, and all the elements and combinations described in the embodiments are indispensable for the solving means of the invention. Not always.

<First Embodiment>
First, a portable electronic device including the substrate support case according to the first embodiment of the present invention will be described.

  FIG. 1 is a partially exploded perspective view of a portable electronic device including a substrate support case according to the first embodiment and an overall perspective view of the portable electronic device. (1A) is a perspective view of a substrate, (1B) is a perspective view of a substrate support case that supports the substrate, and (1C) is a perspective view of a portable electronic device in which the substrate is mounted on the substrate support case. It is.

  A portable electronic device 1 as an example of a case with a substrate includes a substrate support case (housing) 2 having an opening 10 formed on the main operation surface side, and a substrate 3 supported by the substrate support case 2.

  The substrate 3 is a transparent, substantially rectangular flat plate, and includes four corner portions 35, short side portions 36 facing each other, and long side portions 37 facing each other. The substrate 3 is made of glass, for example, and has a short side of 40 to 60 mm, a long side of 90 to 130 mm, and a thickness of 0.3 to 0.7 mm. In addition, the material and dimension of the board | substrate 3 are only examples, and are not limited to these. For example, the substrate 3 may be formed of a resin such as PMMA or PET. The substrate 3 is not limited to a flat plate but may be a curved plate.

  The substrate support case 2 is formed in the vicinity of the opening 10 from a mounting portion 21 formed in an annular shape for mounting the peripheral portion of the back surface of the substrate 3 and a mounting surface on which the substrate 3 of the mounting portion 21 is mounted. It is formed so as to rise in the direction on the side on which the substrate 3 is placed (first direction: hereinafter also referred to as the upward direction), and so as to surround the periphery of the side surface of the substrate 3 placed on the placement unit 21. And a peripheral wall portion 22 formed. The mounting portion 21 and the peripheral wall portion 22 are made of, for example, a metal such as aluminum or a magnesium alloy, or a reinforced resin such as CF or GF, for example, a glass fiber reinforced polycarbonate. A substrate support portion 23 that is made of a rubber-like elastic body and supports the substrate 3 is formed on the entire inner periphery of the peripheral wall portion 22. The substrate support portion 23 may not be formed over the entire inner periphery of the inner peripheral portion 22.

  The rubber-like elastic body constituting the substrate support 23 is a thermosetting elastomer such as urethane rubber, isoprene rubber, ethylene propylene rubber, natural rubber, ethylene propylene diene rubber or styrene butadiene rubber; urethane, ester, styrene, It is preferably composed of an olefin-based, butadiene-based or fluorine-based thermoplastic elastomer; or a composite thereof or the like, and particularly preferably composed of silicone rubber.

  The manufacturing method for forming the substrate support portion 23 on the peripheral wall portion 22 of the substrate support case 2 is not particularly limited. For example, the substrate support case 2 (the placement portion 21 and the mounting portion 21 and the substrate support portion 23 in which the substrate support portion 23 is not formed). An insert molding method in which the peripheral wall portion 22) is set in a mold, an uncured rubber material is poured into the mold, and the substrate support portion 23 is formed on the peripheral wall portion 22 of the substrate support case 2 can be used. As described above, it is easier to form the substrate support portion 22 on the substrate support case 2 by the insert molding method than to form a rubber-like elastic body on the substrate 3.

2 is a cross-sectional perspective view taken along line AA and a cross-sectional perspective view taken along line BB of the portable electronic device of FIG. 1.
(2A) is a cross-sectional perspective view taken along line AA in FIG. 1, and (2B) is a cross-sectional perspective view taken along line BB in FIG.

  The substrate 3 has a chamfered portion 31 and a chamfered portion 32 from which the corners of the side surface of the substrate 3 are removed (that is, chamfered) on the front surface side and the back surface side of the side surface.

  In the substrate support case 2, the placement portion 21 is formed extending in the direction of the opening 10. Further, the peripheral wall portion 22 is formed by rising from the placement surface of the placement portion 21 on which the substrate 3 is placed toward the first direction in which the substrate 3 is placed. The peripheral wall portion 22 is formed so as to surround the entire circumference of the side surface of the substrate 3 placed on the placement portion 21. A substrate support portion 23 is formed on the inner periphery of the peripheral wall portion 22. In the present embodiment, the substrate support portion 23 is fixed to the inner periphery of the peripheral wall portion 22 and the upper surface of the placement portion 21.

  An adhesive portion 4 (for example, a double-sided tape) that bonds the placement surface of the placement portion 21 and the back surface of the placed substrate 3 is disposed on the placement surface of the placement portion 21.

  FIG. 3 is a cross-sectional view of the portable electronic device of FIG.

  The height of the peripheral wall 22 from the mounting surface of the mounting portion 21 is a height at which the surface of the substrate 3 does not protrude from the peripheral wall 22 when the substrate 3 is mounted on the bonding portion 4 of the mounting portion 21. ing.

  The substrate support portion 23 has a slope corresponding to the chamfered portion 31 on the front surface side of the substrate 3, and presses the chamfered portion 31 in a direction opposite to the first direction (second direction: hereinafter also referred to as a downward direction). The first pressing portion 23a has a slope corresponding to the chamfered portion 32 on the back surface side of the substrate 3, and the second pressing portion 23b presses the chamfered portion 32 upward. In addition, the height of the board | substrate support part 23 may be higher than the height of the surrounding wall 22, and may be lower than the height of the surrounding wall 22, for example.

  With such a configuration, when the substrate 3 is mounted on the substrate support case 2, the back surface of the substrate 3 is bonded to the placement unit 21 via the bonding unit 4. Further, the chamfered portion 31 of the substrate 3 is pressed downward by the first pressing portion 23 a of the substrate support portion 23, and the chamfered portion 32 of the substrate 3 is pressed by the second pressing portion 23 b of the substrate support portion 23. As a result, the substrate 3 is sandwiched and supported by the substrate support portion 23. Thereby, the impact generated in the substrate support case 2 is absorbed by the substrate support portion 23 and transmitted to the substrate 3, so that the substrate support case 2 can support the substrate 3 so as to have high impact resistance. it can.

<Second Embodiment>
Next, a portable electronic device according to a second embodiment of the present invention will be described. In the present embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted as appropriate.

  4 is a cross-sectional view of the portable electronic device according to the second embodiment at a position corresponding to the line CC in FIG.

  The substrate support case 2 according to the second embodiment includes a substrate support portion 24 instead of the substrate support portion 23. The substrate support portion 24 has a slope corresponding to the chamfered portion 31 on the front surface side of the substrate 3, contacts the back surface of the substrate 3 with a first pressing portion 24 a that presses the chamfered portion 31 downward, and And a second pressing portion 24b having a convex portion that presses upward.

  With such a configuration, when the substrate 3 is mounted on the substrate support case 2, the back surface of the substrate 3 is bonded to the placement unit 21 via the bonding unit 4. Further, the chamfered portion 31 of the substrate 3 is pressed downward by the first pressing portion 24 a of the substrate supporting portion 24, and the back surface of the substrate 3 is moved upward by the second pressing portion 24 b of the substrate supporting portion 24. The substrate 3 is sandwiched and supported by the substrate support portion 24. Thereby, the impact generated in the substrate support case 2 is absorbed by the substrate support portion 24 and transmitted to the substrate 3, so that the substrate support case 2 can support the substrate 3 so as to have high impact resistance. it can.

<Third Embodiment>
Next, a portable electronic device according to a third embodiment of the present invention will be described. In the present embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted as appropriate.

  In the portable electronic device according to the third embodiment, the shape of the substrate support portion 23 includes a portion that supports the corner portion 35 of the substrate 3, a short side portion 36, and a long side portion 37 (hereinafter also referred to as a straight portion). The space between the substrate support portion 23 and the substrate 3 supported by the substrate support portion 23 is made different from the portion to be supported, so that the portion that supports the corner portion 35 of the substrate 3 and the linear portion of the substrate 3 It is made to differ in the part which supports.

  FIG. 5 is a partial cross-sectional view of the substrate and the substrate support portion of the portable electronic device according to the third embodiment. (5A) is a cross-sectional view of a portion of the substrate support portion 23 that supports the linear portion of the substrate 3 and the substrate 3 that is supported, and (5B) is a corner portion 35 of the substrate 3 of the substrate support portion 23. 2 is a cross-sectional view of a portion that supports the substrate 3 and the substrate 3 that is supported.

  In the portion that supports the straight portion of the substrate 3, as shown in (5A), the substrate support portion 23 has an inclined surface corresponding to the chamfered portion 31 on the surface side of the substrate 3, and the chamfered portion 31 is directed downward. The first pressing portion 23a has a first pressing portion 23a to be pressed and a second pressing portion 23b having a slope corresponding to the chamfered portion 32 on the back surface side of the substrate 3 and pressing the chamfered portion 32 upward. These slopes and the slope of the second pressing part 23b are connected by a joint part 23c. With this configuration, a space S1 surrounded by the side surface 33 of the substrate 3, the slope of the first pressing portion 23a, and the slope of the second pressing portion 23b is formed. The distance L in the surface direction of the substrate 3 between the side surface 33 of the substrate 3 and the bonding portion 23c is, for example, 0.2 to 0.3 mm.

  In the portion that supports the corner portion 35 of the substrate 3, as shown in (5B), the substrate support portion 23 has a slope corresponding to the chamfered portion 31 on the surface side of the substrate 3, and the chamfered portion 31 is directed downward. And a second pressing portion 23e that has a slope corresponding to the chamfered portion 32 on the back surface side of the substrate 3 and presses the chamfered portion 32 upward. The slope of the first pressing portion 23d and the slope of the second pressing portion 23e are connected via an opposing portion 23f having a surface facing the side surface 33 of the substrate 3.

  With this configuration, a space S2 surrounded by the side surface 33 of the substrate 3, the slope of the first pressing portion 23d, the slope of the second pressing portion 23e, and the facing portion 23f is formed. The slope of the first pressing part 23d corresponds to a part of the slope of the first pressing part 23a, and the slope of the second pressing part 23e corresponds to a part of the slope of the second pressing part 23b. The distance M in the surface direction of the substrate 3 between the side surface 33 of the substrate 3 and the facing portion 23f is, for example, 0 to 0.1 mm. The space S2 is narrower than the space S1.

  Thus, by widening the space S1 in the portion that supports the straight portion of the substrate 3, the peripheral wall portion 22 of the substrate support case 2 that supports the straight portion of the substrate 3 is moved to the opening 10 side by the distortion or external force of the molding process. Even when it is deformed, that is, when it is warped, it is possible to effectively prevent an excessive stress from being applied to the substrate 3 to be supported. Here, for example, assuming that the space S2 in the portion that supports the corner 35 is not narrow, if the corner of the substrate support case 2 that supports a certain corner 35 collides with the outside, the entire substrate 3 Is too close to the portion supporting the two straight portions sandwiching the corner portion 35 at the same time, and the gap between the substrate support portion 23 and the substrate 3 in the portion supporting the other two straight portions is increased. There is a possibility that the substrate 3 is detached from the substrate support portion 23. On the other hand, as described above, by reducing the width of the space S2 in the portion that supports the corner portion 35 of the substrate 3, the entire substrate 3 supports the two straight portions sandwiching the certain corner portion 35. It is possible to prevent the portion from being too close to the portion at the same time, and to prevent the substrate 3 from being detached from the substrate support portion 23.

<Fourth embodiment>
Next, a portable electronic device according to a fourth embodiment of the present invention will be described. In the present embodiment, the same reference numerals are given to the components common to the first and second embodiments, and the description thereof will be omitted as appropriate.

  In the portable electronic device according to the fourth embodiment, the shape of the substrate support portion 24 is a portion that supports the corner portion 35 of the substrate 3, and a portion that supports the straight portion (the short side portion 36 and the long side portion 37). The space between the substrate support portion 24 and the substrate 3 supported by the substrate support portion 24 is divided into a portion that supports the corner portion 35 of the substrate 3 and a portion that supports the linear portion of the substrate 3. It was made to differ.

  FIG. 6 is a partial cross-sectional view of the substrate and the substrate support portion of the portable electronic device according to the fourth embodiment. 6A is a cross-sectional view of a portion of the substrate support 24 that supports the linear portion of the substrate 3 and the substrate 3 that is supported, and FIG. 6B is a corner 35 of the substrate 3 of the substrate support 24. 2 is a cross-sectional view of a portion that supports the substrate 3 and the substrate 3 that is supported.

  In the portion that supports the straight portion of the substrate 3, as shown in (6A), the substrate support portion 24 has a slope corresponding to the chamfered portion 31 on the surface side of the substrate 3, and the chamfered portion 31 is directed downward. It has the 1st press part 24a to press, the 2nd press part 24b provided with the convex part which contacts the back surface of the board | substrate 3, and presses the board | substrate 3 upward, and the opposing part 24c which opposes the side surface 33 of the board | substrate 3. .

  With this configuration, a space S3 surrounded by the side surface 33 of the substrate 3, the slope of the first pressing portion 24a, the second pressing portion 24b, and the facing portion 24c is formed. A distance N in the surface direction of the substrate 3 between the side surface 33 of the substrate 3 and the facing portion 24c is, for example, 0.2 to 0.3 mm.

  In the portion that supports the corner portion 35 of the substrate 3, as shown in (6B), the substrate support portion 24 has a slope corresponding to the chamfered portion 31 on the surface side of the substrate 3, and the chamfered portion 31 is directed downward. A first pressing portion 24 d that presses against the substrate 3, a second pressing portion 24 e that includes a convex portion that contacts the back surface of the substrate 3 and presses the substrate 3 upward, and a facing portion 24 f that faces the side surface 33 of the substrate 3. Have.

  With this configuration, a space S4 surrounded by the side surface 33 of the substrate 3, the slope of the first pressing portion 24d, the second pressing portion 24e, and the facing portion 24f is formed. The distance O in the surface direction of the substrate 3 between the side surface 33 of the substrate 3 and the facing portion 24f is, for example, 0 to 0.1 mm. Therefore, the space S4 is narrower than the space S3.

  Thus, by widening the space S3 in the portion that supports the straight portion of the substrate 3, the peripheral wall portion 22 of the substrate support case 2 that supports the straight portion of the substrate 3 is moved to the opening 10 side by the distortion or external force of the molding process. Even when it is deformed, that is, when it is warped, it is possible to effectively prevent an excessive stress from being applied to the substrate 3 to be supported. Here, for example, assuming that the space S4 in the portion that supports the corner portion 35 is not narrow, if the corner portion of the substrate support case 2 that supports a certain corner portion 35 collides with the outside, the entire substrate 3 is formed. Is too close to the portion supporting the two straight portions sandwiching the corner portion 35 at the same time, and the gap between the substrate support portion 24 and the substrate 3 in the portion supporting the other two straight portions is increased. There is a possibility that the substrate 3 is detached from the substrate support portion 24. On the other hand, as described above, by reducing the width of the space S4 in the portion that supports the corner portion 35 of the substrate 3, the entire substrate 3 supports the two straight portions sandwiching the certain corner portion 35. It is possible to prevent the substrate 3 from being too close to the portion at the same time, and to prevent the substrate 3 from being detached from the substrate support portion 24.

<Fifth embodiment>
Next, a portable electronic device according to a fifth embodiment of the invention will be described. In the present embodiment, components common to the first and third embodiments are denoted by the same reference numerals, and the description thereof is omitted as appropriate.

  The portable electronic device according to the fifth embodiment is configured such that a display board 5 (hereinafter also referred to as a display board) including a substrate 3 is attached to the substrate support case 2.

  FIG. 7 is a cross-sectional view of a display panel for a portable electronic device including a substrate according to the fifth embodiment at a position corresponding to the line AA in FIG.

  In the present embodiment, display panel 5 is configured as a capacitive touch panel. The display panel 5 includes a surface layer 51 on the front surface side of the substrate 3 and a transparent electrode 52 on the back surface side of the substrate 3. The surface layer 51 is formed by laminating an optical adhesive layer 53, a UV resin layer 54, a printing layer 57, a transparent resin film 55, and a hard coat layer 56 in this order from the substrate 3 side. The optical adhesive layer 53 is an adhesive layer for forming the UV resin layer 54 and a layer above it on the substrate 3. The UV resin layer 54 is a layer that holds the printed layer 57 and fills the gap between the transparent resin film 55 and the optical adhesive layer 53. The print layer 57 is a layer formed in a frame shape with a predetermined width on the outer edge of the display board 5, and a black print layer 58, a mirror silver print layer 59, and a black print layer 60 are stacked in this order from the substrate 3 side. It consists of The print layer 57 is a layer formed for the purpose of forming a frame. The transparent resin film 55 is a layer made of a transparent resin such as PET, and is a coating layer for the purpose of preventing the substrate 3 from scattering. The transparent resin film 55 is a particularly effective layer when the substrate 3 is made of glass that is easily scattered. The hard coat layer 56 is a layer intended to prevent scratches.

  As an example, the surface layer 51 includes a plurality of layers as described above, but each layer is not an essential layer. Some or all of these layers may not be formed. Further, when the display board 5 is not used as a touch panel that combines operation and display, the transparent electrode 52 is also unnecessary.

<Other embodiments>

  Although the present invention has been described based on the embodiments, the present invention is not limited to the above-described embodiments, and can be applied to various other modes.

  For example, in the first to fifth embodiments, the substrate support portions (23, 24) that support the straight portions (the short side portion 36 and the long side portion 37) of the substrate 3 have substantially the same shape and support the substrate. However, the present invention is not limited to this, for example, by changing the shape of the substrate support portion corresponding to a part of the linear portion, The space between the support part and the supported substrate 3 may be partially different in a range in which the linear part is supported. For example, the space between the substrate support part and the supported substrate 3 in the part that supports the vicinity of the corner part 35 of the straight part, that is, the part that supports the vicinity of both ends of the straight part, other than the vicinity of both ends of the straight part. It may be narrower than the space between the substrate support portion and the substrate 3 supported in the portion that supports this portion. In this way, even if the peripheral wall portion 22 of the substrate support case 2 that supports the straight portion of the substrate 3 is deformed toward the opening 10 due to distortion or external force of the molding process, that is, even when it is warped inward. It is possible to effectively prevent an excessive stress from being applied to the substrate 3 and to prevent the entire substrate 3 from being too close to a portion supporting two straight portions sandwiching a certain corner 35 at the same time. It is possible to prevent the situation where 3 is detached from the substrate support portion.

  The present invention can be used for, for example, a portable electronic device.

DESCRIPTION OF SYMBOLS 1 Portable electronic device 2 Substrate support case 3 Substrate 21 Placement part 22 Peripheral wall parts 23 and 24 Substrate support part 23a, 23d, 24a, 24d 1st press part 23b, 23e, 24b, 24e

Claims (6)

  1. A mounting portion for mounting the peripheral edge portion of the back surface of the transparent , substantially rectangular substrate, and a mounting surface on which the substrate is to be mounted, rising from the mounting surface to the first direction in which the substrate is mounted. A substrate support case having a peripheral wall portion formed so as to surround a side surface of the substrate placed on the placement portion,
    A substrate support portion is formed on a circumference of at least a part of the inner peripheral surface of the peripheral wall portion, and is formed of a rubber-like elastic body, and supports the substrate.
    The substrate support portion is in contact with the chamfered portion of the front surface side of the substrate, the substrate have a first pressing portion that is formed so as to press the second direction of the first direction and the reverse, and the substrate The width of the space between the side surface of the substrate and the substrate support portion in the portion that supports the corner portion of the substrate is such that the side surface of the substrate and the substrate support portion in the portion that supports the linear portion of the substrate. A substrate support case that is formed so as to be narrower than the space between them .
  2.   The substrate support case according to claim 1, wherein the substrate support portion is formed in an annular shape around the entire inner peripheral surface of the peripheral wall portion.
  3.   The said board | substrate support part further has a 2nd press part which contacts at least one of the chamfering part of the back surface side of the said board | substrate, or the back surface of the said board | substrate, and presses the said board | substrate in the said 1st direction. Item 3. A substrate support case according to Item 2.
  4.   The said board | substrate support part is a board | substrate support case as described in any one of Claims 1-3 currently formed in the said surrounding wall part by the insert molding method.
  5. The substrate support case according to any one of claims 1 to 4 , wherein the rubber-like elastic body is an elastic body made of silicone rubber.
  6. The substrate support case according to any one of claims 1 to 5 ,
    A substrate supported by the substrate support case;
    A case with a substrate.
JP2013224954A 2013-10-30 2013-10-30 Substrate support case and case with substrate Active JP6163405B2 (en)

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