TW201711543A - Electronic device - Google Patents
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- TW201711543A TW201711543A TW105101443A TW105101443A TW201711543A TW 201711543 A TW201711543 A TW 201711543A TW 105101443 A TW105101443 A TW 105101443A TW 105101443 A TW105101443 A TW 105101443A TW 201711543 A TW201711543 A TW 201711543A
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Abstract
Description
本發明涉及一種電子裝置，特別涉及一種具有軟性電路板的電子裝置。The present invention relates to an electronic device, and more particularly to an electronic device having a flexible circuit board.
現有電子裝置中，通常具有面板以及軟性電路板。軟性電路板的一端電性連接於面板的上表面，另一端彎折後固定於面板的下表面，以降低電子裝置的整體厚度。軟性電路板的彎折處對應的空間內設置有膠水，以保持軟性電路板的彎曲程度。由於膠水無法移除，進而導致軟性電路板無法再次使用，增加了生產成本。In existing electronic devices, there are usually panels and flexible circuit boards. One end of the flexible circuit board is electrically connected to the upper surface of the panel, and the other end is bent and fixed to the lower surface of the panel to reduce the overall thickness of the electronic device. Glue is provided in the space corresponding to the bend of the flexible circuit board to maintain the degree of bending of the flexible circuit board. Since the glue cannot be removed, the flexible circuit board cannot be reused, which increases the production cost.
鑑於此，有必要提供一種可重複使用之電子裝置。In view of this, it is necessary to provide a reusable electronic device.
一種電子裝置，其包括面板及軟性電路板元件。軟性電路板元件包括軟性電路板及膠體。軟性電路板的一端電連接該面板上表面的邊緣，軟性電路板的另一端彎折固定至該面板與上表面相背的下表面上。軟性電路板元件還包括第一粘接部。第一粘接部可剝離的設置於該軟性電路板的內表面，且覆蓋該軟性電路板彎折位置的內表面。膠體填充於該第一粘接部與面板之間，且對應該軟性電路板的彎折部分，用於維持軟性電路板的彎曲程度。An electronic device includes a panel and a flexible circuit board component. Flexible circuit board components include flexible circuit boards and colloids. One end of the flexible circuit board is electrically connected to the edge of the upper surface of the panel, and the other end of the flexible circuit board is bent and fixed to the lower surface of the panel opposite to the upper surface. The flexible circuit board component also includes a first bonding portion. The first bonding portion is detachably disposed on an inner surface of the flexible circuit board and covers an inner surface of the flexible circuit board at a bent position. The colloid is filled between the first bonding portion and the panel, and corresponds to the bent portion of the flexible circuit board for maintaining the degree of bending of the flexible circuit board.
相較於習知技術，本發明所提供的電子裝置藉由在軟性電路板和膠體之間設置可剝離的第一粘接部，使得膠體可在外力作用下與軟性電路板分離，進而使得軟性電路板可重複使用。Compared with the prior art, the electronic device provided by the present invention provides a peelable first bonding portion between the flexible circuit board and the colloid, so that the colloid can be separated from the flexible circuit board by an external force, thereby making the softness The board can be reused.
圖1為第一實施方式之電子裝置之立體圖。1 is a perspective view of an electronic device of a first embodiment.
圖2為圖1中電子裝置之分解圖。2 is an exploded view of the electronic device of FIG. 1.
圖3為圖1中電子裝置去除框架之示意圖。3 is a schematic view of the electronic device removal frame of FIG. 1.
圖4為圖3中第一實施方式之電子裝置沿IV-IV方向之剖示圖。4 is a cross-sectional view of the electronic device of the first embodiment of FIG. 3 taken along the IV-IV direction.
圖5為圖3中第二實施方式之電子裝置沿IV-IV方向之剖示圖。FIG. 5 is a cross-sectional view of the electronic device of the second embodiment of FIG. 3 taken along the IV-IV direction.
圖6為圖1中第三實施方式之電子裝置之分解圖。Figure 6 is an exploded view of the electronic device of the third embodiment of Figure 1.
圖7為圖5中電子裝置沿VII-VII方向之剖示圖。Figure 7 is a cross-sectional view of the electronic device of Figure 5 taken along the line VII-VII.
下面結合附圖將對本發明實施方式作進一步的詳細說明。The embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.
請參閱圖1，其為一種較佳實施方式的電子裝置100之立體圖。Please refer to FIG. 1 , which is a perspective view of an electronic device 100 according to a preferred embodiment.
請一併參閱圖2及圖3，。該電子裝置100可以為觸控顯示裝置，其包括蓋板10、膠體層20、面板40、軟性電路板元件60及框架90。該蓋板10、該膠體層20、該面板40、該軟性電路板元件60依序層疊設置。具體地，面板40用於藉由膠體層20粘接於該蓋板10上，該軟性電路板元件60電連接該面板40，該面板40設置於該蓋板10和軟性電路板元件60之間。該蓋板10設置於該框架90上方，其用於與該框架90圍成收容空間收容該面板40及該軟性電路板元件60。Please refer to Figure 2 and Figure 3 together. The electronic device 100 can be a touch display device including a cover 10 , a colloid layer 20 , a panel 40 , a flexible circuit board component 60 , and a frame 90 . The cover 10, the gel layer 20, the panel 40, and the flexible circuit board component 60 are sequentially stacked. Specifically, the panel 40 is used to be bonded to the cover 10 by a glue layer 20 electrically connected to the panel 40. The panel 40 is disposed between the cover 10 and the flexible circuit board component 60. . The cover plate 10 is disposed above the frame 90 for enclosing the frame 40 and the flexible circuit board component 60 with the frame 90.
面板40包括觸控面板41和顯示面板42。觸控面板41藉由膠體層20粘接於蓋板10上。該顯示面板42設置於該觸控面板41遠離蓋板10的一側。該軟性電路板元件60電連接該觸控面板41。在其他可替代的實施方式中，面板40可以為指紋識別面板、顯示面板、觸控面板及內嵌式觸控顯示面板等。The panel 40 includes a touch panel 41 and a display panel 42. The touch panel 41 is bonded to the cover 10 by a colloid layer 20. The display panel 42 is disposed on a side of the touch panel 41 away from the cover 10 . The flexible circuit board component 60 is electrically connected to the touch panel 41. In other alternative embodiments, the panel 40 can be a fingerprint recognition panel, a display panel, a touch panel, an in-cell touch display panel, and the like.
請一併參閱圖4，軟性電路板元件60包括印刷電路板61、軟性電路板63、膠體65以及粘接層67。Referring to FIG. 4 together, the flexible circuit board component 60 includes a printed circuit board 61, a flexible circuit board 63, a glue 65, and an adhesive layer 67.
印刷電路板61大致呈薄板狀。印刷電路板61設置於面板40遠離蓋板10的一側。印刷電路板61用於給面板40提供電壓。The printed circuit board 61 is substantially in the form of a thin plate. The printed circuit board 61 is disposed on a side of the panel 40 away from the cover 10. The printed circuit board 61 is used to supply voltage to the panel 40.
軟性電路板63的一端與觸控面板41的上表面電性連接，另一端彎折後固定於顯示面板42的下表面，並與印刷電路板61電性連接。軟性電路板63包括第一連接部631、第二連接部632以及彎折部635。其中，第一連接部631和第二連接部632平行設置，彎折部635電性連接於第一連接部631和第二連接部632之間。One end of the flexible circuit board 63 is electrically connected to the upper surface of the touch panel 41, and the other end is bent and fixed to the lower surface of the display panel 42 and electrically connected to the printed circuit board 61. The flexible circuit board 63 includes a first connection portion 631, a second connection portion 632, and a bent portion 635. The first connecting portion 631 and the second connecting portion 632 are disposed in parallel, and the bent portion 635 is electrically connected between the first connecting portion 631 and the second connecting portion 632.
第一連接部631與顯示面板42的下表面相固定。第二連接部632與觸控面板41的上表面電性連接。彎折部635大致呈“C”字形，用於建立第一連接部631和第二連接部632之間的電性連接。The first connection portion 631 is fixed to the lower surface of the display panel 42. The second connecting portion 632 is electrically connected to the upper surface of the touch panel 41 . The bent portion 635 has a substantially "C" shape for establishing an electrical connection between the first connecting portion 631 and the second connecting portion 632.
膠體65填充於軟性電路板63和麵板40之間，且與彎折部635對應設置。膠體65用於保持彎折部635的彎曲程度。在本實施方式中，膠體65為環氧樹脂或者丙烯酸脂的膠水。The colloid 65 is filled between the flexible circuit board 63 and the panel 40 and is disposed corresponding to the bent portion 635. The colloid 65 is used to maintain the degree of bending of the bent portion 635. In the present embodiment, the colloid 65 is a glue of epoxy resin or acrylate.
粘接層67覆蓋於軟性電路板63上，且可在外力作用下與軟性電路板63相剝離。在本實施方式中，粘接層67的厚度範圍為5-500μm。The adhesive layer 67 covers the flexible circuit board 63 and is detachable from the flexible circuit board 63 by an external force. In the present embodiment, the thickness of the adhesive layer 67 ranges from 5 to 500 μm.
粘接層67包括第一粘接部672和第二粘接部674。其中，第一粘接部672和第二粘接部674對應不同的剝離力，且第一粘接部672對應的剝離力大於第二粘接部674對應的剝離力。The bonding layer 67 includes a first bonding portion 672 and a second bonding portion 674. The first bonding portion 672 and the second bonding portion 674 correspond to different peeling forces, and the peeling force corresponding to the first bonding portion 672 is greater than the peeling force corresponding to the second bonding portion 674.
第一粘接部672夾設於膠體65和彎折部635之間。第一粘接部672將膠體65和彎折部635粘接為一體，以保持彎折部635的彎曲程度。優選地，第一粘接部672剝離力大於1.5N/cm。The first bonding portion 672 is interposed between the colloid 65 and the bent portion 635. The first bonding portion 672 integrally bonds the colloid 65 and the bent portion 635 to maintain the degree of bending of the bent portion 635. Preferably, the first bonding portion 672 has a peeling force greater than 1.5 N/cm.
第二粘接部674夾設於面板40和第一連接部631之間。第二粘接部674將面板40的底部和第一連接部631粘接為一體，以防止顯示面板42相對第一連接部631移動。優選地，第二粘接部674剝離力小於1.5N/cm。The second bonding portion 674 is interposed between the panel 40 and the first connecting portion 631. The second bonding portion 674 integrally bonds the bottom of the panel 40 and the first connecting portion 631 to prevent the display panel 42 from moving relative to the first connecting portion 631. Preferably, the second bonding portion 674 has a peeling force of less than 1.5 N/cm.
請參閱圖5，其為第二實施方式之電子裝置100。Please refer to FIG. 5 , which is an electronic device 100 of the second embodiment.
軟性電路板元件70包括印刷電路板71、軟性電路板73、膠體75以及粘接層77。The flexible circuit board component 70 includes a printed circuit board 71, a flexible circuit board 73, a glue 75, and an adhesive layer 77.
印刷電路板71大致呈薄板狀。印刷電路板71設置於面板40遠離蓋板10的一側。印刷電路板71用於給面板40提供電壓。The printed circuit board 71 is substantially in the form of a thin plate. The printed circuit board 71 is disposed on a side of the panel 40 away from the cover 10. The printed circuit board 71 is used to supply voltage to the panel 40.
軟性電路板73的一端與觸控面板41的上表面電性連接，另一端彎折後固定於顯示面板42的下表面，且與印刷電路板71電性連接。軟性電路板73包括第一連接部731、第二連接部732以及彎折部735。其中，第一連接部731和第二連接部732平行設置，彎折部735電性連接於第一連接部731和第二連接部732之間。One end of the flexible circuit board 73 is electrically connected to the upper surface of the touch panel 41 , and the other end is bent and fixed to the lower surface of the display panel 42 and electrically connected to the printed circuit board 71 . The flexible circuit board 73 includes a first connection portion 731, a second connection portion 732, and a bent portion 735. The first connecting portion 731 and the second connecting portion 732 are disposed in parallel, and the bent portion 735 is electrically connected between the first connecting portion 731 and the second connecting portion 732.
第一連接部731與顯示面板42的下表面相固定。第二連接部732與觸控面板41的上表面電性連接。彎折部735大致呈“C”字形，用於建立第一連接部731和第二連接部732之間的電性連接。The first connection portion 731 is fixed to the lower surface of the display panel 42. The second connecting portion 732 is electrically connected to the upper surface of the touch panel 41 . The bent portion 735 has a substantially "C" shape for establishing an electrical connection between the first connecting portion 731 and the second connecting portion 732.
膠體75填充於軟性電路板73和麵板40之間，且與彎折部735對應設置。膠體75用於保持彎折部735的彎曲程度。在本實施方式中，膠體75為環氧樹脂或者丙烯酸脂的膠水。The colloid 75 is filled between the flexible circuit board 73 and the panel 40, and is disposed corresponding to the bent portion 735. The colloid 75 is used to maintain the degree of bending of the bent portion 735. In the present embodiment, the colloid 75 is a glue of epoxy resin or acrylate.
粘接層77覆蓋於軟性電路板73上，且可在外力作用下與軟性電路板73相剝離。在本實施方式中，粘接層77的厚度範圍為5-500μm。The adhesive layer 77 covers the flexible circuit board 73 and is detachable from the flexible circuit board 73 by an external force. In the present embodiment, the thickness of the adhesive layer 77 ranges from 5 to 500 μm.
粘接層77包括第一粘接部772和第二粘接部774。其中，第一粘接部772和第二粘接部774對應不同的剝離力，且第一粘接部772對應的剝離力大於第二粘接部774對應的剝離力。The bonding layer 77 includes a first bonding portion 772 and a second bonding portion 774. The first bonding portion 772 and the second bonding portion 774 correspond to different peeling forces, and the peeling force corresponding to the first bonding portion 772 is greater than the peeling force corresponding to the second bonding portion 774.
第一粘接部772夾設於膠體75和彎折部735之間。第一粘接部772將膠體75和彎折部735粘接為一體，以保持彎折部735的彎曲程度。優選地，第一粘接部772剝離力大於1.5N/cm。第一粘接部772還包括複數個第一缺口773。複數個第一缺口773間隔設置，以將第一粘接部772分割成多段。在本實施方式中，第一缺口773等間距設置。在可替代的實施方式中，第一缺口773之間的間距可由中部向相端遞減，或沿同一方向呈遞減變化。The first bonding portion 772 is interposed between the colloid 75 and the bent portion 735. The first bonding portion 772 bonds the colloid 75 and the bent portion 735 integrally to maintain the degree of bending of the bent portion 735. Preferably, the first bonding portion 772 has a peeling force greater than 1.5 N/cm. The first bonding portion 772 further includes a plurality of first notches 773. A plurality of first notches 773 are spaced apart to divide the first bonding portion 772 into a plurality of segments. In the present embodiment, the first notches 773 are provided at equal intervals. In an alternative embodiment, the spacing between the first indentations 773 may decrease from the central to the end, or in a decreasing direction in the same direction.
第二粘接部774夾設於顯示面板42和第一連接部731之間。第二粘接部774將顯示面板42的底部和第一連接部731粘接為一體，以防止顯示面板42相對第一連接部731移動。優選地，第二粘接部774剝離力小於1.5N/cm。第二粘接部774包括複數個第二缺口775。複數個第二缺口775間隔設置，以將第二粘接部774分割成多段。在本實施方式中，第一缺口773等間距設置。在可替代的實施方式中，第一缺口773之間的間距可由中部向相端遞減，或沿同一方向呈遞減變化。The second bonding portion 774 is interposed between the display panel 42 and the first connection portion 731 . The second bonding portion 774 integrally bonds the bottom of the display panel 42 and the first connecting portion 731 to prevent the display panel 42 from moving relative to the first connecting portion 731. Preferably, the second bonding portion 774 has a peeling force of less than 1.5 N/cm. The second bonding portion 774 includes a plurality of second notches 775. A plurality of second notches 775 are spaced apart to divide the second bonding portion 774 into a plurality of segments. In the present embodiment, the first notches 773 are provided at equal intervals. In an alternative embodiment, the spacing between the first indentations 773 may decrease from the central to the end, or in a decreasing direction in the same direction.
請參閱圖6，其為第三實施方式之電子裝置700的立體分解示意圖。該電子裝置500可以為指紋識別裝置，其包括面板50及與面板50邊緣電性連接的軟性電路板元件60。在本實施方式中，面板50為指紋識別面板，如超聲波式指紋識別面板，但不限於上述面板。Please refer to FIG. 6 , which is a perspective exploded view of the electronic device 700 of the third embodiment. The electronic device 500 can be a fingerprint recognition device that includes a panel 50 and a flexible circuit board component 60 that is electrically coupled to the edge of the panel 50. In the present embodiment, the panel 50 is a fingerprint recognition panel such as an ultrasonic fingerprint recognition panel, but is not limited to the above panel.
請一併參閱圖7，軟性電路板元件60包括軟性電路板63、膠體65以及粘接層67。Referring to FIG. 7, the flexible circuit board component 60 includes a flexible circuit board 63, a glue 65, and an adhesive layer 67.
軟性電路板63的一端與觸控面板41的上表面電性連接，另一端彎折後固定於顯示面板42的下表面。軟性電路板63包括第一連接部631、第二連接部632以及彎折部635。其中，第一連接部631和第二連接部632平行設置，彎折部635電性連接於第一連接部631和第二連接部632之間。One end of the flexible circuit board 63 is electrically connected to the upper surface of the touch panel 41, and the other end is bent and fixed to the lower surface of the display panel 42. The flexible circuit board 63 includes a first connection portion 631, a second connection portion 632, and a bent portion 635. The first connecting portion 631 and the second connecting portion 632 are disposed in parallel, and the bent portion 635 is electrically connected between the first connecting portion 631 and the second connecting portion 632.
第一連接部631與顯示面板42的下表面相固定。第二連接部632與觸控面板41的上表面電性連接。彎折部635大致呈“C”字形，用於建立第一連接部631和第二連接部632之間的電性連接。The first connection portion 631 is fixed to the lower surface of the display panel 42. The second connecting portion 632 is electrically connected to the upper surface of the touch panel 41 . The bent portion 635 has a substantially "C" shape for establishing an electrical connection between the first connecting portion 631 and the second connecting portion 632.
膠體65填充於軟性電路板63和麵板40之間，且與彎折部635對應設置。膠體65用於保持彎折部635的彎曲程度。在本實施方式中，膠體65為環氧樹脂或者丙烯酸脂的膠水。The colloid 65 is filled between the flexible circuit board 63 and the panel 40 and is disposed corresponding to the bent portion 635. The colloid 65 is used to maintain the degree of bending of the bent portion 635. In the present embodiment, the colloid 65 is a glue of epoxy resin or acrylate.
粘接層67設置於軟性電路板43的內表面上，且可在外力作用下與軟性電路板63相剝離。粘接層67在本實施方式中，粘接層67的厚度範圍為5-500μm。The bonding layer 67 is provided on the inner surface of the flexible circuit board 43, and is detachable from the flexible circuit board 63 by an external force. In the present embodiment, the adhesive layer 67 has a thickness of the adhesive layer 67 in the range of 5 to 500 μm.
粘接層67包括第一粘接部672和第二粘接部674。其中，第一粘接部672和第二粘接部674對應不同的剝離力，且第一粘接部672對應的剝離力大於第二粘接部674對應的剝離力。在本實施方式中，第一粘接部672和第二粘接部674的厚度相同，且呈薄板狀。The bonding layer 67 includes a first bonding portion 672 and a second bonding portion 674. The first bonding portion 672 and the second bonding portion 674 correspond to different peeling forces, and the peeling force corresponding to the first bonding portion 672 is greater than the peeling force corresponding to the second bonding portion 674. In the present embodiment, the first bonding portion 672 and the second bonding portion 674 have the same thickness and have a thin plate shape.
第一粘接部672夾設於膠體65和彎折部635之間。第一粘接部672將膠體65和彎折部635粘接為一體，以保持彎折部635的彎曲程度。優選地，第一粘接部672剝離力大於1.5N/cm。The first bonding portion 672 is interposed between the colloid 65 and the bent portion 635. The first bonding portion 672 integrally bonds the colloid 65 and the bent portion 635 to maintain the degree of bending of the bent portion 635. Preferably, the first bonding portion 672 has a peeling force greater than 1.5 N/cm.
第二粘接部674夾設於顯示面板42和第一連接部631之間。第二粘接部674將顯示面板42的下表面和第一連接部631粘接為一體，以防止顯示面板42相對第一連接部631移動。優選地，第二粘接部674剝離力小於1.5N/cm。The second bonding portion 674 is interposed between the display panel 42 and the first connection portion 631. The second bonding portion 674 integrally bonds the lower surface of the display panel 42 and the first connecting portion 631 to prevent the display panel 42 from moving relative to the first connecting portion 631. Preferably, the second bonding portion 674 has a peeling force of less than 1.5 N/cm.
藉由在彎折部635，735和膠體65，75之間設置可剝離的第一粘接部672，772，使得膠體65，75可在外力作用下與軟性電路板63，73分離，進而使得軟性電路板63，73可重複使用。同時，在第一連接部631，731和麵板40，50之間設置可剝離的第二粘接部674，774，使得面板40，50與軟性電路板63，73相固定，進而防止面板40，50相對軟性電路板63，73移動。By providing the peelable first bonding portions 672, 772 between the bent portions 635, 735 and the colloids 65, 75, the colloids 65, 75 can be separated from the flexible circuit boards 63, 73 by an external force, thereby making The flexible circuit boards 63, 73 are reusable. At the same time, a peelable second bonding portion 674, 774 is disposed between the first connecting portions 631, 731 and the panels 40, 50, so that the panels 40, 50 are fixed to the flexible circuit boards 63, 73, thereby preventing the panel 40 , 50 moves relative to the flexible circuit boards 63, 73.
綜上所述，本創作符合發明專利要件，爰依法提出專利申請。惟，以上所述者僅為本創作之較佳實施例，本創作之範圍並不以上述實施例為限，舉凡熟習本案技藝之人士爰依本創作之精神所作之等效修飾或變化，皆應涵蓋於以下申請專利範圍內。In summary, the creation meets the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention is not limited to the above embodiments, and those skilled in the art will be equivalently modified or changed according to the spirit of the present invention. It should be covered by the following patent application.
100，500‧‧‧電子裝置100,500‧‧‧ electronic devices
10‧‧‧蓋板10‧‧‧ Cover
20‧‧‧膠體層20‧‧‧colloid layer
40，50‧‧‧面板40, 50‧‧‧ panel
41‧‧‧觸控面板41‧‧‧Touch panel
42‧‧‧顯示面板42‧‧‧ display panel
60，70‧‧‧軟性電路板元件60,70‧‧‧Soft circuit board components
61，71‧‧‧印刷電路板61,71‧‧‧Printed circuit board
63，73‧‧‧軟性電路板63,73‧‧‧Soft circuit board
631，731‧‧‧第一連接部631,731‧‧‧First connection
632，732‧‧‧第二連接部632,732‧‧‧Second connection
635，735‧‧‧彎折部635,735‧‧‧Bend
65，75‧‧‧膠體65,75‧‧‧ colloid
67，77‧‧‧粘接層67,77‧‧‧ bonding layer
672，772‧‧‧第一粘接部672,772‧‧‧First Bonding Department
773‧‧‧第一缺口773‧‧‧ first gap
674，774‧‧‧第二粘接部674,774‧‧‧Second bonding department
775‧‧‧第二缺口775‧‧‧ second gap
90‧‧‧框架90‧‧‧Frame
無no
100，500‧‧‧電子裝置 100,500‧‧‧ electronic devices
10‧‧‧蓋板 10‧‧‧ Cover
20‧‧‧膠體層 20‧‧‧colloid layer
40，50‧‧‧面板 40, 50‧‧‧ panel
41‧‧‧觸控面板 41‧‧‧Touch panel
42‧‧‧顯示面板 42‧‧‧ display panel
60，70‧‧‧軟性電路板元件 60,70‧‧‧Soft circuit board components
61，71‧‧‧印刷電路板 61,71‧‧‧Printed circuit board
63，73‧‧‧軟性電路板 63,73‧‧‧Soft circuit board
631，731‧‧‧第一連接部 631,731‧‧‧First connection
632，732‧‧‧第二連接部 632,732‧‧‧Second connection
635，735‧‧‧彎折部 635,735‧‧‧Bend
65，75‧‧‧膠體 65,75‧‧‧ colloid
67，77‧‧‧粘接層 67,77‧‧‧ bonding layer
672，772‧‧‧第一粘接部 672,772‧‧‧First Bonding Department
773‧‧‧第一缺口 773‧‧‧ first gap
674，774‧‧‧第二粘接部 674,774‧‧‧Second bonding department
775‧‧‧第二缺口 775‧‧‧ second gap
90‧‧‧框架 90‧‧‧Frame
Claims (13)
The electronic device of claim 1, wherein the panel comprises a touch panel and a display panel; one end of the flexible circuit board is electrically connected to the upper surface of the touch panel, and the other end is bent and fixed to the lower surface of the display panel. .
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| CN201510183230.0A CN104869749B (en) | 2015-04-17 | 2015-04-17 | Electronic installation |
| ??201510183230.0 | 2015-04-17 |
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| TW201711543A true TW201711543A (en) | 2017-03-16 |
| TWI622331B TWI622331B (en) | 2018-04-21 |
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| FR3048153B1 (en) * | 2016-02-22 | 2019-11-29 | Valeo Vision | LUMINOUS MODULE FOR A MOTOR VEHICLE WITH MASS RECOVERY |
| KR102412154B1 (en) * | 2017-07-07 | 2022-06-23 | 삼성디스플레이 주식회사 | Display device and fabricating method of the same |
| CN107577278B (en) * | 2017-09-14 | 2020-02-04 | 维沃移动通信有限公司 | Display screen assembly and mobile terminal |
| JP7043267B2 (en) * | 2018-01-17 | 2022-03-29 | 株式会社ジャパンディスプレイ | Display device |
| CN108196626B (en) * | 2018-01-17 | 2023-08-29 | 南昌黑鲨科技有限公司 | Screen assembly and intelligent terminal with same |
| CN108259651B (en) * | 2018-01-18 | 2020-09-08 | Oppo广东移动通信有限公司 | Display screen assembly and electronic equipment |
| CN108196625B (en) * | 2018-01-18 | 2020-11-20 | Oppo广东移动通信有限公司 | Display screen assembly and electronic equipment |
| CN108563356A (en) * | 2018-03-27 | 2018-09-21 | 广东欧珀移动通信有限公司 | Display screen component and electronic equipment |
| US11199736B2 (en) | 2018-05-24 | 2021-12-14 | Innolux Corporation | Electronic device |
| CN110536539B (en) * | 2018-05-24 | 2022-03-15 | 群创光电股份有限公司 | Electronic device |
| CN108807482B (en) * | 2018-06-19 | 2020-09-08 | 武汉华星光电半导体显示技术有限公司 | OLED display screen module and display device |
| CN108881540B (en) * | 2018-06-22 | 2021-03-02 | Oppo广东移动通信有限公司 | Display screen assembly and electronic equipment |
| CN109032417B (en) * | 2018-08-09 | 2021-09-03 | 武汉华星光电半导体显示技术有限公司 | Display module and electronic device |
| KR102551050B1 (en) * | 2018-08-22 | 2023-07-03 | 엘지디스플레이 주식회사 | Flexible display device |
| CN109461382B (en) * | 2018-12-03 | 2020-08-11 | 武汉华星光电半导体显示技术有限公司 | Bendable panel and manufacturing method thereof |
| CN113645752A (en) * | 2021-08-03 | 2021-11-12 | 武汉华星光电半导体显示技术有限公司 | Display module and assembling method thereof |
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| KR100530749B1 (en) * | 2003-12-09 | 2005-11-23 | 삼성테크윈 주식회사 | Flexible printed circuit board |
| CN100358400C (en) * | 2004-03-22 | 2007-12-26 | 友达光电股份有限公司 | Soft circuit board structure and electronic device for preventing soft circuit board from centralized stress when bending |
| CN2876829Y (en) * | 2006-03-08 | 2007-03-07 | 胜华科技股份有限公司 | Optical display module structure |
| TWI344038B (en) * | 2006-08-02 | 2011-06-21 | Chimei Innolux Corp | Liquid crystal display device |
| CN101360386B (en) * | 2007-08-03 | 2010-10-06 | 富葵精密组件(深圳)有限公司 | Circuit board binding glue layer and circuit board comprising the glue layer |
| CN201550352U (en) * | 2009-07-27 | 2010-08-11 | 天马微电子股份有限公司 | Flexible PCB and LCM employing same |
| CN202773168U (en) * | 2012-08-07 | 2013-03-06 | 富葵精密组件(深圳)有限公司 | Flexible circuit board |
| CN104182069A (en) * | 2013-05-25 | 2014-12-03 | 宸鸿科技(厦门)有限公司 | Touch panel and manufacturing method for same |
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2015
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| Publication number | Publication date |
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| CN104869749A (en) | 2015-08-26 |
| CN104869749B (en) | 2018-02-27 |
| TWI622331B (en) | 2018-04-21 |
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