JPS6084829A - ワイヤボンデイング装置 - Google Patents

ワイヤボンデイング装置

Info

Publication number
JPS6084829A
JPS6084829A JP59192503A JP19250384A JPS6084829A JP S6084829 A JPS6084829 A JP S6084829A JP 59192503 A JP59192503 A JP 59192503A JP 19250384 A JP19250384 A JP 19250384A JP S6084829 A JPS6084829 A JP S6084829A
Authority
JP
Japan
Prior art keywords
clamper
wire
bonding
solenoid
slider
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59192503A
Other languages
English (en)
Japanese (ja)
Other versions
JPS626651B2 (enrdf_load_stackoverflow
Inventor
Shunichiro Fujioka
俊一郎 藤岡
Shunei Uematsu
俊英 植松
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP59192503A priority Critical patent/JPS6084829A/ja
Publication of JPS6084829A publication Critical patent/JPS6084829A/ja
Publication of JPS626651B2 publication Critical patent/JPS626651B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP59192503A 1984-09-17 1984-09-17 ワイヤボンデイング装置 Granted JPS6084829A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59192503A JPS6084829A (ja) 1984-09-17 1984-09-17 ワイヤボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59192503A JPS6084829A (ja) 1984-09-17 1984-09-17 ワイヤボンデイング装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP15649476A Division JPS5380967A (en) 1976-12-27 1976-12-27 Wire clamper driving mechanism

Publications (2)

Publication Number Publication Date
JPS6084829A true JPS6084829A (ja) 1985-05-14
JPS626651B2 JPS626651B2 (enrdf_load_stackoverflow) 1987-02-12

Family

ID=16292382

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59192503A Granted JPS6084829A (ja) 1984-09-17 1984-09-17 ワイヤボンデイング装置

Country Status (1)

Country Link
JP (1) JPS6084829A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6231672A (ja) * 1985-05-16 1987-02-10 クリツケ・アンド・ソフア・インダストリ−ズ・インコ−ポレ−テツド ボイスコイルで駆動される細いワイヤ−結合ヘツド
US9993860B2 (en) 2010-09-14 2018-06-12 Thyssenkrupp Steel Europe Ag Device and method for producing at least partially closed hollow profiles with rotatable die halves and low cycle time

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6231672A (ja) * 1985-05-16 1987-02-10 クリツケ・アンド・ソフア・インダストリ−ズ・インコ−ポレ−テツド ボイスコイルで駆動される細いワイヤ−結合ヘツド
US9993860B2 (en) 2010-09-14 2018-06-12 Thyssenkrupp Steel Europe Ag Device and method for producing at least partially closed hollow profiles with rotatable die halves and low cycle time

Also Published As

Publication number Publication date
JPS626651B2 (enrdf_load_stackoverflow) 1987-02-12

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