JPS6084542A - Mask for semiconductor device - Google Patents

Mask for semiconductor device

Info

Publication number
JPS6084542A
JPS6084542A JP58192376A JP19237683A JPS6084542A JP S6084542 A JPS6084542 A JP S6084542A JP 58192376 A JP58192376 A JP 58192376A JP 19237683 A JP19237683 A JP 19237683A JP S6084542 A JPS6084542 A JP S6084542A
Authority
JP
Japan
Prior art keywords
mask
photomask
present
wafer
device pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP58192376A
Other languages
Japanese (ja)
Inventor
Soichi Tsuuzawa
通沢　壮一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58192376A priority Critical patent/JPS6084542A/en
Publication of JPS6084542A publication Critical patent/JPS6084542A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
    • G03F1/42—Alignment or registration features, e.g. alignment marks on the mask substrates

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)

Abstract

PURPOSE:To know the directivity of a mask easily and to improve operation efficiency by cutting four corners of a square mask at 1-3 positions and forming chamfered parts. CONSTITUTION:A photomask consists of a device pattern part 1, chromium film 2, identification part 3 for the kind of the substrate, mask name part 4, chamfered parts 5, etc. The photomask is formed by patterning, for example, a glass surface by using a pattern material made of chromium. In this case, up to three chamfered parts 5 may be formed when necessary. The size of chamfering is preferably 3-10cm<2>, but may be increased without reaching the device pattern part 1.

Description

【発明の詳細な説明】 〔技術分野〕 本発明は半導体装置用マスクに関し、特に、マスクの方
向性を容易に知り得るので、マスク製作工程およびウェ
ハでのアライメント工程において作業能率を著しく向上
させることができるホトマスクに関する。[Detailed Description of the Invention] [Technical Field] The present invention relates to a mask for semiconductor devices, and in particular, it is possible to easily know the direction of the mask, thereby significantly improving work efficiency in the mask manufacturing process and the wafer alignment process. Regarding photomasks that can be used.

〔背景技術〕[Background technology]

半導体装置製造の際に使用されるホトマスクは、たとえ
ば電子線描画装置を用いであるいはレピータを用いて作
られる。そして、得られたホトマスクはウニハエ程でマ
スク合せ装置に装着して使用される。このホトマスクは
、通常、一つのＩＣを製造するためには千秋程度必要と
される。従って、ホトマスクのパターンを転写したウェ
ハと次工程のホトマスクとの間の位置合せが必要になる
。Photomasks used in the manufacture of semiconductor devices are made using, for example, an electron beam lithography system or a repeater. Then, the obtained photomask is used by attaching it to a mask matching device in a manner similar to that of a sea urchin fly. This photomask usually requires about 1,000 photomasks to manufacture one IC. Therefore, it is necessary to align the wafer onto which the photomask pattern has been transferred and the photomask for the next process.

本発明者の検討によれば、この位置合せをするにあたり
、次のような問題があることがわかった。According to the study conducted by the inventor of the present invention, it has been found that there are the following problems in performing this alignment.

すなわち、ホトマスクの上下左右を確認する有効な手段
が無く、それ故、マスクの上下、左右を判断する時、い
ちいちデバイスパターンを顕微鏡などでのぞく必要があ
る。また、ホトマスク製造工程中デバイスパターン感光
工程が終り、ホトマスク名称をプリントする時マスクの
上下、左右が全く不明であったり、それを知るには感光
工程での終了時点の向きをくずさずに次工程に運ぶ必要
があり、非常に間違えやすい。さらにマスク検査工程、
ウェハ処理工程でのマスク取扱いにおいて、いちいちデ
バイスパターンを顕微鏡でのぞいてみないと上下、左右
が容易に判明し難い。That is, there is no effective means for checking the top, bottom, left and right of the photomask, and therefore, when determining the top, bottom, left and right of the mask, it is necessary to look at each device pattern using a microscope or the like. In addition, during the photomask manufacturing process, when the device pattern exposure process is finished and the photomask name is printed, the top, bottom, left and right sides of the mask are completely unknown. It is very easy to make mistakes. Furthermore, the mask inspection process,
When handling masks in the wafer processing process, it is difficult to easily determine the top, bottom, left and right of each device pattern unless you look at each device pattern with a microscope.

なお、ホトマスクのコーナーに設けられた基板種類を弁
別する基板種類弁別部や、数字や記号などにより構成さ
れたマスク名称部をマスクの上下。In addition, there is a substrate type discrimination section provided at the corner of the photomask to distinguish the substrate type, and a mask name section consisting of numbers and symbols at the top and bottom of the mask.

左右を判断することが考えられる。しかし、ホトマスク
の種類が多く形状が複雑であったり、形成される位置が
決まっていないので、どの向きがたとえば上なのか左な
のか判別できない。It is possible to determine left and right. However, since there are many types of photomasks and their shapes are complex, and the positions where they are formed are not determined, it is not possible to determine which direction is, for example, upward or to the left.

〔発明の目的〕[Purpose of the invention]

本発明の目的は半導体集積回路製造用角形マスクの上下
、左右の方向を容易に弁別し、マスク合せなどを間違わ
ずに速やかに処理することができ、マスク製造工程、ウ
ェハ処理工程での取扱いを簡略化し得るホトマスクを提
供することにある。The purpose of the present invention is to easily distinguish the vertical and horizontal directions of a rectangular mask for manufacturing semiconductor integrated circuits, to quickly process the mask alignment without making mistakes, and to simplify handling in the mask manufacturing process and wafer processing process. The object of the present invention is to provide a photomask that can be simplified.

本発明の前記ならびにそのはかの目的と新規な特徴は本
明細書の記述および添付図面からあきらかになるであろ
う。The foregoing and further objects and novel features of the present invention will become apparent from the description herein and the accompanying drawings.

〔発明の概要〕[Summary of the invention]

本願において開示される発明のうち代表的なものの概要
を簡単に説明すれば、下記のとおりである。A brief overview of typical inventions disclosed in this application is as follows.

すなわち、本発明においては角形マスクに面取部を設け
、角形マスクの上下、左右方向を容易に弁別できるよう
にしたものである。That is, in the present invention, the square mask is provided with a chamfer so that the vertical and horizontal directions of the square mask can be easily distinguished.

〔実施例〕〔Example〕

以下、本発明の実施例を図面に基づいて説明する。 Embodiments of the present invention will be described below based on the drawings.

第１図はホトマスク全体の平面図であり、第１図にて、
１はデバイスパターン部、２はデバイスパターン部の周
りを囲むクロム膜、３は基板種類弁別部、４はマスク名
称部、５は当該角形マスクのコーナーを切欠いて形成し
た面取部である。Figure 1 is a plan view of the entire photomask, and in Figure 1,
1 is a device pattern portion, 2 is a chrome film surrounding the device pattern portion, 3 is a substrate type discrimination portion, 4 is a mask name portion, and 5 is a chamfered portion formed by cutting out a corner of the square mask.

このホトマスクは、たとえば、方ラス面にクロム（Ｃｒ
）よりなるパターン材を用い、バターニングされて構成
される。面取部５は第１図ではコーナーの右下隅１カ所
に設けた例を示したが、必要に応じて３カ所まで設ける
ことが可能である。この場合の面取りの大きさは３〜１
０１ｍ２位がよいが、デバイスパターン部１を侵食しな
い程度まで大きくしてもよい。This photomask, for example, has chromium (Cr) on the lateral surface.
) is patterned using a patterned material. Although FIG. 1 shows an example in which the chamfered portion 5 is provided at one location at the lower right corner of the corner, it is possible to provide the chamfered portion 5 at up to three locations as required. The size of the chamfer in this case is 3 to 1
The thickness is preferably about 0.01 m2, but it may be increased to the extent that it does not erode the device pattern portion 1.

本発明の面取部を設けたホトマスクは、たとえばウニハ
エ程でのマスク合せ装置に装着して使用される。第２図
は紫外層転写によりホトマスクよりウェハに転写する装
置の概要を示したもので、第２図にて、６はホトマスク
、７はホトマスクステージ、８は投影レンズ、９はへリ
コイド、１゜はステップおよび位置合せ用ステージ、１
１はチャック吸着ゴム、１２はウェハ、１３はウェハチ
ャックである。The photomask provided with the chamfered portion of the present invention is used, for example, by being attached to a mask matching device such as a sea urchin fly. Figure 2 shows an outline of an apparatus for transferring an ultraviolet layer from a photomask to a wafer. In Figure 2, 6 is a photomask, 7 is a photomask stage, 8 is a projection lens, 9 is a helicoid, and 1° is a step and alignment stage, 1
1 is a chuck adsorption rubber, 12 is a wafer, and 13 is a wafer chuck.

第３図はホトマスク６からウェハ１２へ転写する態様を
示したもので、ホトマスク６には本発明に係る面取部５
がそのコーナーに設けられているので、前工程のホトマ
スクのパターンを転写されたウェハ１２と次工程のホト
マスク６との上下左右の位置関係は簡単に目視だけで合
せられる。FIG. 3 shows a mode of transferring from the photomask 6 to the wafer 12, and the photomask 6 has a chamfered portion 5 according to the present invention.
are provided at the corners, so that the vertical and horizontal positional relationship between the wafer 12 onto which the pattern of the photomask of the previous process has been transferred and the photomask 6 of the next process can be easily aligned just by visual inspection.

〔効果〕〔effect〕

（１）　本発明によれば、角形マスクの四隅の少なくと
も１カ所を切欠き面取部を設けたので、それにより、当
該マスクの方向性（上下、左右）が容易に知り得るので
、マスク合せを間違わずに、かつ速やかに実行すること
ができる。(1) According to the present invention, at least one of the four corners of the rectangular mask is provided with a cutout and a chamfered portion, so that the directionality of the mask (up and down, left and right) can be easily known, so that mask alignment is possible. can be carried out quickly and without mistakes.

（２）また、本発明によれば、面取部を利用してマスク
の位置決めが可能となる。マスクを第２図に示すような
装置に装着するときに、通常３カ所で位置決めするが、
この際に、第４図に示すように面取部５を利用して位置
決め棒１ヶを用いてホトマスク６を簡単に押し込みやす
く、容易かつ確実な位置合せを実行でき、かつ従来は当
該突き棒で押し込むときにガラス面かわれることがあっ
たがこれを回避することもできた。尚第４図にて。(2) Furthermore, according to the present invention, the mask can be positioned using the chamfered portion. When attaching a mask to a device like the one shown in Figure 2, it is usually positioned in three places.
At this time, as shown in FIG. 4, the photomask 6 can be easily pushed in using one positioning rod using the chamfered portion 5, and the positioning can be performed easily and surely. The glass surface sometimes got scratched when I pushed it in, but I was able to avoid this. In addition, in Figure 4.

１５は壁、１６は位置決めピンである。15 is a wall, and 16 is a positioning pin.

（３）本発明によれば、第５図に示すようＫ、ホトマス
ク６をケース１７に収容するとぎに、面取部５をもって
そろえておくことにより、マスク６を取り出すときに方
向性も容易に知れ、統一的な使用ができ、作業能率が格
段に向上する。(3) According to the present invention, as shown in FIG. 5, when the photomask 6 is housed in the case 17, the chamfered portions 5 are aligned so that the orientation can be easily determined when the mask 6 is taken out. It can be used in a unified manner, greatly improving work efficiency.

（４）面取部の数を適宜のものとすることによりプレー
トメーカーの区別が容易に知り得る。(4) By setting an appropriate number of chamfers, it is possible to easily distinguish between plate manufacturers.

（５）また、面取部のカット形状や大きさを適宜変更す
ることにより同じくプレートメーカーの区別が容易に知
り得る〇 （６）ホトマスク製造時、特に感光工程１名称プリント
工程において正しくプレートを装着でき、決まった位置
に名称をつけることができる。(5) In addition, by appropriately changing the cut shape and size of the chamfered part, it is easy to tell the difference between the plate manufacturers. (6) When manufacturing a photomask, especially during the photosensitive process 1 name printing process, the plate is installed correctly. It is possible to assign a name to a fixed position.

以上本発明者によってなされた発明を実施例にもとづき
具体的に説明したが、本発明は上記実施例に限定される
ものではなく、その要旨を逸脱しない範囲で種々変更可
能であることはいうまでもない。Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the above Examples and can be modified in various ways without departing from the gist thereof. Nor.

〔利用分野〕[Application field]

以上の説明では主として本発明者によってなされた発明
をその背景となった利用分野である半導体装置用の角形
マスクについてウニハエ程に適用する場合について説明
したが１本発明は半導体装置製造工程前後におけるホト
マスク製造工程、ウェハ処理工程全般に利用でき、ホト
マスク検査工程でも利用できる。In the above description, the invention made by the present inventor was mainly applied to the field of application of the invention, which is a rectangular mask for semiconductor devices, to the extent of a sea urchin fly. It can be used in general manufacturing processes and wafer processing processes, and can also be used in photomask inspection processes.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明の実施例を示すホトマスクの平面図、 第２図はマスクからウェハへの転写機構の概要の一例を
示す説明図、 第３図はマスクからウェハへの転写を説明する斜視図、 第４図はマスク位置合せを説明する斜視図。 第５図は本発明ホトマスクをケースに収容している状態
を説明する斜視図である。 １・・・デバイスパターン部、２・・・クロム族、３・
・・基板種類弁別部、４・・・マスク名称部、５・・・
面取部、６・・・ホトマスク、７・・・ホトマスクステ
ージ、８・・・投影レンズ、９・・・ヘリコイド、１０
・・・ステップおよび位置合せ用ステージ、１１・・・
チャック吸着ゴム％　１２・・・ウェハ、１３・・・ウ
ェハチャック、１４・・・位置決め棒、１５・・・壁、
１６・・・位置決めピン、１７・・・ケース。 第　１　図 σ 第２図 第　４　図 第　５　図Fig. 1 is a plan view of a photomask showing an embodiment of the present invention, Fig. 2 is an explanatory diagram showing an example of an outline of a transfer mechanism from a mask to a wafer, and Fig. 3 is a perspective view illustrating transfer from a mask to a wafer. FIG. 4 is a perspective view illustrating mask alignment. FIG. 5 is a perspective view illustrating a state in which the photomask of the present invention is housed in a case. DESCRIPTION OF SYMBOLS 1...Device pattern part, 2...Chromium group, 3...
...Substrate type discrimination section, 4...Mask name section, 5...
Chamfered portion, 6... Photomask, 7... Photomask stage, 8... Projection lens, 9... Helicoid, 10
... Step and alignment stage, 11...
Chuck adsorption rubber% 12...Wafer, 13...Wafer chuck, 14...Positioning rod, 15...Wall,
16...Positioning pin, 17...Case. Figure 1 σ Figure 2 Figure 4 Figure 5

Claims (1)

【特許請求の範囲】[Claims] 半導体装置用の角形マスクにおいて、当該角形マスクの
四隅の１〜３箇所を切欠き面取部を形成して成ることを
％徴とする半導体装置用マスク。A mask for a semiconductor device, which is characterized by having chamfered portions formed at one to three of the four corners of the rectangular mask.
JP58192376A 1983-10-17 1983-10-17 Mask for semiconductor device Pending JPS6084542A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58192376A JPS6084542A (en) 1983-10-17 1983-10-17 Mask for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58192376A JPS6084542A (en) 1983-10-17 1983-10-17 Mask for semiconductor device

Publications (1)

Publication Number Publication Date
JPS6084542A true JPS6084542A (en) 1985-05-13

Family

ID=16290258

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58192376A Pending JPS6084542A (en) 1983-10-17 1983-10-17 Mask for semiconductor device

Country Status (1)

Country Link
JP (1) JPS6084542A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005085951A1 (en) * 2004-03-09 2005-09-15 Hoya Corporation Method for supporting mask manufacture, method for providing mask blank and mask blank dealing system

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005085951A1 (en) * 2004-03-09 2005-09-15 Hoya Corporation Method for supporting mask manufacture, method for providing mask blank and mask blank dealing system
JPWO2005085951A1 (en) * 2004-03-09 2007-08-09 Hoya株式会社 Mask manufacturing support method, mask blank providing method, mask blank transaction system
JP2009122708A (en) * 2004-03-09 2009-06-04 Hoya Corp Method and system for acquiring mask blank information, method for providing mask blank information, method for assisting and manufacturing transfer mask, and method for manufacturing and providing mask blank
US7660456B2 (en) 2004-03-09 2010-02-09 Hoya Corporation Mask fabrication supporting method, mask blank providing method, and mask blank dealing system
JP4503015B2 (en) * 2004-03-09 2010-07-14 Ｈｏｙａ株式会社 Mask blank information acquisition method and system, mask blank information providing method, transfer mask manufacturing support and manufacturing method, and mask blank manufacturing and providing method
US8196070B2 (en) 2004-03-09 2012-06-05 Hoya Corporation Mask fabrication supporting method, mask blank providing method, and mask blank dealing system
US8627239B2 (en) 2004-03-09 2014-01-07 Hoya Corporation Mask fabrication supporting method, mask blank providing method, and mask blank dealing system

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