JPS6079764U - Multi-cavity board - Google Patents
Multi-cavity boardInfo
- Publication number
- JPS6079764U JPS6079764U JP17244483U JP17244483U JPS6079764U JP S6079764 U JPS6079764 U JP S6079764U JP 17244483 U JP17244483 U JP 17244483U JP 17244483 U JP17244483 U JP 17244483U JP S6079764 U JPS6079764 U JP S6079764U
- Authority
- JP
- Japan
- Prior art keywords
- board
- cavity board
- cutting aid
- aid groove
- corners
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案の一実施例を示す多数個取り基板の平面
図、第２図は第１図の側面図、第３図は本考案に係るＲ
形コーナーを有するパッケージへの収納形態を示す部分
略図、−第４図は第３図との対比例であり、従来の基板
におけるＲ形コーナーを有するパッケージへの収納形態
を示す部分略図 ゛である。
１・・・多数個取り基板、２．２−１．２−２．２−３
．２−４・・・切断補助用溝、３１． ３２．３３．３
４−・・基板、３１ａ、３１ｂ、３１ｃ、３１ｄ＝
３２ａｔ ３２ｂｔ ３２ｃ、３２ｄ、３３ａｖ３
３ｂ、３３ｃ、３３ｄ、３４ａ、３４ｂ、３４ｃ、３４
ｄ・・・面取り］−ナー、４・・・パッケージ。FIG. 1 is a plan view of a multi-chip board showing an embodiment of the present invention, FIG. 2 is a side view of FIG. 1, and FIG. 3 is a R according to the present invention.
FIG. 4 is an example of comparison with FIG. 3, and is a partial schematic diagram showing how a conventional board is stored in a package having R-shaped corners. . 1...Multi-piece board, 2.2-1.2-2.2-3
．． 2-4... Cutting aid groove, 31. 32.33.3
4-...Substrate, 31a, 31b, 31c, 31d=
32at 32bt 32c, 32d, 33av3
3b, 33c, 33d, 34a, 34b, 34c, 34
d...Chamfer]-ner, 4...Package.
Claims (1)
することにより前記各基板を区分けするとともに、当該
切断補助用溝によって区分けされた前記各基板の全コー
ナーに、当該各基板の辺々に対して略４５°の面取りを
施こしたことを特徴とする多数個取り基板。Each board is divided by forming a sufficiently deep cutting aid groove on the boundary surface of each board, and the edges of each board are marked at all corners of each board separated by the cutting aid groove. A multi-chip board characterized in that each part is chamfered at approximately 45°.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17244483U JPS6079764U (en) | 1983-11-09 | 1983-11-09 | Multi-cavity board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17244483U JPS6079764U (en) | 1983-11-09 | 1983-11-09 | Multi-cavity board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6079764U true JPS6079764U (en) | 1985-06-03 |
Family
ID=30375896
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17244483U Pending JPS6079764U (en) | 1983-11-09 | 1983-11-09 | Multi-cavity board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6079764U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016195244A (en) * | 2015-03-31 | 2016-11-17 | 日立金属株式会社 | Silicon nitride based ceramic assembled board and method for manufacturing the same |
-
1983
- 1983-11-09 JP JP17244483U patent/JPS6079764U/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016195244A (en) * | 2015-03-31 | 2016-11-17 | 日立金属株式会社 | Silicon nitride based ceramic assembled board and method for manufacturing the same |
| JP2020038996A (en) * | 2015-03-31 | 2020-03-12 | 日立金属株式会社 | Silicon nitride based ceramic assembly board |
| JP2020202397A (en) * | 2015-03-31 | 2020-12-17 | 日立金属株式会社 | Manufacturing method of silicon nitride ceramic aggregate substrate |
| JP2021168424A (en) * | 2015-03-31 | 2021-10-21 | 日立金属株式会社 | Silicon nitride-based ceramic assembly substrate |
| JP2021185611A (en) * | 2015-03-31 | 2021-12-09 | 日立金属株式会社 | Silicon nitride based ceramic assembled board |
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