JPS6079716A - 半導体デバイスの製造方法 - Google Patents
半導体デバイスの製造方法Info
- Publication number
- JPS6079716A JPS6079716A JP59116746A JP11674684A JPS6079716A JP S6079716 A JPS6079716 A JP S6079716A JP 59116746 A JP59116746 A JP 59116746A JP 11674684 A JP11674684 A JP 11674684A JP S6079716 A JPS6079716 A JP S6079716A
- Authority
- JP
- Japan
- Prior art keywords
- silicon
- boron
- layer
- substrate
- diffusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10P32/171—
-
- H10D64/0111—
-
- H10P32/1408—
-
- H10P95/00—
-
- H10W20/064—
Landscapes
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US537124 | 1983-09-29 | ||
| US06/537,124 US4481046A (en) | 1983-09-29 | 1983-09-29 | Method for making diffusions into a substrate and electrical connections thereto using silicon containing rare earth hexaboride materials |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6079716A true JPS6079716A (ja) | 1985-05-07 |
| JPH0263291B2 JPH0263291B2 (cg-RX-API-DMAC10.html) | 1990-12-27 |
Family
ID=24141313
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59116746A Granted JPS6079716A (ja) | 1983-09-29 | 1984-06-08 | 半導体デバイスの製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US4481046A (cg-RX-API-DMAC10.html) |
| EP (1) | EP0162950B1 (cg-RX-API-DMAC10.html) |
| JP (1) | JPS6079716A (cg-RX-API-DMAC10.html) |
| DE (1) | DE3469108D1 (cg-RX-API-DMAC10.html) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4490193A (en) * | 1983-09-29 | 1984-12-25 | International Business Machines Corporation | Method for making diffusions into a substrate and electrical connections thereto using rare earth boride materials |
| US5086016A (en) * | 1990-10-31 | 1992-02-04 | International Business Machines Corporation | Method of making semiconductor device contact including transition metal-compound dopant source |
| US20040016401A1 (en) * | 2002-07-26 | 2004-01-29 | Metal Oxide Technologies, Inc. | Method and apparatus for forming superconductor material on a tape substrate |
| US20040023810A1 (en) * | 2002-07-26 | 2004-02-05 | Alex Ignatiev | Superconductor material on a tape substrate |
| US20040020430A1 (en) * | 2002-07-26 | 2004-02-05 | Metal Oxide Technologies, Inc. | Method and apparatus for forming a thin film on a tape substrate |
| AU2010239265B2 (en) | 2009-04-21 | 2014-06-05 | Tetrasun, Inc. | High-efficiency solar cell structures and methods of manufacture |
| EP2553735B1 (en) * | 2010-03-26 | 2017-11-15 | Tetrasun, Inc. | Shielded electrical contact and doping through a passivating dielectric layer in a high-efficiency crystalline solar cell, including structure and methods of manufacture |
| US10068981B2 (en) | 2016-03-02 | 2018-09-04 | Lam Research Corporation | Rare earth metal surface-activated plasma doping on semiconductor substrates |
| EP3579284A1 (en) * | 2018-06-08 | 2019-12-11 | Total SA | Method to obtain a photovoltaic device |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3340108A (en) * | 1963-07-09 | 1967-09-05 | Semi Elements Inc | Laser materials |
| US3601888A (en) * | 1969-04-25 | 1971-08-31 | Gen Electric | Semiconductor fabrication technique and devices formed thereby utilizing a doped metal conductor |
| JPS567304B2 (cg-RX-API-DMAC10.html) * | 1972-08-28 | 1981-02-17 | ||
| US4180596A (en) * | 1977-06-30 | 1979-12-25 | International Business Machines Corporation | Method for providing a metal silicide layer on a substrate |
| US4329706A (en) * | 1979-03-01 | 1982-05-11 | International Business Machines Corporation | Doped polysilicon silicide semiconductor integrated circuit interconnections |
| US4364166A (en) * | 1979-03-01 | 1982-12-21 | International Business Machines Corporation | Semiconductor integrated circuit interconnections |
| US4227944A (en) * | 1979-06-11 | 1980-10-14 | General Electric Company | Methods of making composite conductive structures in integrated circuits |
| US4245796A (en) * | 1979-06-15 | 1981-01-20 | Chromalloy American Corporation | System for handling flexible sheet rolls |
| US4389255A (en) * | 1980-01-14 | 1983-06-21 | Burroughs Corporation | Method of forming buried collector for bipolar transistor in a semiconductor by selective implantation of poly-si followed by oxidation and etch-off |
| US4285761A (en) * | 1980-06-30 | 1981-08-25 | International Business Machines Corporation | Process for selectively forming refractory metal silicide layers on semiconductor devices |
| US4378628A (en) * | 1981-08-27 | 1983-04-05 | Bell Telephone Laboratories, Incorporated | Cobalt silicide metallization for semiconductor integrated circuits |
-
1983
- 1983-09-29 US US06/537,124 patent/US4481046A/en not_active Expired - Lifetime
-
1984
- 1984-06-08 JP JP59116746A patent/JPS6079716A/ja active Granted
- 1984-09-21 DE DE8484111288T patent/DE3469108D1/de not_active Expired
- 1984-09-21 EP EP84111288A patent/EP0162950B1/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| US4481046A (en) | 1984-11-06 |
| DE3469108D1 (en) | 1988-03-03 |
| EP0162950A1 (en) | 1985-12-04 |
| EP0162950B1 (en) | 1988-01-27 |
| JPH0263291B2 (cg-RX-API-DMAC10.html) | 1990-12-27 |
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