JPS6077148A - Method for working glass substrate - Google Patents

Method for working glass substrate

Info

Publication number
JPS6077148A
JPS6077148A JP18354583A JP18354583A JPS6077148A JP S6077148 A JPS6077148 A JP S6077148A JP 18354583 A JP18354583 A JP 18354583A JP 18354583 A JP18354583 A JP 18354583A JP S6077148 A JPS6077148 A JP S6077148A
Authority
JP
Japan
Prior art keywords
glass substrate
resin
vinyl acetate
ethylene
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18354583A
Other languages
Japanese (ja)
Inventor
Yoshio Maeda
佳男 前田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hoya Corp
Original Assignee
Hoya Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoya Corp filed Critical Hoya Corp
Priority to JP18354583A priority Critical patent/JPS6077148A/en
Publication of JPS6077148A publication Critical patent/JPS6077148A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To make it possible to carry out chemical etching of only the end of a glass substrate with ease, by applying an ethylene-vinyl acetate based hot-melt resin having the acid resistance to at least one principal surface of the glass substrate. CONSTITUTION:A soda lime based glass substrate 1 which is worked into a given shape and has just a roughly ground end 2 is heated in an oven at about 90 deg.C, taken out thereof, and a resin 3 consisting essentially of rosin and beeswax as an ethylene-vinyl acetate based hot-melt type resin is rubbed against both principal surfaces under high temperature conditions, melted and applied thereto. The resultant substrate 1 is then dipped in a chemical etching solution prepared by mixing about 3% hydrofluoric acid with about 56% sulfuric acid for about 2min to give the end 2 of the glass substrate 1 a smooth end 4. The resultant substrate 1 is washed, dried and dipped in an organic solvent, e.g. trichloroethylene, for about 5min to peel the resin 3 therefrom.

Description

【発明の詳細な説明】 本発明は、半導体集積回路のフォトマスク、アモルファ
スシリコン太陽電池、エレクトロルミネセンス素子等に
使用されるソーダライム系ガラス、ボロシリケート系ガ
ラス、溶融石′li等におCプる電子デバイス用ガラス
基板の加工方法に関づる。
DETAILED DESCRIPTION OF THE INVENTION The present invention provides a method for applying carbon to soda lime glass, borosilicate glass, molten stone, etc. used in photomasks of semiconductor integrated circuits, amorphous silicon solar cells, electroluminescent devices, etc. Related to processing methods for glass substrates for electronic devices.

このガラス基板は、端面エツジからガラスチップが欠け
た場合、そのガラス基板の主表面(通常、その主表面に
は厳しい平面精度が請求され(いる。
If the glass chip is chipped from the edge of the glass substrate, the main surface of the glass substrate (normally, the main surface requires strict flatness accuracy).

)又はその主表面に成膜した全屈薄膜にキズを発生させ
ることから、その発生を防止するために、各端面を研摩
加工することにより鏡面状に仕−1二げる加工方法が知
られている。
) or scratches on the fully refracted thin film formed on its main surface.In order to prevent this from occurring, a processing method is known in which each end face is polished to give it a mirror finish. ing.

しかしながら、このようなガラス基板の加工方法は、4
つの端面をそれぞれ粗研摩から精研摩までの数段階の研
摩工程を経て行われることから、生産性の低下を余儀な
くされていたし、また、端面を鏡面状まで仕上げている
ことから、ハンドリングの作業性を低下させていた。
However, this method of processing glass substrates is
As each end face undergoes several stages of polishing from rough polishing to fine polishing, productivity is unavoidably reduced.Furthermore, since the end faces are finished to a mirror finish, handling efficiency is reduced. was decreasing.

一方、ガラス基板の全面を化学エラチンブザる加工方法
が知られているが、同方法によれば、自主表面も化学エ
ツチングされることから、その自主表面の平面精度を茗
しく悪化させてしまい、1ッチング後に、成膜される少
なくとも一生表面を1jll摩しなければならない。
On the other hand, there is a known processing method in which the entire surface of a glass substrate is chemically etched, but since the free-standing surface is also chemically etched, the flatness of the free-standing surface is seriously deteriorated. After etching, the surface to be coated must be rubbed by at least 100 mm.

本発明は、上記した欠点を除去′するためになされたも
のであり、端面のみを容易に化学エツチングづることの
できるガラス基板の加工方法を提供することである。
The present invention has been made in order to eliminate the above-mentioned drawbacks, and it is an object of the present invention to provide a method for processing a glass substrate in which only the end face can be easily chemically etched.

本発明の主構成は、カラス基板の少なくとも−1表面上
に耐酸性を右するエチレン酢酸ビニル系のホットメルト
型樹脂を塗布する工程と、前記ガラス基板の端面を化学
エツチングする工程と、前記ホラ1−メルl〜型樹脂を
有放溶剤に浸漬して剥部する]二程とから成る。
The main components of the present invention include a step of applying an ethylene-vinyl acetate-based hot-melt resin having acid resistance on at least the -1 surface of a glass substrate, a step of chemically etching the end surface of the glass substrate, and a step of chemically etching the end surface of the glass substrate. The process consists of two steps: immersing a 1-Mel type resin in a released solvent and peeling it off.

以下、実施例図面を参照して本発明の詳細な説明する。Hereinafter, the present invention will be described in detail with reference to the drawings.

第′1図は、本発明による一実施例の工程を示す斜視図
である。本例では、同図(a)において、ソーグライム
系のカラス基板1(大きさ: 127mm角、厚さ2.
3Tnm)が所定形状に加工され、その4つの端面2は
相?iIl摩まで施されている。次に、同図(1))に
おいて、ガラス基板1を約90℃のオーブンに設置して
高温加熱し、Δ−ブンから取り出された高温状態のガラ
ス基板1の両生面上に、エチレン酢酸ビニル系の小ソト
メル1−型樹脂とし【ロジン及びミツロウを主成分とづ
る樹脂3をこJることにより溶融して塗イIJりる。そ
の際、溶融した樹脂3がエツジを超えて端面にまでイー
1着しないために、エツジから3〜10 Ill II
+程度中心部寄りにd)って樹脂3をこすることが好ま
しい。なお、樹脂3が端面にまで41着した場合に&J
、での端面をイ1i等でふいて、その部分の樹脂を除去
すればよい。
FIG. 1 is a perspective view showing the steps of an embodiment of the present invention. In this example, in the same figure (a), a saw lime-based glass substrate 1 (size: 127 mm square, thickness 2.
3Tnm) is processed into a predetermined shape, and its four end surfaces 2 are phase ? Even the polish has been applied. Next, in (1) of the same figure, the glass substrate 1 is placed in an oven at about 90°C and heated to a high temperature, and ethylene vinyl acetate is placed on both sides of the glass substrate 1 in the high temperature state taken out from the Δ-bun. A small sotomel 1-type resin of the system is melted and applied by pouring resin 3 whose main components are rosin and beeswax. At that time, in order to prevent the molten resin 3 from exceeding the edge and reaching the end surface, 3 to 10 Ill II
It is preferable to rub the resin 3 by + degree d) toward the center. In addition, when the resin 3 reaches the end surface, &J
, and the like, to remove the resin in that area.

次に、同図(C)において、3 ?p(1)%のフッ酸
と56重量%の硫酸を混合した化学エツチング液にカラ
ス基板1を2分間浸漬して、ガラス基IJi2 ’1の
端面を平滑状の端面4にづる。次に、ガラス基板1を洗
浄・乾燥した後、i〜リクl:Iル」−チレン液等の有
機溶剤に5分間浸漬し、同図(d)に承りように両生面
上の樹脂33を刺部1りる。
Next, in the same figure (C), 3? The glass substrate 1 is immersed for 2 minutes in a chemical etching solution containing a mixture of p(1)% hydrofluoric acid and 56% by weight sulfuric acid, so that the end face of the glass substrate IJi2'1 is formed into a smooth end face 4. Next, after cleaning and drying the glass substrate 1, it is immersed in an organic solvent such as a tyrene solution for 5 minutes to remove the resin 33 on the bibulous surface as shown in FIG. Thorn part 1 ruru.

上記ガラス基板1の一生表mjに対づる精411摩は、
本発明による工程の前でt)iU ’−C’も」;いか
、いり゛れにせよ、その−主表面は法王■?と()て成
膜される前にm jJI FJ ’lることに4する。
The fine 411 machining for the lifetime surface mj of the glass substrate 1 is as follows:
Before the process according to the invention, t)iU '-C' is also present; in any case, is its -main surface ?? 4. Before the film is formed using (),

そして、本発明の工程を経たガラス基板1の−1表面上
にクロム等の金属薄膜をスパッタリング法等により成膜
した場合、−でのクロム薄膜のピンホールを、従来(端
面に化学上ツヂングを施さない従来品)’1cm2中に
’l、−′10個程度であったのに対してi/100個
稈瓜、j、て減少することがでさた。また、本発明によ
れば、ガラス基板の主表面は化学エツチングさ4′tて
いないことから、その主表面を精研摩した後に、本発明
に、j、る工程を実施しても、その主表面の平面II′
1度を悪化することはない。更に、本発明によるガラス
リ板は、その端面が微視的には非常に滑らかな表面とづ
ることができ、巨視的には鏡面ではないので、ハンドリ
ングの際の作業性を向」:さU、成膜及びレジストコー
ト等の製造工程においC自動搬送づることができる。
When a metal thin film such as chromium is formed by sputtering or the like on the −1 surface of the glass substrate 1 that has undergone the process of the present invention, the pinholes in the chromium thin film at −1 are removed by conventional methods (chemical tweezing on the end surface). (Conventional product that does not apply) There were about 10 culms in 1 cm2, but the number was reduced by 1/100 culms. Further, according to the present invention, since the main surface of the glass substrate is not chemically etched, even if the main surface is finely polished and then the steps of the present invention are performed, the main surface is not chemically etched. Surface plane II'
It will not make the first degree worse. Furthermore, the edge surface of the glass plate according to the present invention can be described as a very smooth surface microscopically, but not a mirror surface macroscopically, which improves workability during handling. C can be automatically transported during manufacturing processes such as film formation and resist coating.

第2図は、本発明による他の一実施例で8’rる工程を
示づr1視図である。本例では、同図(a )にJ3い
て、樹脂3を加だ1溶融した容器中にガラス基板1を浸
し、イのカラス基板1の全表面に樹脂3を塗布する。次
に、同図(1))において、カラス基板1の端面2部分
に塗イriされた4う4脂3をラッピング加工により剥
部し、必要に応じて面取りラッピングを行う。次に、同
図(C)において、前実施例と同様、端面3を化学上ツ
ブングにJ、り平d′I状の端面4にする。そして、同
図(d)におい(も前実施例と同様、カラス基板1の両
主面」二の樹n旨3を有機溶剤に浸漬して3り端ブる。
FIG. 2 is a view from r1 showing the step 8'r in another embodiment of the present invention. In this example, the glass substrate 1 is immersed in a container in which resin 3 is melted at J3 in FIG. Next, in (1) of the same figure, the 4-piece resin 3 coated on the end surface 2 portion of the glass substrate 1 is peeled off by lapping, and chamfer lapping is performed if necessary. Next, in the same figure (C), as in the previous embodiment, the end surface 3 is chemically rounded to J, and the end surface 4 is made into a flat d'I shape. Then, as shown in FIG. 3(d), both main surfaces of the glass substrate 1 are immersed in an organic solvent and removed as in the previous embodiment.

本実施例においても、前実施例と同様な効果を秦づる1
In this example as well, the same effect as in the previous example is achieved.

【図面の簡単な説明】[Brief explanation of drawings]

第1図及び第2図はぞれそ゛れ本発明にJ、る一実施例
の工程を示iI斜視図である。
FIGS. 1 and 2 are perspective views showing steps of an embodiment of the present invention, respectively.

Claims (2)

【特許請求の範囲】[Claims] (1) ガラス基板の少なくともコニ表面上に耐酸性を
有づるエチレン酢酸ビニル系のホットメルト型樹脂を塗
布する工程と、前記ガラス基板の端面を化学エツチング
する工程と、前記ホットメルト型樹脂を有機溶剤に浸漬
して剥離する工程を含むことを特徴とするガラス基板の
加工方法。
(1) A step of applying an acid-resistant ethylene-vinyl acetate hot-melt resin on at least the surface of the glass substrate, a step of chemically etching the end surface of the glass substrate, and a step of applying an organic hot-melt resin to the glass substrate. A method for processing a glass substrate, comprising a step of immersing it in a solvent and peeling it off.
(2) ガラス基板の全表面上に耐酸性を右するコーヂ
レン酢酸ビニル系のホットメルト型樹脂を塗布する工程
と、前記ガラス基板の端面に塗布された前記ホットメル
ト型樹脂を剥離した後、前記端面を化学エツチングする
工程と、前記ホットメルト型樹脂を有機溶剤に浸漬して
剥離する工程を含むことを特徴とするガラス基板の加工
方法。
(2) The step of applying a cordylene vinyl acetate-based hot melt resin that has acid resistance on the entire surface of the glass substrate, and the step of peeling off the hot melt resin applied to the end surface of the glass substrate; A method for processing a glass substrate, comprising the steps of chemically etching the end face and peeling off the hot-melt resin by immersing it in an organic solvent.
JP18354583A 1983-09-30 1983-09-30 Method for working glass substrate Pending JPS6077148A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18354583A JPS6077148A (en) 1983-09-30 1983-09-30 Method for working glass substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18354583A JPS6077148A (en) 1983-09-30 1983-09-30 Method for working glass substrate

Publications (1)

Publication Number Publication Date
JPS6077148A true JPS6077148A (en) 1985-05-01

Family

ID=16137683

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18354583A Pending JPS6077148A (en) 1983-09-30 1983-09-30 Method for working glass substrate

Country Status (1)

Country Link
JP (1) JPS6077148A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6486341A (en) * 1987-09-29 1989-03-31 Sharp Kk Optical disk
CN100432772C (en) * 2002-11-22 2008-11-12 西山不锈化学股份有限公司 Glass substrate for plane display device and mfg method thereof
JP2013252992A (en) * 2012-06-07 2013-12-19 Nippon Electric Glass Co Ltd Dielectric multilayer film, glass plate with dielectric multilayer film and method for producing glass plate with dielectric multilayer film
JP2016028002A (en) * 2014-07-11 2016-02-25 東京応化工業株式会社 Method for processing glass, glass etching solution, and glass substrate

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5425A (en) * 1977-06-03 1979-01-05 Hitachi Ltd Method of chamfering glass substrate
JPS56160384A (en) * 1980-05-08 1981-12-10 Shiyouichi Sakai Method of carving porcelain, glass, marble or like

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5425A (en) * 1977-06-03 1979-01-05 Hitachi Ltd Method of chamfering glass substrate
JPS56160384A (en) * 1980-05-08 1981-12-10 Shiyouichi Sakai Method of carving porcelain, glass, marble or like

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6486341A (en) * 1987-09-29 1989-03-31 Sharp Kk Optical disk
JP2506123B2 (en) * 1987-09-29 1996-06-12 シャープ株式会社 optical disk
CN100432772C (en) * 2002-11-22 2008-11-12 西山不锈化学股份有限公司 Glass substrate for plane display device and mfg method thereof
JP2013252992A (en) * 2012-06-07 2013-12-19 Nippon Electric Glass Co Ltd Dielectric multilayer film, glass plate with dielectric multilayer film and method for producing glass plate with dielectric multilayer film
JP2016028002A (en) * 2014-07-11 2016-02-25 東京応化工業株式会社 Method for processing glass, glass etching solution, and glass substrate

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