JPS6074457A - 半導体プラスチツクパツケ−ジ - Google Patents

半導体プラスチツクパツケ−ジ

Info

Publication number
JPS6074457A
JPS6074457A JP59063358A JP6335884A JPS6074457A JP S6074457 A JPS6074457 A JP S6074457A JP 59063358 A JP59063358 A JP 59063358A JP 6335884 A JP6335884 A JP 6335884A JP S6074457 A JPS6074457 A JP S6074457A
Authority
JP
Japan
Prior art keywords
semiconductor
resin
mold
lead frame
cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59063358A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6126225B2 (cs
Inventor
Aizo Kaneda
金田　愛三
Shigeharu Tsunoda
重晴 角田
Keizo Otsuki
大槻　桂三
Takashi Nakagawa
隆 中川
Masayoshi Aoki
正義 青木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP59063358A priority Critical patent/JPS6074457A/ja
Publication of JPS6074457A publication Critical patent/JPS6074457A/ja
Publication of JPS6126225B2 publication Critical patent/JPS6126225B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/37—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings
    • B29C45/372—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings provided with means for marking or patterning, e.g. numbering articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP59063358A 1984-04-02 1984-04-02 半導体プラスチツクパツケ−ジ Granted JPS6074457A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59063358A JPS6074457A (ja) 1984-04-02 1984-04-02 半導体プラスチツクパツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59063358A JPS6074457A (ja) 1984-04-02 1984-04-02 半導体プラスチツクパツケ−ジ

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP54029379A Division JPS5831293B2 (ja) 1979-03-15 1979-03-15 インサ−ト樹脂封止用成形金型

Publications (2)

Publication Number Publication Date
JPS6074457A true JPS6074457A (ja) 1985-04-26
JPS6126225B2 JPS6126225B2 (cs) 1986-06-19

Family

ID=13226946

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59063358A Granted JPS6074457A (ja) 1984-04-02 1984-04-02 半導体プラスチツクパツケ−ジ

Country Status (1)

Country Link
JP (1) JPS6074457A (cs)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5077464U (cs) * 1973-11-19 1975-07-05
JPS50103791A (cs) * 1974-01-23 1975-08-16
JPS5110701U (cs) * 1974-07-13 1976-01-26
JPS5163866A (ja) * 1975-10-23 1976-06-02 Mitsubishi Electric Corp Shashutsuseikeiyokanagatanoseizohoho
JPS5270165U (cs) * 1975-11-18 1977-05-25
JPS5414661U (cs) * 1977-07-01 1979-01-30

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5077464U (cs) * 1973-11-19 1975-07-05
JPS50103791A (cs) * 1974-01-23 1975-08-16
JPS5110701U (cs) * 1974-07-13 1976-01-26
JPS5163866A (ja) * 1975-10-23 1976-06-02 Mitsubishi Electric Corp Shashutsuseikeiyokanagatanoseizohoho
JPS5270165U (cs) * 1975-11-18 1977-05-25
JPS5414661U (cs) * 1977-07-01 1979-01-30

Also Published As

Publication number Publication date
JPS6126225B2 (cs) 1986-06-19

Similar Documents

Publication Publication Date Title
US2491147A (en) Method of making denture base parts and applying artificial teeth thereto
TWI263518B (en) Manufacturing method for golf club head and wax pattern thereof
JPS6074457A (ja) 半導体プラスチツクパツケ−ジ
JPS5831293B2 (ja) インサ−ト樹脂封止用成形金型
JPS6074446A (ja) 半導体プラスチツクパツケ−ジの製造方法
JPS624862B2 (cs)
US2934823A (en) Denture and method of making same
US1033489A (en) Art of making wax patterns for castings for dental work.
JPS58217313A (ja) 樹脂モ−ルド方法
JPH10272655A (ja) 樹脂封止型
JPS607484Y2 (ja) 電子部品の樹脂モ−ルド装置
JPH09181104A (ja) 半導体樹脂封止用金型およびその表面処理方法
JPS6135920A (ja) 樹脂モ−ルド方法
TWI258417B (en) Method for forming a shoe mold
JPS59101842A (ja) 樹脂封止用金型
JP2502387B2 (ja) 半導体素子の樹脂封止方法及び樹脂封止金型
JPS6036100B2 (ja) 超硬モ−ルド型
US125979A (en) Improvement in modes of attaching pyroxyline base to artificial teeth
JPS63110645A (ja) 半導体装置の製造方法
JPS60121728A (ja) 半導体装置用樹脂封止金型
JPH05114672A (ja) モールデイング用金型
JP2766489B2 (ja) エポキシボンディング用成形型
JPH0142690B2 (cs)
JPH049142Y2 (cs)
JPH09107051A (ja) 樹脂モールド半導体素子及びその製造方法