JPS6073241U - 半導体ウェハーのバンプめっき装置 - Google Patents
半導体ウェハーのバンプめっき装置Info
- Publication number
- JPS6073241U JPS6073241U JP16508183U JP16508183U JPS6073241U JP S6073241 U JPS6073241 U JP S6073241U JP 16508183 U JP16508183 U JP 16508183U JP 16508183 U JP16508183 U JP 16508183U JP S6073241 U JPS6073241 U JP S6073241U
- Authority
- JP
- Japan
- Prior art keywords
- plating
- semiconductor wafer
- plating equipment
- semiconductor wafers
- wafer bump
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title claims description 12
- 239000004065 semiconductor Substances 0.000 title claims description 6
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 claims 3
- 239000007788 liquid Substances 0.000 claims 2
- 238000007664 blowing Methods 0.000 claims 1
- 239000007921 spray Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16508183U JPS6073241U (ja) | 1983-10-25 | 1983-10-25 | 半導体ウェハーのバンプめっき装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16508183U JPS6073241U (ja) | 1983-10-25 | 1983-10-25 | 半導体ウェハーのバンプめっき装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6073241U true JPS6073241U (ja) | 1985-05-23 |
| JPS6350852Y2 JPS6350852Y2 (enrdf_load_stackoverflow) | 1988-12-27 |
Family
ID=30361752
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16508183U Granted JPS6073241U (ja) | 1983-10-25 | 1983-10-25 | 半導体ウェハーのバンプめっき装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6073241U (enrdf_load_stackoverflow) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5443974U (enrdf_load_stackoverflow) * | 1977-09-01 | 1979-03-26 |
-
1983
- 1983-10-25 JP JP16508183U patent/JPS6073241U/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5443974U (enrdf_load_stackoverflow) * | 1977-09-01 | 1979-03-26 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6350852Y2 (enrdf_load_stackoverflow) | 1988-12-27 |
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