JPS6072292A - Controller - Google Patents
ControllerInfo
- Publication number
- JPS6072292A JPS6072292A JP18166083A JP18166083A JPS6072292A JP S6072292 A JPS6072292 A JP S6072292A JP 18166083 A JP18166083 A JP 18166083A JP 18166083 A JP18166083 A JP 18166083A JP S6072292 A JPS6072292 A JP S6072292A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- moisture
- proof resin
- printed wiring
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、一般家庭において使用する洗濯機や乾燥機、
食器洗い機などの制御装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention is applicable to washing machines and dryers used in general households;
It relates to control devices such as dishwashers.
従来例の構成とその問題点
従来、この種の制御装置としては、第１図及Ｏ第２図に
示すように、第１の電子部品（１）が印刷配線板（２）
にハンダ（３）で実装され、そ°の表面を印刷配線板（
２）に層着した防湿樹脂（４）によυ被覆された構造の
ものが一般的に知られている。Conventional Structure and Problems Conventionally, in this type of control device, as shown in Figs. 1 and 2, the first electronic component (1) is connected to a printed wiring board (2).
The surface is mounted on the printed circuit board (3) using solder (3).
2) is generally known to have a structure covered with a moisture-proof resin (4) layered thereon.
しかし表からこのような構造によれば、防湿樹脂被覆層
が第１の電子部品（１）の端子（１ａ）（１ａ）の部分
で薄くなるために、印加される電圧の高さによっては防
湿樹脂を介して漏れ電流が発生し、制御装置が誤動作す
る恐れがあるという問題があった。However, according to the structure shown in the table, since the moisture-proof resin coating layer becomes thinner at the terminals (1a) (1a) of the first electronic component (1), the moisture-proof resin coating layer becomes thinner at the terminals (1a) (1a) of the first electronic component (1). There was a problem in that leakage current was generated through the resin, which could cause the control device to malfunction.
発明の目的
本発明はこのような問題点をなくすために、端子部分を
含めた第１の電子部品を充分な層厚の防湿樹脂で被覆し
た構造にして耐湿性能の向上を図った制御装置を提供す
るものである。Purpose of the Invention In order to eliminate such problems, the present invention provides a control device in which the first electronic component including the terminal portion is coated with a sufficiently thick layer of moisture-proof resin to improve moisture resistance. This is what we provide.
発明の構成
前記目的を達成するために本考案の制御装置は、印刷配
線板上に第１の電子部品と、下面側にこの第１の電子部
品を収納できる空間を有する形状に形成された第２の電
子部品とを実装すると共に第： １の電子部品を防湿樹
脂で被覆し且つその防湿樹脂が表面張力によシ前記第２
の電子部品の下面に １付着して第１の電子部品を包含
する樹脂膜を形成するように前記印刷配線板と第２の電
子部品との間に所定の間隔を設けたものであり、第１及
び第２の電子部品と印刷配線板との配設距離関係によっ
て防湿樹脂の表面張力を利用し、第１の電子部品を被覆
する防湿樹脂の膜厚が第１の電子部のみを印刷配線板に
実装した場合に形成される防湿樹脂の膜厚よシ厚くした
ものである。Structure of the Invention In order to achieve the above-mentioned object, the control device of the present invention includes a first electronic component on a printed wiring board, and a first electronic component formed in a shape having a space on the lower surface side in which the first electronic component can be accommodated. 2. At the same time, the first electronic component is covered with a moisture-proof resin, and the moisture-proof resin acts on the surface tension of the second electronic component.
A predetermined interval is provided between the printed wiring board and the second electronic component so that the first electronic component is adhered to the bottom surface of the second electronic component to form a resin film that includes the first electronic component. The surface tension of the moisture-proof resin is utilized depending on the distance relationship between the first and second electronic components and the printed wiring board, and the film thickness of the moisture-proof resin covering the first electronic component is reduced so that only the first electronic part is printed wiring. This is made thicker than the moisture-proof resin film that is formed when mounted on a board.
実施例の説明 以下、添付図面に基いて本発明の一実施例を説明する。Description of examples Hereinafter, one embodiment of the present invention will be described based on the accompanying drawings.
（１）は低粒器、ダイオード等の第１の電子部品で、印
刷配線板（２）にその端子（１ａＸ１ａ）を挿着し、印
刷配線板（２）の下面においてハンダ（３）で固着する
ことによシ印刷配線板（２）上に実装されである。(1) is the first electronic component such as a low particle size converter or diode, and its terminal (1aX1a) is inserted into the printed wiring board (2) and fixed with solder (3) on the bottom surface of the printed wiring board (2). By doing so, it is mounted on a printed wiring board (2).
（５）はスイッチ、トランス等の第２の電子部品で、第
３図に示すよう忙、その下面四方に脚片（６）を一体に
設けて下面側に第１の電子部品（１）の収納可能なを間
を有していると共に第１の電子部品（１）と第２の電子
部品（５）との間には、防湿樹脂（４）を施す際に、８
５図に示すように防湿樹脂（４Ｃ）が詔２の電子部品（
５）の下面に接した状態となって防湿樹脂（４）の表面
張力で乾燥後もその状態で残存する時間（７）を有する
ものである。(5) is a second electronic component such as a switch, a transformer, etc., as shown in Fig. 3. Leg pieces (6) are integrally provided on all sides of the lower surface of the second electronic component (1), and the first electronic component (1) is mounted on the lower surface side. When applying the moisture-proof resin (4) between the first electronic component (1) and the second electronic component (5), there is a gap between the first electronic component (1) and the second electronic component (5).
As shown in Figure 5, moisture-proof resin (4C) is used for electronic parts (Regulation 2).
5) and remains in that state even after drying due to the surface tension of the moisture-proof resin (4) (7).
この第２の電子部品（５）を第１の電子部品（１）に被
せるようにして印刷配線板（２）上に配設し、その端子
を印刷配線板（２）にハンダ付けして実装してあり、第
１の電子部品（１）の端子（１ａＸ ｌａ）近傍部＋１
第２の電子部品（５）の下面に表面張力によって付着し
た前記防湿樹脂（４Ｃ）Ｋよって厚い防湿樹脂（４ａＸ
４ｂ）の膜層が形成されているものである。This second electronic component (5) is placed on the printed wiring board (2) so as to cover the first electronic component (1), and its terminals are soldered to the printed wiring board (2) for mounting. and the vicinity of the terminal (1aX la) of the first electronic component (1) +1
The thick moisture-proof resin (4aX)
The film layer 4b) is formed.
このような構造により、第１の電子部品（１）の端子（
１ａＸ１ａ）部分を包含する防湿樹脂（４ａ）（４１）
） ノ厚さが大となるので、漏れ電流を減少させること
ができる。With such a structure, the terminal (
Moisture-proof resin (4a) (41) including portion 1aX1a)
) Since the thickness is increased, leakage current can be reduced.
なお、上記実施例においては、制御装置の一部を示して
いるが、端子に印加される電圧が低くて漏れ電流による
誤動作の恐れのない部分については上記構造にする必要
はなく、要は、防湿樹脂の性能を確実に発揮させる必要
のある部分を上記構造にすればよい。Although a part of the control device is shown in the above embodiment, it is not necessary to use the above structure for parts where the voltage applied to the terminal is low and there is no risk of malfunction due to leakage current. The above structure may be applied to the portions where the moisture-proof resin needs to exhibit its performance reliably.
発明の効果
以上のように本発明の制御装置は、第１の電子部品を第
２の電子部品の下方に配設して両室子部品間の隙間部に
防湿樹脂をその表面張力で第２の電子部品の下面忙付着
した状態にし、この防湿樹脂によシ第１の電子部品を被
覆させているので、防湿樹脂の厚さを充分に確保でき、
印加される電圧が高い場合や湿度の高い雰囲気での使用
においても漏れ電流の発生を防止することができるもの
であυ、従って、制御装置の耐湿性能の向上を図り、誤
動作の発生をなくすことができるものである。Effects of the Invention As described above, in the control device of the present invention, the first electronic component is disposed below the second electronic component, and the moisture-proof resin is applied to the second electronic component in the gap between the two chamber components using its surface tension. Since the first electronic component is covered with this moisture-proof resin, a sufficient thickness of the moisture-proof resin can be ensured.
It is possible to prevent the occurrence of leakage current even when the applied voltage is high or when used in a humid atmosphere.Therefore, it is possible to improve the moisture resistance of the control device and eliminate the occurrence of malfunctions. It is something that can be done.
第１図は従来の制御装置の電子部品の実装例を示す縦断
正面図、第２図はその縦断側面図、第６図は本発明実施
例における第２の電子部品の斜視図、第４図は本発明の
一実施例を示す制御装置の縦断正面図、第５図はその縦
断側面図である。
（１）は第１の電子部品、（２）は印刷配線板、（４）
は防湿樹脂、（５）は第２の電子部品、（７）は隙間部
。FIG. 1 is a longitudinal sectional front view showing an example of mounting electronic components of a conventional control device, FIG. 2 is a longitudinal sectional side view thereof, FIG. 6 is a perspective view of a second electronic component in an embodiment of the present invention, and FIG. 4 5 is a longitudinal sectional front view of a control device showing one embodiment of the present invention, and FIG. 5 is a longitudinal sectional side view thereof. (1) is the first electronic component, (2) is the printed wiring board, (4)
(5) is the moisture-proof resin, (5) is the second electronic component, and (7) is the gap.
Claims (1)
１の電子部品を収納できる空間を有する形状に形成され
た第２の電子部品とを実装すると共に第１の電子部品を
防湿樹脂で被覆し且つその防湿樹脂が表面張力により前
記第２の電子部品の下面に付着して第１の電子部品を包
含する樹月旨膜を形成するよう罠前記印刷配線板と第２
の電子音す品との間に所定の間隔を設けてなる制御装置
。Mounting a first electronic component on a printed wiring board and a second electronic component formed in a shape having a space on the bottom surface (j) that can accommodate the first electronic component; The printed wiring board and the second electronic component are coated with a moisture-proofing resin, and the moisture-proofing resin adheres to the lower surface of the second electronic component due to surface tension to form a protective film surrounding the first electronic component.
A control device in which a predetermined distance is provided between the electronic sound device and the electronic sound device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18166083A JPS6072292A (en) | 1983-09-28 | 1983-09-28 | Controller |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18166083A JPS6072292A (en) | 1983-09-28 | 1983-09-28 | Controller |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6072292A true JPS6072292A (en) | 1985-04-24 |
Family
ID=16104632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18166083A Pending JPS6072292A (en) | 1983-09-28 | 1983-09-28 | Controller |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6072292A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6232693A (en) * | 1985-08-03 | 1987-02-12 | 株式会社 ニフコ | Mounting of circuit part to printed circuit board |
| EP3928676A4 (en) * | 2019-02-18 | 2022-11-30 | LG Electronics Inc. | Dishwasher |
-
1983
- 1983-09-28 JP JP18166083A patent/JPS6072292A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6232693A (en) * | 1985-08-03 | 1987-02-12 | 株式会社 ニフコ | Mounting of circuit part to printed circuit board |
| EP3928676A4 (en) * | 2019-02-18 | 2022-11-30 | LG Electronics Inc. | Dishwasher |
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