JPS6066441A - ワイヤボンダ用ツ−ル - Google Patents
ワイヤボンダ用ツ−ルInfo
- Publication number
- JPS6066441A JPS6066441A JP58174198A JP17419883A JPS6066441A JP S6066441 A JPS6066441 A JP S6066441A JP 58174198 A JP58174198 A JP 58174198A JP 17419883 A JP17419883 A JP 17419883A JP S6066441 A JPS6066441 A JP S6066441A
- Authority
- JP
- Japan
- Prior art keywords
- tool
- wire
- harder
- wires
- life
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims abstract description 12
- 238000005299 abrasion Methods 0.000 abstract 2
- 150000002500 ions Chemical class 0.000 abstract 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58174198A JPS6066441A (ja) | 1983-09-22 | 1983-09-22 | ワイヤボンダ用ツ−ル |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58174198A JPS6066441A (ja) | 1983-09-22 | 1983-09-22 | ワイヤボンダ用ツ−ル |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6066441A true JPS6066441A (ja) | 1985-04-16 |
| JPH0154857B2 JPH0154857B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-11-21 |
Family
ID=15974436
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58174198A Granted JPS6066441A (ja) | 1983-09-22 | 1983-09-22 | ワイヤボンダ用ツ−ル |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6066441A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
-
1983
- 1983-09-22 JP JP58174198A patent/JPS6066441A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0154857B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-11-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3627192A (en) | Wire lead bonding tool | |
| US4571184A (en) | Implement for abrasion | |
| US20080272176A1 (en) | Wedge-bonding of wires in electronic device manufacture with reversible wedge bonding | |
| KR930003533B1 (ko) | 절단용 공구 | |
| EP1066901A3 (en) | Tool for chip removing machining | |
| ES2100355T3 (es) | Proceso para la produccion de una aleacion que tiene particulas duras comprendiendo carburo de titanio. | |
| CN210296301U (zh) | 一种键合用劈刀 | |
| US6283844B1 (en) | Tool component | |
| JPS6066441A (ja) | ワイヤボンダ用ツ−ル | |
| US3542277A (en) | Wire bonding needle and method for making same | |
| US2876761A (en) | Helicoidal stone-sawing wire | |
| SE0103769L (sv) | Verktyg samt förfarande för dess framställning | |
| US3717189A (en) | Method and apparatus for tire studs | |
| KR100549375B1 (ko) | 다이아몬드 코어드릴 및 그 제조방법 | |
| US2346373A (en) | Diamond tool | |
| JP4153680B2 (ja) | 軸付きメタルボンド超砥粒ホイール及びその製造方法 | |
| JPS54160168A (en) | Pressure bonding capillary chip | |
| US4269900A (en) | Solderless capillary chips | |
| JPH0539912U (ja) | 研削穿孔工具 | |
| JP2000061929A (ja) | 台金にテーパ部を有するワイヤソー | |
| CN209851339U (zh) | 新型复合型金刚线 | |
| GB2229859A (en) | Roll surface cutting method | |
| JPS6475138A (en) | Manufacture of drill screw and drill part forming die used for said manufacture | |
| JPS5921415A (ja) | 圧延ロ−ル | |
| JPS61121818A (ja) | ワイヤ−ソ−用ワイヤ− |