JPS6063944U - Semiconductor integrated circuit package - Google Patents
Semiconductor integrated circuit packageInfo
- Publication number
- JPS6063944U JPS6063944U JP15564183U JP15564183U JPS6063944U JP S6063944 U JPS6063944 U JP S6063944U JP 15564183 U JP15564183 U JP 15564183U JP 15564183 U JP15564183 U JP 15564183U JP S6063944 U JPS6063944 U JP S6063944U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- semiconductor integrated
- circuit package
- pins
- displayed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図、第２図は従来のＩＣパッケージを示す外観図、
第３図、第４図は本考案パッケージの実施例を示す概観
図である。゛
１・・・・・・Ｏ印マーク、２・・・・・・印マーク、
３・・・・・・０印マーク、４・・・・・・総合ピン数
表示。Figures 1 and 2 are external views showing conventional IC packages;
FIGS. 3 and 4 are schematic diagrams showing an embodiment of the package of the present invention.゛1...O mark, 2...mark,
3...0 mark mark, 4...total pin number display.
Claims (1)
複数個のピン番号表示を施したことを特徴とする半導体
集積回路パッケージ。A semiconductor integrated circuit package characterized in that the total number of pins or a plurality of pin numbers are displayed on the surface of the semiconductor integrated circuit package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15564183U JPS6063944U (en) | 1983-10-08 | 1983-10-08 | Semiconductor integrated circuit package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15564183U JPS6063944U (en) | 1983-10-08 | 1983-10-08 | Semiconductor integrated circuit package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6063944U true JPS6063944U (en) | 1985-05-07 |
Family
ID=30343685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15564183U Pending JPS6063944U (en) | 1983-10-08 | 1983-10-08 | Semiconductor integrated circuit package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6063944U (en) |
-
1983
- 1983-10-08 JP JP15564183U patent/JPS6063944U/en active Pending
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