JPS6060994A - セラミツクの部分メツキ法 - Google Patents

セラミツクの部分メツキ法

Info

Publication number
JPS6060994A
JPS6060994A JP16888083A JP16888083A JPS6060994A JP S6060994 A JPS6060994 A JP S6060994A JP 16888083 A JP16888083 A JP 16888083A JP 16888083 A JP16888083 A JP 16888083A JP S6060994 A JPS6060994 A JP S6060994A
Authority
JP
Japan
Prior art keywords
resist ink
plating
ceramic
tin
palladium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16888083A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6234714B2 (enExample
Inventor
久保井　義夫
井上　達政
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Okuno Chemical Industries Co Ltd
Original Assignee
Okuno Chemical Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Okuno Chemical Industries Co Ltd filed Critical Okuno Chemical Industries Co Ltd
Priority to JP16888083A priority Critical patent/JPS6060994A/ja
Publication of JPS6060994A publication Critical patent/JPS6060994A/ja
Publication of JPS6234714B2 publication Critical patent/JPS6234714B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0565—Resist used only for applying catalyst, not for plating itself
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks

Landscapes

  • Chemically Coating (AREA)
JP16888083A 1983-09-12 1983-09-12 セラミツクの部分メツキ法 Granted JPS6060994A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16888083A JPS6060994A (ja) 1983-09-12 1983-09-12 セラミツクの部分メツキ法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16888083A JPS6060994A (ja) 1983-09-12 1983-09-12 セラミツクの部分メツキ法

Publications (2)

Publication Number Publication Date
JPS6060994A true JPS6060994A (ja) 1985-04-08
JPS6234714B2 JPS6234714B2 (enExample) 1987-07-28

Family

ID=15876269

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16888083A Granted JPS6060994A (ja) 1983-09-12 1983-09-12 セラミツクの部分メツキ法

Country Status (1)

Country Link
JP (1) JPS6060994A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62235473A (ja) * 1986-04-04 1987-10-15 Nippon Mining Co Ltd 無電解めつき用アルカリ型触媒液
EP0708581A3 (en) * 1994-10-18 1997-10-29 At & T Corp Method for depositing a metal stream without current

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04102507U (ja) * 1991-02-05 1992-09-03 株式会社大林組 電線管

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62235473A (ja) * 1986-04-04 1987-10-15 Nippon Mining Co Ltd 無電解めつき用アルカリ型触媒液
EP0708581A3 (en) * 1994-10-18 1997-10-29 At & T Corp Method for depositing a metal stream without current

Also Published As

Publication number Publication date
JPS6234714B2 (enExample) 1987-07-28

Similar Documents

Publication Publication Date Title
JPS634075A (ja) 無電解メツキ用シ−ドの形成方法
JPH01501402A (ja) 選択的金属化法及びプリント回路基板の加層的製造方法
JPH0455553B2 (enExample)
US4430154A (en) Method of producing printed circuit boards
US4847114A (en) Preparation of printed circuit boards by selective metallization
US4759952A (en) Process for printed circuit board manufacture
JPH01500677A (ja) 無電解ニツケル又は銅めつき用クロムマスク
JPS6060994A (ja) セラミツクの部分メツキ法
JP3474291B2 (ja) ガラス又はセラミックス基板へのめっき層の形成方法
US4761304A (en) Process for printed circuit board manufacture
JPS62230996A (ja) アルミニウム基板にめつきをする方法
JPH0357638B2 (enExample)
JPS6118357B2 (enExample)
JPS58161393A (ja) プリント基板の製造方法
JPS61163691A (ja) プリント配線板の電路形成方法
JPH0450389B2 (enExample)
JPS6345893A (ja) 印刷配線板の製造方法
JPS63293895A (ja) メッキ方法
JPH0449796B2 (enExample)
JPS6363630B2 (enExample)
JPS59193089A (ja) 印刷配線板の製造方法
JPS6224686A (ja) プリント配線板の製造方法
JPS6329996A (ja) 絶縁基板へのメツキ方法
JPH0317392B2 (enExample)
JPS62260389A (ja) プリント配線板の製造方法