JPS6060994A - Partial plating process for ceramic - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] The present invention relates to a method for partial plating of ceramics.

The following methods have been conventionally used for partial plating of ceramics. That is, a desired pattern is masked on a ceramic material using an alkali-soluble resist ink, dried, degreased, and subjected to a motuching/greasing process, followed by adhering tin ions using a tin solution containing stannous chloride as the main component. Palladium solution with palladium as main component on top of tin ions/
By reacting, a metal palladium catalyst is deposited and electroless plating is performed. After washing with water, the resist ink portion is peeled off and partial plating is performed. However, according to this method, tin ions and dipalladium ions adhere not only to the ceramic portion but also to the resist ink portion and act as catalysts, so that plating is deposited not only on the ceramic portion but also on the resist ink portion. For this reason, it is necessary to separately peel off only the resist ink portion after plating.

In addition, in this conventional method, attempts have been made to selectively prevent the above-mentioned ions from adhering to the resist ink area by varying the tin ion concentration and palladium ion concentration; It cannot be attached.

As a result of continuing research to solve the above-mentioned difficulties of conventional methods, the present inventor came up with a completely new idea that it would be possible to perform partial plating by peeling off the cyst ink before the electroless plating process. As a result of continued research, the present invention was finally completed.

That is, in the present invention, desired areas are masked using an alkali-soluble resist ink on the ceramic surface, and after drying, a colloidal M medium of palladium and tin is attached, and the resist ink is activated by contacting with an alkaline solution to activate the catalyst. The present invention relates to a ceramic partial plating method characterized by dissolving and removing and then performing electroless plating.

In the method of the present invention, first, masking is performed on the ceramic material in a desired pattern using resist ink. Next, through the usual steps of drying, degreasing, washing, and etching, a mixed colloid of tin and palladium is adhered to both the ceramic surface and the resist ink surface using a colloidal solution of tin and palladium. . This colloid has poor activation power as it is and can be activated with an alkaline solution. At this time, at the same time as activation, the resist ink with attached tin and palladium is dissolved and removed, leaving the tin and palladium catalyst (activated) only in the areas to be plated. Next, by washing with water and electroless treatment, plating is deposited in a desired pattern.

A wide variety of ceramic materials can be used in the present invention, including pure alumina, barium titanate, ferrite, and zircon ceramics. There is no particular restriction on the shape of the hexalamic material, and various shapes can be used. As the resist ink, one that is soluble in an alkaline solution is used. For example, it is preferable to use an alkali-soluble resist ink containing a malonic acid resin as the resin component, a selonlube solvent such as ethyl cellosolve, and an inorganic pigment as the solvent. used. The thickness of the ink used for masking is not particularly limited, and may be any conventional thickness, for example, about 10 to 50 microns. As the tin and palladium colloid liquid, a liquid in which these metal colloids are dispersed in water is usually used. These ordinary alkaline solutions can be used to activate metal colloids,
For example, caustic soda or caustic potash water bath liquid can be cited as a representative example. Electroless plating itself may be performed as is according to conventional methods.

In order to make the features of the present invention more clear, the differences between the method of the present invention and the conventional method will be shown below using drawings.

Figures 1 to 3 are all simulative illustrations of conventional methods; Figure 1 shows the state after S11 and PB ions have been deposited, and Figure 2 shows the state after electroless plating. FIG. 3 shows the state after the resist ink has been peeled off. In these figures, (1) is a ceramic material, (2) is an electroless plating film, (3) is a resist ink coating, (4) is a Sin', (
5) indicates pb. In the conventional method shown in Figure 1, Sh and PB ions also adhere to the resist ink film (3), and when electroless plating is applied on top of this, the resist ink film (3) appears as shown in Figure 2. A plating film is formed on the surface. When the resist ink is then removed, a plating film remains in the state shown in FIG. 3, and a plating film is also formed on the masking portion.

Therefore, according to the conventional method, it is necessary to separately remove the excess plating film (6). Since this removal is carried out according to conventional mechanical means, it is difficult to completely remove the ceramic material, and in addition, it has an undesirable effect on the ceramic material and, in severe cases, causes cracks and cracks.

On the other hand, FIGS. 4 to 6 are detailed explanatory diagrams of the present invention, and the numbers in the drawings indicate the same things as in FIGS. 1 to 3. Figure 4 shows Sh,
FIG. 5 shows the state after the pb colloid is attached, FIG. 5 shows the state after resist ink peeling and activation, and FIG. 6 shows the state after electroless plating.

As shown in Figure 4, the S'n%pb colloid adheres to the ceramic material and the resist ink film, but by treatment with an alkaline solution, the tin is dissolved and the palladium colloid is activated and remains. The ink is removed and the state as shown in FIG. 5 is obtained. Next, when electroless plating is applied, a state as shown in FIG. 6 is obtained, and the plating is deposited in a desired pattern.

Example A checkered pattern as shown in FIG. 7 was printed on a ceramic material (96 thialumina plate) using resist ink (malonic acid resin ink). This was dried at t-60°C, degreased with an acidic chelate substance, washed with water, and etched with hydrofluoric acid. The etched board was then treated with 81113% and pbo
, immersed in a colloidal solution containing 02% for 5-7 minutes,
It was immersed in NaOH aqueous solution for 3 to 5 minutes, washed with water and dried. Electroless plating was performed at 30° C. for 130 minutes using an electroless nickel plating bath or an electroless copper plating bath, followed by washing and drying. This was repeated 10 times to determine the deposition rate on the resist. The results are shown in Part 1.

Comparative Example The material that had been etched in the above example was immersed in an aqueous solution containing 3 g of stannous chloride for 2 minutes, then immersed in an aqueous solution of 0.02 g of palladium chloride for 2 minutes, washed with water, and dried. Same as Example 1. Electroless plating was performed under the following conditions. The results are also listed in Table 1.

Table 1

[Brief explanation of drawings]

1 to 7 are diagrams schematically showing the conditions at each step of the plating method. In the figure (1) is ceramic i; tL
(2) is a plating film, (3) is a resist ink film, (4)
represents Sn and (5) represents pb. (Above) Agent: Eiji Saegusa, Patent Attorney, Figure 1, Figure 2, Figure 4, Figure 5, Figure 1, Figure 3, Figure 6

Claims (1)

[Claims] ■ Mask the desired areas on the ceramic surface using an alkali-soluble resist ink, and after drying, attach a colloidal catalyst of palladium and tin, and bring it into contact with an alkaline solution to activate the catalyst and dissolve and remove the resist ink. A partial plating method for ceramics, which is then subjected to non-JL plating.