JPS6059542U - 40-pin IC package for high-density mounting - Google Patents
40-pin IC package for high-density mountingInfo
- Publication number
- JPS6059542U JPS6059542U JP15141683U JP15141683U JPS6059542U JP S6059542 U JPS6059542 U JP S6059542U JP 15141683 U JP15141683 U JP 15141683U JP 15141683 U JP15141683 U JP 15141683U JP S6059542 U JPS6059542 U JP S6059542U
- Authority
- JP
- Japan
- Prior art keywords
- pin
- package
- pins
- density mounting
- added
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
図面は、本考案に係る高密度実装用４０ピンＩＣパツケ
ージの一実施例を説明するためのａは平面図、ｂは正面
図、Ｃは側面図、ｄは裏面図であ 、る。
図において、１はＩＣパッケージ本体、２はチ、ツブ、
３はピン、４は丸棒ピン、Ａはチップ搭載部をそれぞれ
示す。
補正 昭５９．２．１６
図面の簡単な説明を次のように補正する。
明細書第４頁第６〜８行の「図面は本考案に係る・・・
・・・ｄは裏面図である。」を次のとおり補正する。
［第１．２．３図および第４図は本考案に係る高密度実
装用４０ピンＩＣパツケージの一実施例を説明するため
の図で、第１図は平面図、第２図は正面図、第３図は側
面図、第４図は裏面図である。」In the drawings, a is a plan view, b is a front view, C is a side view, and d is a back view for explaining one embodiment of a 40-pin IC package for high-density mounting according to the present invention. In the figure, 1 is the IC package body, 2 is the chip, the knob,
3 indicates a pin, 4 indicates a round bar pin, and A indicates a chip mounting portion. Amendment February 16, 1982 The brief description of the drawing is amended as follows. On page 4 of the specification, lines 6-8, ``The drawings relate to the present invention...''
...d is a back view. ' shall be amended as follows. [Figures 1.2.3 and 4 are diagrams for explaining an embodiment of a 40-pin IC package for high-density mounting according to the present invention, with Figure 1 being a plan view and Figure 2 being a front view. , FIG. 3 is a side view, and FIG. 4 is a back view. ”
Claims (1)
に設けたチップ部を避けて１６ピンを増設し、該増設し
たピンを丸棒で形成するとともに、該ピンの長さを２４
ピンめ長さよりも若干長くしたことを特徴とする高密度
実装用４０ピンＩＣパツケージ。16 pins are added to the pin protrusion side of the 24-pin DIP type package, avoiding the chip part provided in the center, and the added pins are formed with round bars, and the length of the pins is set to 24 pins.
A 40-pin IC package for high-density mounting, characterized by being slightly longer than the pin length.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15141683U JPS6059542U (en) | 1983-09-29 | 1983-09-29 | 40-pin IC package for high-density mounting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15141683U JPS6059542U (en) | 1983-09-29 | 1983-09-29 | 40-pin IC package for high-density mounting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6059542U true JPS6059542U (en) | 1985-04-25 |
Family
ID=30335542
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15141683U Pending JPS6059542U (en) | 1983-09-29 | 1983-09-29 | 40-pin IC package for high-density mounting |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6059542U (en) |
-
1983
- 1983-09-29 JP JP15141683U patent/JPS6059542U/en active Pending
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