JPS6059531U - 発光ダイオ−ドの樹脂封入成形用金型 - Google Patents

発光ダイオ−ドの樹脂封入成形用金型

Info

Publication number
JPS6059531U
JPS6059531U JP15008983U JP15008983U JPS6059531U JP S6059531 U JPS6059531 U JP S6059531U JP 15008983 U JP15008983 U JP 15008983U JP 15008983 U JP15008983 U JP 15008983U JP S6059531 U JPS6059531 U JP S6059531U
Authority
JP
Japan
Prior art keywords
mold
light emitting
cavity
emitting diodes
resin encapsulation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15008983U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6317250Y2 (enrdf_load_stackoverflow
Inventor
道男 長田
Original Assignee
有限会社ティ・アンド・ケイ・インターナショナル研究所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 有限会社ティ・アンド・ケイ・インターナショナル研究所 filed Critical 有限会社ティ・アンド・ケイ・インターナショナル研究所
Priority to JP15008983U priority Critical patent/JPS6059531U/ja
Publication of JPS6059531U publication Critical patent/JPS6059531U/ja
Application granted granted Critical
Publication of JPS6317250Y2 publication Critical patent/JPS6317250Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
JP15008983U 1983-09-28 1983-09-28 発光ダイオ−ドの樹脂封入成形用金型 Granted JPS6059531U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15008983U JPS6059531U (ja) 1983-09-28 1983-09-28 発光ダイオ−ドの樹脂封入成形用金型

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15008983U JPS6059531U (ja) 1983-09-28 1983-09-28 発光ダイオ−ドの樹脂封入成形用金型

Publications (2)

Publication Number Publication Date
JPS6059531U true JPS6059531U (ja) 1985-04-25
JPS6317250Y2 JPS6317250Y2 (enrdf_load_stackoverflow) 1988-05-16

Family

ID=30332980

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15008983U Granted JPS6059531U (ja) 1983-09-28 1983-09-28 発光ダイオ−ドの樹脂封入成形用金型

Country Status (1)

Country Link
JP (1) JPS6059531U (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000108144A (ja) * 1998-10-06 2000-04-18 Taiyo Ltd 部品の製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS556840A (en) * 1978-06-28 1980-01-18 Nec Corp Optical semiconductor device and resin sealing method of the same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS556840A (en) * 1978-06-28 1980-01-18 Nec Corp Optical semiconductor device and resin sealing method of the same

Also Published As

Publication number Publication date
JPS6317250Y2 (enrdf_load_stackoverflow) 1988-05-16

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