JPS6052431B2 - Manufacturing method of resin gravure plate - Google Patents

Manufacturing method of resin gravure plate

Info

Publication number
JPS6052431B2
JPS6052431B2 JP12576778A JP12576778A JPS6052431B2 JP S6052431 B2 JPS6052431 B2 JP S6052431B2 JP 12576778 A JP12576778 A JP 12576778A JP 12576778 A JP12576778 A JP 12576778A JP S6052431 B2 JPS6052431 B2 JP S6052431B2
Authority
JP
Japan
Prior art keywords
photosensitive resin
resin layer
polyamide
layer
protective film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP12576778A
Other languages
Japanese (ja)
Other versions
JPS5552062A (en
Inventor
進 谷田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to JP12576778A priority Critical patent/JPS6052431B2/en
Publication of JPS5552062A publication Critical patent/JPS5552062A/en
Publication of JPS6052431B2 publication Critical patent/JPS6052431B2/en
Expired legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/09Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/095Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)

Description

【発明の詳細な説明】 本発明は焼付原稿のピンホールあるいは焼付時に付着し
た異物等の影響を受けてもその影響を良好に除去して良
質なる画像部を得ることのできる樹脂製グラビア版の製
法に関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention provides a resin gravure plate that can effectively eliminate the effects of pinholes in printed originals or foreign matter attached during printing to obtain high-quality image areas. It is related to the manufacturing method.

光硬化型感光性樹脂層にグラビア用ポジ原稿を焼付けて
グラビア版を得る方法は従来よりよく知られているもの
である。この製法は金属性グラビア版に較べて煩瑣なメ
ッキ工程等を不要とするので、従来のグラビア剛腹工程
の大幅な能率アップを図ることができるものである。と
ころで、樹脂性グラビア版の剛腹工程において原稿を感
光層に焼付けるとき、原稿の含んでいるピンホールある
いは原稿、感光層等に付着するゴミ、ホコリ等の異物が
画質に影響する。
The method of obtaining a gravure plate by printing a positive gravure original onto a photocurable photosensitive resin layer is well known. This manufacturing method eliminates the need for complicated plating processes, etc. compared to metallic gravure plates, and therefore can greatly improve the efficiency of the conventional gravure rigid plate process. By the way, when an original is printed on a photosensitive layer in the hardening process of a resin gravure plate, image quality is affected by pinholes contained in the original or foreign substances such as dirt and dust that adhere to the original or the photosensitive layer.

これらピンホール、異物等は完全には避け難いものであ
るから、画像の一部として焼付けられ、途中で何らかの
処理を施さないとそのまま画線部を構成してしまう。そ
して印刷物を欠陥商品としてしまうのである。従来、ピ
ンホール、異物等により影響を受けた刷版部分は感光層
と同系の樹脂で埋めて研摩し、画像部とならないように
修正している。
Since these pinholes, foreign objects, etc. cannot be completely avoided, they are printed as part of the image, and unless some processing is performed during the process, they will form part of the image area. And the printed matter becomes a defective product. Conventionally, printing plate areas affected by pinholes, foreign matter, etc. are filled with a resin of the same type as the photosensitive layer and polished to correct them so that they do not become image areas.

しかし、ピンホール、異物等はかなり多く生じており、
かつその発生位置も定まつたものではないから、上記修
正作業は甚大なる時間と労力とを要求するものである。
However, there are quite a lot of pinholes, foreign objects, etc.
In addition, since the location of the occurrence is not fixed, the above-mentioned correction work requires an enormous amount of time and effort.

従つてこの方法はあまり実用的でない。本発明は所謂ニ
ス止めと呼ばれる手法で上記影響を解消せんものと第1
図のような方法を試みた。
Therefore, this method is not very practical. The present invention uses a method called varnishing to eliminate the above-mentioned effects.
I tried the method shown in the figure.

図において、10は円筒形基体又は板状基体(図示せず
)の上に形成されているポリアミド系感光性樹脂層、1
2はグラビア用ポジ原稿、14は光、16はニスである
In the figure, 10 is a polyamide-based photosensitive resin layer formed on a cylindrical substrate or a plate-shaped substrate (not shown);
2 is a positive original for gravure, 14 is light, and 16 is varnish.

しかして、原稿画像を樹脂層10に焼き付け(1)、原
稿のピンホール18に相当するところの未露光部20を
ニス16で覆い()、次いで現像し()、しかる後二ス
16を除去()したところ、図示のようにセル22以外
のところに数ミクロンの段差aが生じてしまい、これが
印刷物上で地汚れとなつて現われたのである。
Then, the original image is printed on the resin layer 10 (1), the unexposed areas 20 corresponding to the pinholes 18 of the original are covered with varnish 16 (), then developed (), and then the second swatch 16 is removed. As a result, as shown in the figure, a step a of several microns was created in areas other than the cell 22, and this appeared as background stains on the printed matter.

これは現像液によつて、ニス16で覆われた部分以雅の
感光層10の上面も侵食を受けるからであろう。
This is probably because the upper surface of the photosensitive layer 10 beyond the portion covered with the varnish 16 is also eroded by the developer.

ニス16を画線部との境界ギリギリまで塗ればそのよう
な不具合は生じないものと考えられるが、そのような処
理は実際上ほとんど不可能に近い。本発明はこの段階を
大幅に進め、段差を生ぜず、かつピンホール等の影響を
ほとんど全部無く9することのできる方法を提供しよう
とするものである。
It is thought that such a problem will not occur if the varnish 16 is applied to the very edge of the border with the drawing area, but such processing is almost impossible in practice. The present invention aims to significantly advance this step and provide a method that does not create a step and is almost completely free from the effects of pinholes and the like.

以下、第2図に基づき本発明の望ましい実施態様につき
説明する。
Hereinafter, a preferred embodiment of the present invention will be described based on FIG.

まず最初に、ポリアミド系感光性樹脂層10の表面に、
当該ポリアミド系感光性樹脂層の現像液では侵食されな
い他の光硬化型感光性樹脂層24が付着形成される(1
)。
First, on the surface of the polyamide photosensitive resin layer 10,
Another photocurable photosensitive resin layer 24 that is not eroded by the developer of the polyamide photosensitive resin layer is adhered and formed (1
).

この層24は、例えばゴム系レジスト(より具体的には
、東京応化製0MR1富士薬品製FSRlKOdak製
KTER)、ポリケイ皮酸ビニル系フオトレジスト(よ
り具体的には、東京応化製TPRlOSR.sKOda
k製KPR)等を液状でスプレイ、デイツピング、ホエ
ラ一、垂直コート等の適宜手段で付着させることにより
形成されうる。
This layer 24 is made of, for example, a rubber-based resist (more specifically, 0MR manufactured by Tokyo Ohka Co., Ltd., KTER manufactured by Fuji Yakuhin Co., Ltd.), a polyvinyl cinnamate photoresist (more specifically, TPRlOSR.sKOda manufactured by Tokyo Ohka Co., Ltd.),
It can be formed by applying a liquid such as KPR (manufactured by K.K.) by appropriate means such as spraying, dipping, whealing, vertical coating, etc.

層24の厚さは望ましくは数ミクロンである。層10と
層24とは感光特性が相違するのが普通だから後段の工
程()で不具合を生じないよう、なるべく層24は薄く
形成するのがよいものと考えられる。次いで、上記層2
4の上にグラビア用ポジ原稿12があてがわれ、画像の
焼き付けが行なわれる()。
The thickness of layer 24 is preferably a few microns. Since the layer 10 and the layer 24 usually have different photosensitive characteristics, it is considered that the layer 24 should be formed as thin as possible to avoid problems in the subsequent steps (). Then, the layer 2
A positive gravure original 12 is placed on top of the image 4, and the image is printed ().

焼付光源としては、例えば超高圧水銀灯、高圧水銀灯、
ケミカルランプ等が使用されうる。上記画像が焼き付け
により、ポリアミド系感光性樹脂層10および他の樹脂
層24に潜像として形成されると、現像液で層24のみ
が現像される()。この現像液はポリアミド系感光性樹
脂を侵食しない性質のもので、例えば主成分をキシロー
ルとするものが選定され、スプレイ、デイツピング等の
適宜手段で層24に接触せしめられる。層24が現像さ
れると、次いで保護膜形成工程()が行なわれる。保護
膜16は、例えばニス止めと称される作業によりニスて
形成される。ニスはポリアミド系感光性樹脂の現像液(
工程Vて使用)で侵食されない耐アルコール性のもの例
えば東京化成製アスフアルトが選定される。ここで、保
護膜16は、前述の如く原稿に含まれるピンホール18
あるいは焼付時に光路中に介入するゴミ等の異物によつ
て生じるところの欠陥部分に施されるべきものである。
Examples of burning light sources include ultra-high pressure mercury lamps, high-pressure mercury lamps,
A chemical lamp or the like may be used. When the above image is formed as a latent image on the polyamide photosensitive resin layer 10 and other resin layers 24 by printing, only the layer 24 is developed with a developer (). This developing solution is selected to be one that does not corrode the polyamide photosensitive resin, for example, one containing xylene as a main component, and is brought into contact with the layer 24 by appropriate means such as spraying or dipping. Once layer 24 is developed, a protective film formation step () is then performed. The protective film 16 is formed by varnishing, for example, by a process called varnishing. The varnish is a polyamide photosensitive resin developer (
An alcohol-resistant material that is not corroded in step V (used in step V), such as Tokyo Kasei asphalt, is selected. Here, the protective film 16 covers the pinholes 18 contained in the original as described above.
Alternatively, it should be applied to defective areas caused by foreign matter such as dust that gets into the optical path during printing.

このピンホール等は原稿12に非画線部てあるにもかか
わらず画線部が存するかの如く光を遮るように作用する
()。このため、焼付工程()において両層10,24
にピンホール等の潜像が形成され、現像工程において層
24の潜像部が除去されると、そこから層10のピンホ
ール等の潜像であるところの未露光部20が露呈するこ
とになる。の保護膜形成工程はかような非画線部に相応
する層10の未露光部20および当該未露光部に対応す
る他の層24の除去部26を覆つて、画線部に対応する
未露光部の現像工程Vで侵食されないようにするため設
けられている。
These pinholes and the like act to block light as if there were an image area even though there is a non-image area on the document 12 (). Therefore, in the baking process (), both layers 10 and 24
A latent image such as a pinhole is formed on the layer 10, and when the latent image portion of the layer 24 is removed in the development process, the unexposed portion 20, which is the latent image such as a pinhole, of the layer 10 is exposed. Become. In the protective film forming step, the unexposed area 20 of the layer 10 corresponding to the non-image area and the removed area 26 of the other layer 24 corresponding to the unexposed area are covered, and the unexposed area corresponding to the image area is covered. This is provided to prevent the exposed area from being eroded during the development process V.

ニス止め等の保護膜形成が成されると()、層10の現
像がなされ画線部に相当するグラビアセル22が形成さ
れる()。
After a protective film such as varnish is formed (), the layer 10 is developed and a gravure cell 22 corresponding to the image area is formed ().

この現像液は上層24および保護膜16を侵食せず、下
層10だけを侵食するものが選定され、例えばエタノー
ルと水との混合液が使用される。現像液は望ましくはス
プレイ法により噴射される。現像後必要に応じてエタノ
ール液によるリンスが成される。このとき、層10の平
滑面は層24で覆われているから、第1図の如く上面が
侵食を受けて段差aが生じるようなことがない。
A developer is selected that does not attack the upper layer 24 and the protective film 16 but only attacks the lower layer 10; for example, a mixed solution of ethanol and water is used. The developer is preferably sprayed by a spray method. After development, rinsing with ethanol solution is performed as necessary. At this time, since the smooth surface of the layer 10 is covered with the layer 24, the upper surface will not be eroded and the step a will not occur as shown in FIG.

しかる後、除去液で上層24および保護膜16が除去さ
れる()。
Thereafter, the upper layer 24 and the protective film 16 are removed using a removal solution ().

除去液は下層10にのみ不感性のものであつて、例えば
トルエン、トリクレン、O−ジクロルベンゼン、エチル
セロソルブアセテート等である。除去液で保護膜16、
上層24は膨潤ないし溶解され下層面から除去される。
この後、層10の表面は乾燥され、後露光によつてピン
ホール等の対応未露光部20に光14が照射されて()
完全硬化され、さらに必要であればベーキングがなされ
グラビア版とされる。なお、未露光部20はその周辺の
既露光部と露光時期がずれるため少しくぼむことがある
が、その深さは1ミクロン以内であつて印刷には何ら支
障を来すことがない。さて、本発明は以上のように、ポ
リアミド系感光性樹脂層10の表面に他の光硬化型感光
性樹脂層24を付着形成し、次いて両層に潜像を形成し
、しかる後ます上層24だけを現像してから保護膜を形
成した後下層10の現像を行なうようにしてグラビア版
を作成しようとするものである。
The removal liquid is insensitive only to the lower layer 10, and is, for example, toluene, trichlene, O-dichlorobenzene, ethyl cellosolve acetate, or the like. Protective film 16 with removal solution,
The upper layer 24 swells or dissolves and is removed from the lower surface.
After this, the surface of the layer 10 is dried, and the corresponding unexposed areas 20 such as pinholes are irradiated with light 14 by post-exposure ().
The plate is completely cured and, if necessary, baked to form a gravure plate. Note that the unexposed area 20 may be slightly depressed because the exposure timing is different from that of the surrounding exposed area, but the depth thereof is within 1 micron and does not cause any trouble to printing. Now, in the present invention, as described above, another photocurable photosensitive resin layer 24 is adhered and formed on the surface of the polyamide photosensitive resin layer 10, a latent image is formed on both layers, and then an upper layer is formed. The gravure plate is prepared by developing only the lower layer 10 after developing the protective film 24 and then developing the lower layer 10.

従つて本発明によれば、ピンホール、ほこり等が存在し
ても従来の如く完成した版に後からピンホール相当部に
修正を加えるという極めて精緻かつめんどうな作業を全
く要せず、単に保護膜をピンホール相当部に大まかに付
着させるだけの簡易な操作で事足りるようにすることが
でき、しかもこの作業は版面が外部に露出する以前の工
程において最終的には不要となる層の土から行うからそ
れだけ版面を精度よく奇麗に仕上げることができるもの
である。最後に本発明の実施例を掲げる。
Therefore, according to the present invention, even if there are pinholes, dust, etc., there is no need for the extremely elaborate and troublesome work of modifying the areas corresponding to the pinholes on the completed plate later, as in the past, and it is possible to simply protect the plate. It is possible to do this by simply applying the film roughly to the area corresponding to the pinhole, and in addition, this process removes the layer of soil that will ultimately become unnecessary in the process before the plate surface is exposed to the outside. The more you do this, the more accurately and neatly you will be able to finish the printing plate. Finally, examples of the present invention are listed.

実施例 1 板状感光性ポリアミド樹脂(東京応化工業製、TOPL
ON版)上に、市販のゴム系フオトレジスト(東京応化
製1駅−83)を1.5μ厚にスプレーコーテイングし
、乾燥する。
Example 1 Plate photosensitive polyamide resin (manufactured by Tokyo Ohka Kogyo, TOPL)
A commercially available rubber-based photoresist (1-83 manufactured by Tokyo Ohka Co., Ltd.) is spray-coated to a thickness of 1.5 μm on the photoresist (ON version) and dried.

次に、上記薄膜コートされた未露光の版に焼枠(光源;
超高圧水銀灯50W/イ:真空密着)にてグラビア用ポ
ジ原稿を2.紛間露光する。
Next, a printing frame (light source;
2. A positive gravure original with an ultra-high pressure mercury lamp 50W/A: vacuum contact). Intermittent exposure.

露光後、ゴム系フオトレジスト(0MR−83)のスプ
レー現象(溶剤:キシロール系)を3分間行ない、同じ
くスプレーにて、リンス(溶剤:酢酸ブチル系)を1分
間行う。次に、感光性ポリアミド樹脂(TOPLON)
の現像前に、ゴム系フオトレジスト(0MR−&3)の
ピンホールをニス(耐アルコール性ニスである東京化成
製アスフアルトニス)止めする。
After exposure, a rubber photoresist (0MR-83) was sprayed (solvent: xylene) for 3 minutes, and rinsed (solvent: butyl acetate) using the same spray for 1 minute. Next, photosensitive polyamide resin (TOPLON)
Before development, pinholes in the rubber photoresist (0MR-&3) were covered with varnish (asphalt varnish manufactured by Tokyo Kasei, an alcohol-resistant varnish).

ニス止め後、感光性ポリアミド樹脂(TOPlON)の
スプレー現象(エタノール80%十水20%;30℃;
3.6k9/C7ll)を1分間行い、スプレーにてリ
ンス(エタノール)を托秒間行う。最後に、ニス及びゴ
ム系フオトレジストをトルエン、トルクレン、0−ジク
ロルベンゼン等にて剥膜する。
After varnishing, spraying of photosensitive polyamide resin (TOPlON) (ethanol 80% water 20%; 30°C;
3.6k9/C7ll) for 1 minute, and spray rinse (ethanol) for 1 second. Finally, the varnish and rubber-based photoresist are removed using toluene, torculene, 0-dichlorobenzene, or the like.

剥膜後、乾燥、後露光、ベーキングを行つた結果、1(
イ)線;網点濃度濶%で50ミクロンセル深度の版を得
た。
After peeling, drying, post-exposure, and baking, the result was 1 (
B) Line: A plate with a halftone dot density of 50 μm and a cell depth of 50 μm was obtained.

このようにして得られた版でグラビア印刷した結果、ピ
ンホールのない鮮明な画像を得ることができた。
As a result of gravure printing with the plate thus obtained, a clear image without pinholes could be obtained.

しかも、従来の金属製刷版による印刷物と比しても全く
損色のない画質を得た。実施例 2 グラビアシリンダ表面に、感光性ポリアミド樹脂をエン
ドレス状にコーテイングし、その樹脂面上に市販のゴム
系フオトレジスト(東京応化製0MR−83)を2μ厚
にスプレーコーテイングし、乾燥する。
Moreover, the image quality was completely free of color loss compared to printed matter made with conventional metal printing plates. Example 2 A photosensitive polyamide resin is endlessly coated on the surface of a gravure cylinder, and a commercially available rubber photoresist (0MR-83 manufactured by Tokyo Ohka Co., Ltd.) is spray-coated to a thickness of 2 μm on the resin surface and dried.

次に、薄膜コートされた未露光のシリンダ版をメツテン
ハイマ一焼付材(光源:高圧水銀灯90W/イ)にて2
分間露光する。
Next, the unexposed cylinder plate coated with a thin film was exposed to the Metsutenheimer baking material (light source: high pressure mercury lamp 90W/a) for 2 hours.
Expose for a minute.

露光後、ゴム系フオトレジスト(東京応化製0MR−8
3)のスプレー現象(溶剤:キシロール系)を3分間行
ない、同じくスプレーにてリンス(溶剤:酢酸ブチル系
)を1分間行う。
After exposure, rubber photoresist (0MR-8 manufactured by Tokyo Ohka Co., Ltd.
3) Spraying (solvent: xylene) is performed for 3 minutes, and rinsing (solvent: butyl acetate) is performed for 1 minute using the same spray.

次に、感光性ポリアミド樹脂の現像の前に、ゴム系フオ
トレジスト(Ex.OMR−83)のピンホールをニス
止めする。
Next, before developing the photosensitive polyamide resin, the pinholes in the rubber photoresist (Ex. OMR-83) are covered with varnish.

ニス止め後、感光性ポリアミド樹脂のスプレー現象(エ
タノール80%十水20%;30℃;3.6k9/Cl
l)を1分間行い、スプレーにてリンス(エタノール)
を158間行う。
After varnishing, spraying phenomenon of photosensitive polyamide resin (ethanol 80% dihydrate 20%; 30℃; 3.6k9/Cl
1) for 1 minute and rinse with spray (ethanol)
Do this for 158 minutes.

最後に、ニス及びゴム系フオトレジストをトルエン、ト
ルクレン、0−ジクロルベンゼン等にて剥膜する。
Finally, the varnish and rubber-based photoresist are removed using toluene, torculene, 0-dichlorobenzene, or the like.

剥膜後、乾燥、後露光、ベーキングを行つた結果、1(
4)線網点濃度濶%で40ミクロンのセル深度のエンド
レス版を得た。
After peeling, drying, post-exposure, and baking, the result was 1 (
4) An endless plate with a cell depth of 40 microns was obtained with a line halftone density of %.

このようにして得られた版でグラビア印刷した結果、ピ
ンホールのない鮮明な画像を得ることがノ出きた。
As a result of gravure printing using the plate thus obtained, it was possible to obtain clear images without pinholes.

しかも、従来の金属製刷版シリンダーによる印刷物と比
べて問題のない画質を得た。
Furthermore, the image quality was satisfactory compared to that produced by conventional metal printing plate cylinders.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はグラビア印刷版の製法の失敗例を示す工程図て
ある。 第2図は本発明に係るグラビア印刷版の製法の一例を示
す工程図である。10・・・・ポリアミド系感光性樹脂
層、12・・・・・グラビア用ポジ原稿、14・・・・
・・光、16・・・・・ニス、18・・・・・ゼンホー
ル、20・・・・・・未露光部、22・・・・・・セル
、24・・・・・光硬化型感光性樹脂層。
FIG. 1 is a process diagram showing an example of failure in the manufacturing method of a gravure printing plate. FIG. 2 is a process diagram showing an example of a method for manufacturing a gravure printing plate according to the present invention. 10...Polyamide-based photosensitive resin layer, 12...Positive manuscript for gravure, 14...
... light, 16 ... varnish, 18 ... Zen hole, 20 ... unexposed area, 22 ... cell, 24 ... photocurable photosensitive sexual resin layer.

Claims (1)

【特許請求の範囲】 1 下記工程を順次行なうことを特徴とする樹脂製グラ
ビア版の製法。 a ポリアミド系感光性樹脂層の表面に、当該ポリアミ
ド系感光性樹脂層の現像液では侵食されない他の光硬化
型感光性樹脂層を付着形成する工程。 b 上記ポリアミド系感光性樹脂層および他の光硬化型
感光性樹脂層にグラビア用ポジ原稿を焼付ける工程。 c 上記ポリアミド系感光性樹脂層を侵食しない現像液
で上記他の光硬化型感光性樹脂層を現像する工程。 d 非画線部であるにもかかわらず生じた上記ポリアミ
ド系感光性樹脂層の未露光部および当該未露光部に対応
する他の光硬化型感光性樹脂層の現像除去部を保護膜で
覆う工程。 e 上記他の光硬化型感光性樹脂層および上記保護膜を
侵食しない現像液で上記保護膜の与えられたポリアミド
系感光性樹脂層を現像する工程。 f 上記ポリアミド系感光性樹脂層を侵食しない除去液
で上記他の光硬化型感光性樹脂層および上記保護膜を除
去する工程。 g 上記ポリアミド系感光性樹脂層の未露光部を後露光
で硬化させる工程。
[Scope of Claims] 1. A method for producing a resin gravure plate, characterized by sequentially performing the following steps. a Step of adhering and forming on the surface of the polyamide photosensitive resin layer another photocurable photosensitive resin layer that is not eroded by the developer of the polyamide photosensitive resin layer. b. A step of printing a positive gravure original onto the polyamide photosensitive resin layer and other photocurable photosensitive resin layers. c. A step of developing the other photocurable photosensitive resin layer with a developer that does not corrode the polyamide photosensitive resin layer. d. Covering the unexposed areas of the polyamide photosensitive resin layer that occur even though they are non-image areas and the development removal areas of other photocurable photosensitive resin layers corresponding to the unexposed areas with a protective film. Process. e A step of developing the polyamide-based photosensitive resin layer provided with the protective film with a developer that does not corrode the other photocurable photosensitive resin layer and the protective film. f. A step of removing the other photocurable photosensitive resin layer and the protective film with a removal liquid that does not corrode the polyamide photosensitive resin layer. g. A step of curing the unexposed portions of the polyamide photosensitive resin layer by post-exposure.
JP12576778A 1978-10-13 1978-10-13 Manufacturing method of resin gravure plate Expired JPS6052431B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12576778A JPS6052431B2 (en) 1978-10-13 1978-10-13 Manufacturing method of resin gravure plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12576778A JPS6052431B2 (en) 1978-10-13 1978-10-13 Manufacturing method of resin gravure plate

Publications (2)

Publication Number Publication Date
JPS5552062A JPS5552062A (en) 1980-04-16
JPS6052431B2 true JPS6052431B2 (en) 1985-11-19

Family

ID=14918315

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12576778A Expired JPS6052431B2 (en) 1978-10-13 1978-10-13 Manufacturing method of resin gravure plate

Country Status (1)

Country Link
JP (1) JPS6052431B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2847163B2 (en) * 1988-10-11 1999-01-13 大蔵省印刷局長 Intaglio printing plate and its plate making method

Also Published As

Publication number Publication date
JPS5552062A (en) 1980-04-16

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