JPS6052246A - Polishing machine - Google Patents

Abstract

PURPOSE:To polish the entire surface of a workpiece with a uniform degree of accuracy without interrupting the working, by providing, in a conventional polishing machine, adjusting mechanism for adjusting the transfer speed or transfer width of a rotary transfer plate during polishing. CONSTITUTION:In a surface-grinding machine 10 which is used for polishing prisms, lenses, etc., a rotary plate 12 is fitted onto a vertical shaft 14, and is rotated driven thereby. Further, there is provided an adjusting mechanism for adjusting the transfer speed or transfer width of a rotary transfer plate 16 which is arranged above the rotary plate 12. This rotary transfer plate 16 is able to conduct various movements so that it may polish a workpiece 26, uniformly all over the surface thereof with a high degree of accuracy. Further, since it is not necessary to interrupt the working, the working efficiency may be remarkably enhanced.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a flat or spherical polishing method used for processing prisms, lenses, etc.

This type of polishing machine is almost the same for both flat and spherical surfaces, and is usually constructed as shown in FIG. In this surface polishing machine 10, a rotating plate 12 is attached to a vertical shaft 14 and driven to rotate.

A rotationally movable plate 16 is provided above the rotary plate 12, and its central portion is supported by a shaft 2o via a ball joint 18, and this shaft 20 is driven to move horizontally while applying downward force. Ru. A polisher 22 having polishing power is formed on the surface of the rotary plate 12, and a mounting portion 24 for fixing the workpiece with an adhesive or the like is formed on the surface of the rotary moving plate 16.

When the workpiece 26 is attached to this attachment part 24, the rotary plate 12 is rotated, and the rotary plate 16 is moved horizontally by applying a downward force to the shaft 2o, the rotary plate 16 is moved horizontally. The workpiece 26 is rotated and moved around the ball joint 18 in accordance with the rotation of the workpiece 26, and the surface of the workpiece 26 is polished to a flat surface.

At this time, since both the rotary plate 12 and the rotationally movable plate 16 rotate, the moving speeds are naturally different between the center and the outer periphery.
The amount of polishing work of the workpiece 26 differs for each part.

In conventional polishing machines, the rotary movable plate J6 is simply reciprocated using a ta-motor, an air cylinder, etc., and it is almost impossible to adjust this movement. It was only possible to change the movement width by changing the mounting position. For this reason, the above-mentioned non-uniformity in processing accuracy due to non-uniformity in the amount of polishing work is corrected by changing the movement width of the shaft 20, that is, the rotary movable plate 16, during processing. This correction method is inefficient because it stops the work in the middle of processing, and the correction is insufficient, often requiring reprocessing.

The object of the present invention is to improve such inconveniences and to provide a polishing machine that can polish the entire surface with uniform accuracy without stopping the work.

That is, the present invention provides a conventional polishing machine with an adjustment mechanism for adjusting the moving speed or moving width of the rotary moving plate during polishing.

As this adjustment mechanism, for example, a mechanism may be used in which the shaft 20 is driven by a stepping motor and the stepping motor is driven by information stored in advance in a memory.

This mesori is actually polished in various manners, and the manner in which the rotationally moving plate is moved so that the entire surface of the workpiece is uniform is determined and the manner is memorized. In addition, it is still impossible to theoretically predict the precision of the number of layers in this type of polishing.
The optimum movement mode cannot be known unless the polishing is actually performed.

Examples of movement of the rotationally movable plate according to the present invention are shown in FIGS. 3 to 6. For comparison, FIG. 2 shows the movement of the rotary moving plate of a conventional polishing machine.

FIG. 3 shows an example in which the moving speed of the rotary moving plate is gradually changed by IR.

FIG. 4 shows an example in which the rotationally movable plate is temporarily retained at several locations.

FIG. 5 shows an example in which the rotationally movable plate is reciprocated in a small width at several locations.

FIG. 6 shows an example in which the width of the reciprocating movement of the rotary moving plate is gradually reduced.

All of the above are examples of the crane movement realized by the present invention, and in reality, these movement modes are used in appropriate combinations as described above.

It goes without saying that the present invention can be used not only in a polishing machine in which the above-mentioned rotary movable plate is rotated dependently by the rotary plate, but also in a polishing machine in which the rotary movable plate itself is rotationally driven.

As described above, according to the present invention, since the rotary movable plate can perform various movements, uniform and highly accurate polishing can be performed over the entire surface of the workpiece. Moreover, since there is no need to interrupt the machining operation, the work efficiency is significantly improved.

[Brief explanation of drawings]

FIG. 1 is a front view showing the structure of the polishing machine, FIG. 2 is a graph showing the movement of the rotary movable plate of a conventional polishing machine, and FIGS. 3 to 6 show various types of movement of the rotary movable plate of the present invention. Figure 2 is a graph showing an example. 10... Polishing machine, 12... Rotating plate, 1
6... Rotating plate, 22... Polishing plate, 26... Workpiece. Patent Applicant Co., Ltd. Umashini Ri Shoten Agent Figure 11 Figure 2 Figure 3

Claims (1)

[Claims] 1. A polishing machine that has a rotating plate and a rotary moving plate that is pressed toward the rotating plate and rotates while moving along the rotating plate, and polishes a workpiece by sandwiching it between these two plates. A polishing machine characterized by being provided with an adjustment mechanism for adjusting the moving speed or the moving width of the rotary moving plate during polishing.