JPS62193760A - Chamfering unit - Google Patents

Abstract

PURPOSE:To chamfer an end face of a square body with such a tool that is easy in form correction, by installing a tool unit part rotating a cylindrical tool, a workpiece holding unit part rotating a workpiece in making it contact with an outer circumference of the cylindrical tool as keeping a tilt angle with constant load and a controlling device. CONSTITUTION:A tool unit part is designed so as to give high-speed rotation and axial vibration to a cylindrical grinding wheel 1. Control over a tilt angle alphaof a work 4 to the cylindrical grinding wheel 1 takes place in the following process that an arm 29 being installed in a rotary table 18 is operated with voltage to be impressed on a piezoelectric element 30 varied as well as the work 4 is rotated with the rotary table 18 rotated, whereby a top surface of the work 4 comes into contact with an outer circumference of the cylindrical grinding wheel 1 in keeping the tilt angle alpha. And, during rotation of the work 4, the tilt angle alpha is controlled at high speed continuously in a constant range, for example, in a range from alpha1 deg. to alpha2 deg. whereby chamfering for an end face of the work 4 can be done. In this connection, since the grinding wheel is of cylindrical form, dressing is very easy.

Description

[Detailed Description of the Invention] [Industrial Field of Application] The present invention relates to a single-face force machining device, and particularly for chamfering the end face of a rectangular object such as a magnetic head by grinding or polishing. The present invention relates to a chamfer processing device suitable for.

[Conventional technology]

Conventionally, as a method of chamfering the end face of a magnetic head made of a ceramic material or the like, a method is known in which a wrapping tape is run at high speed and polished.

Furthermore, an example of an eyeglass lens that undergoes chamfering by grinding using a grindstone is known.

This process is performed by rotating a full-form grindstone that corresponds to the chamfered shape. A similar technique is used, for example, in the
It is described in No. 28071.

[Problem that the invention seeks to solve]

Among the above-mentioned conventional techniques, the former, that is, the polishing process using a lapping tape, has a problem of low processing efficiency and large variations in the shape after chamfering.

Furthermore, in the case of grinding using a full-form grindstone corresponding to the latter chamfered shape, the full-form grindstone is expensive, and it is difficult to correct the shape when the grindstone becomes worn. This is especially true when the material of the workpiece is ceramic, since it is common to use a diamond grindstone.

The problem was that the full-form grindstone was expensive and difficult to modify.

The present invention was made in order to solve the problems of the prior art described above, and uses a simple cylindrical tool whose shape can be easily modified to efficiently chamfer the end face of a rectangular object with high precision. The purpose is to provide a chamfer processing device that can process chamfers.

[Means for solving problems]

The configuration of the chamfering force processing device according to the present invention is as follows.

a tool device section for at least rotating a cylindrical tool; means for bringing a workpiece into contact with the outer periphery of the cylindrical tool with a constant load; means for rotating the workpiece; and means for bringing the tool into contact with the outer periphery of the tool while maintaining an inclination angle thereto.

The tool is equipped with a control means for controlling at least a rotation angle and an inclination angle of the workpiece that is in contact with the outer periphery of the cylindrical tool in response to the severe chamfering of the workpiece.

As an additional note, the tool device section includes a cylindrical grindstone,
The cylindrical grindstone is provided with a drive means for rotating the cylindrical grindstone, and a vibration imparting means for applying small amplitude vibration in the axial direction to the cylindrical grindstone.

[Effect]

According to the above-mentioned technical means, the tool device section includes a cylindrical tool 1
For example, high-speed rotation and vibration can be applied to a cylindrical grindstone.

On the other hand, the workpiece holding device section, that is, the work head section,
By bringing the workpiece into contact with a cylindrical grindstone under a constant load and controlling the rotational speed of the workpiece and the angle of inclination of the workpiece in contact with the outer circumference of the cylindrical grindstone, it is possible to chamfer a square object on the workpiece. can.

〔Example〕

Hereinafter, one embodiment of the present invention will be described with reference to FIGS. 1 to 7.

First, FIG. 1 is a perspective view of a chamfering force processing device according to an embodiment of the present invention, and FIG. 2 is a diagram showing the shape of a workpiece.
) is a plan view, (b) is a sectional view taken along the line B-B in (a), and FIG. 3 is a plan view of essential parts taken along line A-A in FIG.

The chamfering force processing device shown in FIG. 1 is composed of a grinding device main body and a control device.

The main body of the grinding device consists of a tool device section that is equipped with a driving means that gives a cylindrical grinding wheel 1 rotation as shown by arrow 2 and small amplitude vibration in the axial direction as shown by arrow 3, and a tool device section that is equipped with a drive means that gives a cylindrical grindstone 1 rotation as shown by arrow 2 and small amplitude vibration in the axial direction as shown by arrow 3. ) Rotate and tilt the workpiece 4, and place the workpiece 4 on the cylindrical grindstone 1.
It consists of a workpiece holding device section (hereinafter referred to as the workhead section) that applies a constant load to the workpiece.

First, the configuration of the tool device section will be explained.

In FIG. 1, 1 is a cylindrical grindstone related to a cylindrical tool;
Reference numeral 5 denotes a motor for rotating the cylindrical grindstone 1 at high speed, which is directly connected to the axis of the grindstone, and is placed on a slide table 6.

Reference numeral 7 indicates a crank for applying small amplitude vibrations in the axial direction to the cylindrical grindstone 1, 8 a motor for operating the crank 7, and 9 an eccentric cam directly connected to the motor 8. The crank 7 has one end attached to the side surface of the slide table 6 and the other end connected to an eccentric cam 9. The crank 7 makes reciprocating motion via the eccentric cam 9 as the motor 8 rotates, and moves around the cylinder on the slide table 6. A small amplitude vibration in the axial direction is applied to the shaped grindstone 1. The amplitude is determined by adjusting the amount of eccentricity of the eccentric cam 9.

Next, the configuration of the work head section will be explained.

10 is a DC motor for rotating the workpiece 4, 11
12 is a spindle holder that holds the spindle 13 that transmits the rotational force of the DC motor 10, and 12 is a workpiece mounting plate that is directly connected to the spindle 13 and holds the workpiece 4. These are mounted on the slide table 14 described below. It constitutes a means for rotating the workpiece 4.

14 is a slide table for bringing the workpiece 4 into contact with the outer periphery of the cylindrical grindstone 1 with a constant load, that is, for applying a grinding load; 15 is a fixed part, for example, an arm fixed to the slide base 19 side to be described later; 16 is an arm fixed to the slide table 14, 17 is both arms 15.
It is a spring set between 16 and 16.

Arm 16 that slides like this and arm 1 that is fixed
A grinding load is applied by a spring 17 set between the slide table 14, both arms 15 and 16, and the spring 17 to bring the workpiece 4 into contact with the outer periphery of the cylindrical grindstone 1 with a constant load. It consists of

Reference numeral 18 denotes a rotary table for rotating each of the above-mentioned means, and a slide table 14 is placed on this rotary table 18.

19 is a slide base on which the above-mentioned means and a rotary table are placed, and 20 is a motor for moving this slide base 20.

Reference numeral 22 indicates an operation panel, and inside this operation panel 22, a control circuit for a workpiece rotation angle, a tilt angle, etc., which will be described later, is housed.

Next, Fig. 3 shows a workpiece 4 relative to the outer circumference of a cylindrical stone 1
This figure shows a means for bringing the two into contact while maintaining the inclination angle α. In the figure, the same reference numerals as in FIG. 1 indicate the same parts.

In FIG. 3, 27 is a contact point between the cylindrical grindstone 1 and the workpiece 4, 28 is a rotating shaft of the rotary table 18, 29 is an arm fixed to the rotary table 18, and 30 is a semiconductor that produces a piezoelectric effect. With piezo element, piezo element 30 with
functions as means for rotating the rotary table 18 in the direction of arrow a.

Reference numeral 31 denotes a base on which the piezo element 30 is attached, and this base 31 is fixed to a slide base 19 that is fixed to the rotary table 18.

321d is a tension spring set between the arm 29 and the base 31, and this tension spring 32 functions as a means for rotating the rotary table 18 in the direction of the arrow mark.

Since the surface area machining device has such a configuration, the cylindrical grinding wheel 1 is rotated at high speed and a constant small amplitude vibration is applied in the axial direction, while the workpiece 4 is rotated at a certain constant level with respect to the outer circumference of the cylindrical grinding wheel 1. Chamfering can be performed while applying rotation and tilt angle to the workpiece 4 while pressing it with a load.

Next, the operation of chamfering the end of a square object will be explained with reference to FIGS. 4 to 6 together with the previous figures.

FIG. 4 is an explanatory diagram showing the contact position between the cylindrical grindstone and the workpiece, FIG. 5 is an explanatory diagram of the control system, and FIG. 6 is a diagram showing the relationship between the rotation and inclination of the workpiece.

Now, FIG. 2 shows the shape of the workpiece 4, and the workpiece 4 is, for example, a square-shaped object such as a magnetic head.

(a) The figure shows the top surface of the workpiece 4, and the center position is 23,
The chamfered portion is indicated by 24.25.

(1)) The figure shows a cross section taken along line B-B in figure (a), and the multi-chamfered portion 25 has an inclination angle α with respect to the flat portion 26 on the upper surface.
It has an R shape that changes continuously from to α;.

Figures 3 to 7 show the situation in which this workpiece 4 is chamfered.
As shown in the figure.

FIG. 3 shows a state in which the workpiece 4 is in contact with the cylindrical grindstone 1 at an inclination angle α.

The tilt angle α is controlled by the arm 2 provided on the rotary table 18.
9 is operated by changing the voltage applied to the piezo element 30, and the rotary table 18 is rotated, thereby rotating the spindle holder 1 placed on the rotary table 18.
1. Rotate the workpiece mounting plate 12 and the workpiece 4 to tilt the axis of the spindle 13 by α0 with respect to the direction perpendicular to the axis C-C of the cylindrical grindstone 1. That is, the upper surface 23 of the workpiece 4 maintains an inclination angle α with respect to the outer periphery of the cylindrical grindstone 1, and contacts at 27 as shown in the figure.

The workpiece 4 is rotated by a DC motor 10 via a spindle 13. During the rotation of the workpiece 4, the inclination angle α is continuously controlled at high speed within a certain range, for example, from α1 to α2. The edges can be chamfered.

FIG. 4 shows the contact position of the work 4 with respect to the cylindrical grindstone 1 when the work 4 is rotated by θ00.

The inclination state of the workpiece 4 in this figure is set to the same inclination angle α0 as in the case of FIG. 3.

The workpiece 4 is ground when it reaches the center line C-C of the outer periphery of the grindstone, which corresponds to the axis of the cylindrical grindstone 1.

Therefore, in the case of FIG. 4(a) where the longitudinal center line passing through the center 23 of the workpiece 4 is on the same line as the center line C-C of the outer periphery of the grinding wheel, it is point 33, and in contrast to FIG. In the case of FIG. 4(b) in which the workpiece 4 rotates 000 times, the position of point 34 is the contact position, that is, the grinding position.

FIG. 5 shows a control system of the piezo element 30 and the DC motor 10 for rotating the workpiece.

A control circuit 35 indicated by a broken line is connected to the operation panel 22 shown in FIG.
The piezo element control circuit 36 is connected to the piezo element 30 and the motor control circuit 37 is connected to the DC motor 10.

The rotation of the work 4 caused by the drive of the DC motor 10 and the inclination of the work 4 caused by changes in the voltage applied to the piezo element 30 can be synchronously controlled.

Figure 6 shows the rotation angle θ of the work 40 and the inclination angle α of the work 4.
This shows the control status of

FIG. 6(a) shows the change in rotation angle θ (θ° to 360°) over time t, and FIG. 6(b) shows the change over time in a constant angle range (αl−α2) of the tilt angle α FIG. 3 is a diagram showing the transition with respect to t.

While the rotation of the workpiece 4 progresses at a constant speed as shown in FIG.

With the above control, the edges of the rectangular workpiece 4 are
It is possible to chamfer an R portion with an inclination of ;

Furthermore, by changing the workpiece rotation speed shown in FIG. 6(a), asymmetrical chamfering is also possible.

In addition, when a part of the cylindrical grindstone 1 is worn out, the workpiece 4
A slide base 19 that moves parallel to the axis of the cylindrical grindstone 1 is provided so that the grinding position can be moved to perform processing, and the grinding position can be set by rotating the motor 20.

Thereby, the cylindrical grindstone 1 can be effectively used over the entire length of the cylinder.

According to this embodiment, the end face of a ceramic rectangular object such as a magnetic head can be efficiently chamfered.
Variations in chamfer shape are reduced.

Moreover, the cylindrical grindstone makes it easy to modify the shape of the whetstone during grinding, the cost of modifying the whetstone is low, and it is effective for chamfering mass-produced products. Furthermore, it has the advantage of being compatible with various chamfered shapes.

Next, an apparatus for polishing a surface chamfered by grinding using a lapping tape as described above will be described with reference to FIG.

FIG. 7 is a schematic configuration diagram of a polishing device section according to another embodiment of the present invention.

The polishing device shown in FIG. 7 corresponds to the tool unit of the chamfering force processing device shown in FIG. 1, and is used in combination with the work head shown in FIG. 1 to perform chamfering by polishing. . The most desirable finish can be obtained by performing chamfering by grinding with the chamfering device shown in Figure 1, and then finishing the chamfering by polishing with the chamfering device equipped with the polishing device shown in Figure 7. .

In FIG. 7, 38 is a wrapping tape, 39 is an idler related to one rotation means, 40 is a cylindrical rigid drum,
41 is an elastic sheet wrapped around the outer periphery of this rigid drum 40, and 42 is a drum related to a cylindrical tool formed thereby.

Polishing must be done with flexible tools, so
An elastic sheet 41 made of polyurethane, urethane, rubber, or the like is wrapped around the outer periphery of a cylindrical rigid drum 40.

Wrapping tape 38 is placed on the outside of this drum 42.
is installed via the idler 39. In this state, a drum rotation motor (not shown) is driven to cause the wrapping tape 38 to travel.

On the other hand, the work head section that holds the workpiece 4 adjusts the rotation angle of the workpiece 4 while bringing the workpiece 4 into contact with the wrapping tape 38 running around the outer periphery of the drum 42 with a constant load, as described above for the grinding process. Performs chamfer finishing while controlling the inclination angle.

According to this embodiment, it is possible to efficiently perform final polishing of a ground workpiece, and to perform highly accurate chamfer finishing with little variation in chamfer shape. After chamfering is performed by grinding using the chamfering force processing device shown in Fig. 1, chamfering is performed using a chamfering force processing device that combines the polishing device shown in Fig. 7 and the work head section shown in Fig. 1. For example, efficiency is improved by about five times compared to finishing with conventional wrapping tape only.

In the description of each of the above-mentioned embodiments, after chamfering is performed by grinding using the chamfering force processing device shown in FIG. 1, the surface obtained by combining the polishing device shown in FIG. We have explained an example of chamfering by polishing using a force processing device.
It goes without saying that for machining a workpiece whose purpose can be achieved only by chamfering by grinding, machining can be performed using only the chamfering force machining device shown in FIG. Similarly, there may be cases where the purpose can be achieved only by chamfering by polishing using a chamfering force processing device that combines the polishing device shown in FIG. 7 and the work head section shown in FIG.

Further, the mechanisms of each part of the chamfering force processing device shown in FIGS. 1 and 3 described above are examples, and the present invention is not limited to these examples. For example, the vibration applying means for applying small amplitude vibration to the cylindrical grindstone 1 is not limited to the mechanism using the crank 7, the eccentric cam 9° and the slide table 6. Further, the means for bringing the workpiece 4 into contact with the outer periphery of the cylindrical grindstone 1 with a constant load is not limited to the mechanism using the arms 15, 16, the spring 17, and the like.

Furthermore, means for giving an inclination angle to the workpiece 4 is also provided on the rotary table 18. Arm 29. Piezo element 30. Base 31. The mechanism is not limited to the tension spring 32 or the like. This does not preclude the adoption of other mechanisms as long as each means can fulfill the expected functions.

〔Effect of the invention〕

As described above, according to the present invention, there is provided a chamfering force processing device that can chamfer the end face of a square object efficiently and with high precision using a simple cylindrical tool whose shape can be easily modified. be able to.

[Brief explanation of drawings]

FIG. 1 is a perspective view of a chamfering force processing device according to an embodiment of the present invention, and FIG. 2 is a diagram showing the shape of a workpiece, in which (a) is a plan view, and (1)) is (a). FIG. 3 is a plan view of the main part taken along the line A-A in FIG. FIG. 6 is an explanatory diagram of the control system, FIG. 6 is a diagram showing the relationship between the rotation and inclination of the workpiece, and FIG. 7 is a schematic diagram of the polishing apparatus section according to another embodiment of the present invention.

Claims (1)

[Scope of Claims] 1. A tool device for at least rotating a cylindrical tool; means for bringing a workpiece into contact with the outer periphery of the cylindrical tool with a constant load; and means for rotating the workpiece; a workpiece holding device section comprising means for bringing the workpiece into contact with the outer periphery of the cylindrical tool while maintaining an inclination angle; A chamfering device comprising a control means for controlling a rotation angle and an inclination angle of a workpiece in contact with the outer periphery of a tool. 2. In the tool device described in claim 1, the tool device includes a cylindrical grindstone, a driving means for rotating the cylindrical grindstone, and a vibration imparting device that applies small amplitude vibration in the axial direction to the cylindrical grindstone. A chamfering force processing device comprising means. 3. In the item described in claim 1, the tool device section causes the wrapping tape to run through a cylindrical tool formed by wrapping an elastic sheet around the outer periphery of a cylindrical rigid drum via a rotating means. A chamfering device that can polish a workpiece in this manner.