JPS605129U - Carrier for semiconductor wafer - Google Patents

Carrier for semiconductor wafer

Info

Publication number
JPS605129U
JPS605129U JP9686983U JP9686983U JPS605129U JP S605129 U JPS605129 U JP S605129U JP 9686983 U JP9686983 U JP 9686983U JP 9686983 U JP9686983 U JP 9686983U JP S605129 U JPS605129 U JP S605129U
Authority
JP
Japan
Prior art keywords
semiconductor wafer
carrier
groove
opposite direction
semiconductors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9686983U
Other languages
Japanese (ja)
Inventor
西ケ谷 勲
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP9686983U priority Critical patent/JPS605129U/en
Publication of JPS605129U publication Critical patent/JPS605129U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来使用されているキャリヤの外観図、第2図
は第1図のキャリヤの溝部断面図、第3図は本考案の実
施例によるキャリヤの溝部断面図、第4図は従来使用さ
れているキャリヤを用いた場合のうつし替え作業説明図
、第5図は本考案の実施例によるキャリヤを用いた場合
のうつし替え作業説明図。 図中、1はキャリヤ本体、2はウェハ、3ハV字型溝、
4はキャリヤ本体、5はV字型溝、6は丸棒、7は貫通
穴、8′はウェハ収納キャリヤ、9は空キャリヤ、10
はウェハ収納キャリヤ、11は空キャリヤである。
Fig. 1 is an external view of a conventionally used carrier, Fig. 2 is a sectional view of the groove of the carrier of Fig. 1, Fig. 3 is a sectional view of the groove of the carrier according to the embodiment of the present invention, and Fig. 4 is a conventionally used carrier. FIG. 5 is a diagram illustrating a reloading operation using a carrier according to an embodiment of the present invention; FIG. In the figure, 1 is the carrier body, 2 is the wafer, 3 is the V-shaped groove,
4 is a carrier body, 5 is a V-shaped groove, 6 is a round bar, 7 is a through hole, 8' is a wafer storage carrier, 9 is an empty carrier, 10
1 is a wafer storage carrier, and 11 is an empty carrier.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 複数の半導体つ千ハを平行にかつ等間かくに収納する為
に、互に対向して形成された複数の貫通せるV字型断面
を有する溝の一端に、該溝にそった一方向にのみ半導体
ウェハが通り抜は可能となり、逆方向に対しては通り抜
けを阻止するストップ機構をもつ事を特徴とする半導体
ウェハ用キャリヤ。
In order to store a plurality of semiconductors in parallel and at equal distances, one end of a groove having a plurality of penetrating V-shaped cross sections formed facing each other, and extending in one direction along the groove. A semiconductor wafer carrier characterized in that it has a stop mechanism that allows the semiconductor wafer to pass through only in the opposite direction, and prevents the semiconductor wafer from passing through in the opposite direction.
JP9686983U 1983-06-23 1983-06-23 Carrier for semiconductor wafer Pending JPS605129U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9686983U JPS605129U (en) 1983-06-23 1983-06-23 Carrier for semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9686983U JPS605129U (en) 1983-06-23 1983-06-23 Carrier for semiconductor wafer

Publications (1)

Publication Number Publication Date
JPS605129U true JPS605129U (en) 1985-01-14

Family

ID=30230668

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9686983U Pending JPS605129U (en) 1983-06-23 1983-06-23 Carrier for semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS605129U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04354351A (en) * 1991-05-31 1992-12-08 Shin Etsu Handotai Co Ltd Wafer transfer method and device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04354351A (en) * 1991-05-31 1992-12-08 Shin Etsu Handotai Co Ltd Wafer transfer method and device

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