JPS6050936A - 化合物半導体結晶の組成分布評価法 - Google Patents

化合物半導体結晶の組成分布評価法

Info

Publication number
JPS6050936A
JPS6050936A JP58159867A JP15986783A JPS6050936A JP S6050936 A JPS6050936 A JP S6050936A JP 58159867 A JP58159867 A JP 58159867A JP 15986783 A JP15986783 A JP 15986783A JP S6050936 A JPS6050936 A JP S6050936A
Authority
JP
Japan
Prior art keywords
compound semiconductor
wavelength
substrate
distribution
crystal substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58159867A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6337501B2 (enExample
Inventor
Masaru Koseto
勝 小瀬戸
Junjiro Goto
純二郎 後藤
Hiroshi Hidaka
日高　博士
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP58159867A priority Critical patent/JPS6050936A/ja
Publication of JPS6050936A publication Critical patent/JPS6050936A/ja
Publication of JPS6337501B2 publication Critical patent/JPS6337501B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP58159867A 1983-08-30 1983-08-30 化合物半導体結晶の組成分布評価法 Granted JPS6050936A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58159867A JPS6050936A (ja) 1983-08-30 1983-08-30 化合物半導体結晶の組成分布評価法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58159867A JPS6050936A (ja) 1983-08-30 1983-08-30 化合物半導体結晶の組成分布評価法

Publications (2)

Publication Number Publication Date
JPS6050936A true JPS6050936A (ja) 1985-03-22
JPS6337501B2 JPS6337501B2 (enExample) 1988-07-26

Family

ID=15702944

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58159867A Granted JPS6050936A (ja) 1983-08-30 1983-08-30 化合物半導体結晶の組成分布評価法

Country Status (1)

Country Link
JP (1) JPS6050936A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03187425A (ja) * 1989-12-15 1991-08-15 Matsushita Electric Works Ltd 便器水洗装置
JPH03187426A (ja) * 1989-12-15 1991-08-15 Matsushita Electric Works Ltd 便器水洗装置
WO2001020662A1 (en) * 1999-09-10 2001-03-22 Nikko Materials Co., Ltd. Device for mapping composition ratio of specific element which compound semiconductor wafer contains
JP2021170005A (ja) * 2020-04-15 2021-10-28 株式会社コーセー 結晶構造の分布評価方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03114701U (enExample) * 1990-03-07 1991-11-26

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5193665A (enExample) * 1975-02-14 1976-08-17
JPS57206045A (en) * 1981-06-12 1982-12-17 Fujitsu Ltd Method for checking silicon wafer

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5193665A (enExample) * 1975-02-14 1976-08-17
JPS57206045A (en) * 1981-06-12 1982-12-17 Fujitsu Ltd Method for checking silicon wafer

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03187425A (ja) * 1989-12-15 1991-08-15 Matsushita Electric Works Ltd 便器水洗装置
JPH03187426A (ja) * 1989-12-15 1991-08-15 Matsushita Electric Works Ltd 便器水洗装置
WO2001020662A1 (en) * 1999-09-10 2001-03-22 Nikko Materials Co., Ltd. Device for mapping composition ratio of specific element which compound semiconductor wafer contains
JP2021170005A (ja) * 2020-04-15 2021-10-28 株式会社コーセー 結晶構造の分布評価方法

Also Published As

Publication number Publication date
JPS6337501B2 (enExample) 1988-07-26

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