JPS6042732U - 半導体材料の水切乾燥装置 - Google Patents

半導体材料の水切乾燥装置

Info

Publication number
JPS6042732U
JPS6042732U JP13477583U JP13477583U JPS6042732U JP S6042732 U JPS6042732 U JP S6042732U JP 13477583 U JP13477583 U JP 13477583U JP 13477583 U JP13477583 U JP 13477583U JP S6042732 U JPS6042732 U JP S6042732U
Authority
JP
Japan
Prior art keywords
rotor
blades
utility
drying device
model registration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13477583U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6233316Y2 (enrdf_load_html_response
Inventor
相合　征一郎
Original Assignee
黒谷　巌
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 黒谷　巌 filed Critical 黒谷　巌
Priority to JP13477583U priority Critical patent/JPS6042732U/ja
Publication of JPS6042732U publication Critical patent/JPS6042732U/ja
Application granted granted Critical
Publication of JPS6233316Y2 publication Critical patent/JPS6233316Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Drying Of Solid Materials (AREA)
JP13477583U 1983-08-31 1983-08-31 半導体材料の水切乾燥装置 Granted JPS6042732U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13477583U JPS6042732U (ja) 1983-08-31 1983-08-31 半導体材料の水切乾燥装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13477583U JPS6042732U (ja) 1983-08-31 1983-08-31 半導体材料の水切乾燥装置

Publications (2)

Publication Number Publication Date
JPS6042732U true JPS6042732U (ja) 1985-03-26
JPS6233316Y2 JPS6233316Y2 (enrdf_load_html_response) 1987-08-26

Family

ID=30303580

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13477583U Granted JPS6042732U (ja) 1983-08-31 1983-08-31 半導体材料の水切乾燥装置

Country Status (1)

Country Link
JP (1) JPS6042732U (enrdf_load_html_response)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007085630A (ja) * 2005-09-21 2007-04-05 Kida Seiko Kk 表面処理済みワークの乾燥装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007085630A (ja) * 2005-09-21 2007-04-05 Kida Seiko Kk 表面処理済みワークの乾燥装置

Also Published As

Publication number Publication date
JPS6233316Y2 (enrdf_load_html_response) 1987-08-26

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