JPS6041004A - Solid-state image pickup element - Google Patents
Solid-state image pickup elementInfo
- Publication number
- JPS6041004A JPS6041004A JP59135128A JP13512884A JPS6041004A JP S6041004 A JPS6041004 A JP S6041004A JP 59135128 A JP59135128 A JP 59135128A JP 13512884 A JP13512884 A JP 13512884A JP S6041004 A JPS6041004 A JP S6041004A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- color
- filter
- color separation
- intermediate layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002861 polymer material Substances 0.000 claims abstract description 14
- 230000005855 radiation Effects 0.000 claims abstract description 14
- 238000000926 separation method Methods 0.000 claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 12
- 230000003595 spectral effect Effects 0.000 claims abstract description 5
- 229920000620 organic polymer Polymers 0.000 claims description 11
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000003384 imaging method Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 18
- 238000004043 dyeing Methods 0.000 abstract description 6
- 230000035945 sensitivity Effects 0.000 abstract description 3
- 206010034972 Photosensitivity reaction Diseases 0.000 abstract 1
- 230000001678 irradiating effect Effects 0.000 abstract 1
- 230000036211 photosensitivity Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 32
- 239000010408 film Substances 0.000 description 14
- 230000001681 protective effect Effects 0.000 description 14
- 239000011241 protective layer Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 11
- 108010010803 Gelatin Proteins 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 239000008273 gelatin Substances 0.000 description 4
- 229920000159 gelatin Polymers 0.000 description 4
- 235000019322 gelatine Nutrition 0.000 description 4
- 235000011852 gelatine desserts Nutrition 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 229920002454 poly(glycidyl methacrylate) polymer Polymers 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- -1 poly(methyl methacrylate) Polymers 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- QCVGEOXPDFCNHA-UHFFFAOYSA-N 5,5-dimethyl-2,4-dioxo-1,3-oxazolidine-3-carboxamide Chemical compound CC1(C)OC(=O)N(C(N)=O)C1=O QCVGEOXPDFCNHA-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 102000002322 Egg Proteins Human genes 0.000 description 1
- 108010000912 Egg Proteins Proteins 0.000 description 1
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 1
- 229920000084 Gum arabic Polymers 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- 229920002367 Polyisobutene Polymers 0.000 description 1
- 241000978776 Senegalia senegal Species 0.000 description 1
- 235000010489 acacia gum Nutrition 0.000 description 1
- 239000000205 acacia gum Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 239000005018 casein Substances 0.000 description 1
- BECPQYXYKAMYBN-UHFFFAOYSA-N casein, tech. Chemical compound NCCCCC(C(O)=O)N=C(O)C(CC(O)=O)N=C(O)C(CCC(O)=N)N=C(O)C(CC(C)C)N=C(O)C(CCC(O)=O)N=C(O)C(CC(O)=O)N=C(O)C(CCC(O)=O)N=C(O)C(C(C)O)N=C(O)C(CCC(O)=N)N=C(O)C(CCC(O)=N)N=C(O)C(CCC(O)=N)N=C(O)C(CCC(O)=O)N=C(O)C(CCC(O)=O)N=C(O)C(COP(O)(O)=O)N=C(O)C(CCC(O)=N)N=C(O)C(N)CC1=CC=CC=C1 BECPQYXYKAMYBN-UHFFFAOYSA-N 0.000 description 1
- 235000021240 caseins Nutrition 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 235000014103 egg white Nutrition 0.000 description 1
- 210000000969 egg white Anatomy 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/201—Filters in the form of arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
- H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02162—Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Optical Filters (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は固体撮像素子に関する0
〔発明の背景〕
従来、固体撮像素子と色分解フィルタを個別に製造して
おき1両者を位置合せしつつ光学用接着剤等で貼合せる
のが一般的な製造方法である(特公昭52−17375
)。[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to a solid-state image pickup device. [Background of the Invention] Conventionally, a solid-state image pickup device and a color separation filter are manufactured separately, and then optical A common manufacturing method is to bond with a commercial adhesive (Japanese Patent Publication No. 52-17375)
).
本発明の目的は、固体撮像素子の光検知部上に直接色分
解フィルタを搭載し、素子製造の作業性を向上させるこ
とにある。An object of the present invention is to mount a color separation filter directly on the light detection section of a solid-state image sensor to improve the workability of manufacturing the device.
本発明の第2の目的はこの場合の色分解フィルタを十分
精度良く、高品位になすことにある。A second object of the present invention is to make the color separation filter in this case sufficiently accurate and of high quality.
本発明は色分解フィルタを構成するいわゆる中間層や保
護層をポジ型の放射線感応性有機高分子材料を用いるも
ので、その加工を2層を越えない積層数銀行なうことに
より、フィルタの加工を容易ならしめ、加工精度を向上
せしめる。The present invention uses a positive radiation-sensitive organic polymer material for the so-called intermediate layer and protective layer constituting the color separation filter, and the processing of the filter is made by stacking no more than two layers. Make it easier and improve machining accuracy.
本発明に用いるに有用な放射線感応性有機高分子材料は
次の如きものが掲げられる。The following radiation-sensitive organic polymer materials are useful for use in the present invention.
ノン
(1) ポリ・アルキメ・メタクリレート又はその共重
合体
CH3
但し、R+はアルキキ基1例えば、CH3゜C,H。Non (1) Poly-alkyme methacrylate or its copolymer CH3 However, R+ is an alkyl group 1, for example, CH3°C,H.
(2) ポリグリシジル・メタクリレート又はその共重
合体
CH3
1
(3) ポリメタクリルアミド
CH3
モCH2−C+。(2) Polyglycidyl methacrylate or its copolymer CH3 1 (3) Polymethacrylamide CH3 moCH2-C+.
0NH2 (4)ポリメチルインプロペニルケトンH3 モCH2−C→0 OCH3 CH2 CI(3 (6) ポリイソブチレン CH3 ■ そCH2−C+。0NH2 (4) Polymethylimpropenylketone H3 MoCH2-C→0 OCH3 CH2 CI(3 (6) Polyisobutylene CH3 ■ So CH2-C+.
CH3
これらの例以外のポジ型の放射線感応性有機高分子材料
を使用し得ることはいうまでもない。CH3 It goes without saying that positive-type radiation-sensitive organic polymer materials other than these examples may be used.
もちろん、紫外線、電子線、X線に感応性のものも使用
し得るものであ91本明細書でこれらを「放射線感応性
」なる用語を用いる。Of course, those sensitive to ultraviolet rays, electron beams, and X-rays can also be used, and in this specification, these are referred to as "radiation sensitive."
前述した放射線感応性材料のなかで、たとえばポリグリ
シジルメタクリレート、ポリメチルメタクリルアミドお
よびポリメチルメタクリレートとの共重合体に属するポ
リメチルメタクリレ−)−メタクリロイルクロリド共重
合体は熱架橋性の拐料である。Among the radiation-sensitive materials mentioned above, for example, polyglycidyl methacrylate, polymethyl methacrylamide, and poly(methyl methacrylate)-methacryloyl chloride copolymer belonging to copolymers with polymethyl methacrylate are thermally crosslinkable additives. be.
この様な材料の場合、たとえば中間層を塗布した後、熱
架橋を生ずる程度の温度で加熱することによって、中間
層の耐水性は向上し、耐染色層としてよシ有効に作用す
る。In the case of such a material, for example, by applying the intermediate layer and heating it at a temperature sufficient to cause thermal crosslinking, the water resistance of the intermediate layer is improved and it acts more effectively as a dye-resistant layer.
加熱温度および時間は各々200°015分間程度行な
えば架橋による高分子化は相当程度進行し、前記の耐水
性等の向上が生じる。If the heating temperature and time are about 200 DEG C. and about 15 minutes, polymerization due to crosslinking will proceed to a considerable extent, resulting in the above-mentioned improvement in water resistance, etc.
以下、本発明を具体例に従って詳細に説明する。 Hereinafter, the present invention will be explained in detail according to specific examples.
第1図から第4図までは本発明のカラー用固体撮廉累子
の製一工程を示す。いずれも素子の主要部の断面図であ
る。第5図はその平面図である。1 to 4 show the manufacturing process of the color solid-state camera of the present invention. Both are cross-sectional views of the main parts of the elements. FIG. 5 is a plan view thereof.
カラー用固体撮像累子基板1には多数の光検知部10お
よびこれらを駆動する駆動回路部11が少なくとも形成
されている。一般に基板1はシリコンで作製されている
。光検昶部は、これを動作させるだめの周辺回路を形づ
くる半導体集積回路と同一基材で作られる場合と、刈株
の半導体材料を用いる場合などがある。At least a large number of photodetecting sections 10 and a drive circuit section 11 for driving them are formed on the color solid-state image sensor substrate 1. As shown in FIG. Generally, the substrate 1 is made of silicon. The optical detection section may be made of the same base material as the semiconductor integrated circuit that forms the peripheral circuitry that operates it, or it may be made of semiconductor material from tree stubble.
こうしたカラー用固体撮像素子基板上に色分解フィルタ
の母材の層を厚さ0.5〜2.5μm程度形成する。こ
の母材は一般にゼラチン、卵白、グルー、カゼイン、ア
ラビアゴムおよびポバール等に感光性を与えた材料が用
いられる。感光特性としてはネガ型を用い365nmな
いし435 nmに感度を持たせるのが一般的である。A layer of a base material of a color separation filter is formed to a thickness of about 0.5 to 2.5 μm on such a color solid-state image sensor substrate. This matrix is generally made of gelatin, egg white, glue, casein, gum arabic, poval, or the like, which has been made photosensitive. As for photosensitive characteristics, it is common to use a negative type and have sensitivity in the range of 365 nm to 435 nm.
この層にマスク露光法で第1色目の部分17だけ光硬化
させ現像することによって1色分解フィルタ母材の部分
17だけが残される。この部分に所定の分光特性を有す
る染色で染色する。なお、染色法を従来から行なわれて
いる染料水溶液を用いる方法で良い。By photo-curing only the first color portion 17 of this layer using a mask exposure method and developing it, only the portion 17 of the one-color separation filter base material remains. This area is stained with a dye having predetermined spectral characteristics. Note that the dyeing method may be a conventional method using an aqueous dye solution.
なお、この第1色目のフィルタ母料の層を形成する際、
基板1の表面に約0.5〜1μmの厚さに有機高分子材
料の保護層16を形成しておくのが好ましい。この有機
高分子材料の被膜によって基板表面がより平坦化される
。これによって次の様な利点を生ずる。Note that when forming this first color filter matrix layer,
It is preferable to form a protective layer 16 of an organic polymer material on the surface of the substrate 1 to a thickness of about 0.5 to 1 μm. The surface of the substrate is further planarized by this coating of organic polymer material. This brings about the following advantages.
(1)基板1中に設けられた半導体装置部分に対し、不
純物等の汚染の保護効果が生ずる。(1) The semiconductor device portion provided in the substrate 1 is protected from contamination such as impurities.
(2) 基板1の光面が平坦化され、この上部に形成さ
れる中間層18、フィルタ母材の層等の形成が容易にな
ると共に、特に中間層の変形に伴ない生ずる染色時の混
色を防止することが出来る0
(3)色フィルタの加工工程で、不純物の付着面積が小
さくなり、基板中の半導体装置の汚染防止に有用である
。(2) The optical surface of the substrate 1 is flattened, making it easier to form the intermediate layer 18, the filter base material layer, etc. formed on top of the optical surface, and also reducing color mixture during dyeing, which occurs especially due to deformation of the intermediate layer. (3) In the color filter processing process, the adhesion area of impurities is reduced, which is useful for preventing contamination of semiconductor devices in the substrate.
なお、この有機高分子材料も前述の中間層等を形成する
ための放射線感応性有機高分子材料を用いるのが、後の
加工に有利である。Note that it is advantageous for later processing to use a radiation-sensitive organic polymer material for forming the above-mentioned intermediate layer and the like as the organic polymer material.
なお、本件ではポリグリシジルメタクリレートを用いた
。In this case, polyglycidyl methacrylate was used.
次いで透明な耐染色性の中間層18を厚さ0.5〜15
μmに被覆する。第1図がこの状態である0この中間層
に前述の放射線感応性有機高分子材料を用いる0この場
合、色分解フィルタ母材の感光特性と異なる放射線感応
特性を有する如く選択するのが良いことは前述した。Next, a transparent dye-resistant intermediate layer 18 is formed to a thickness of 0.5 to 15 mm.
Coat to μm. This state is shown in Figure 1. The above-mentioned radiation-sensitive organic polymer material is used for this intermediate layer. In this case, it is best to select a material that has radiation sensitivity characteristics different from those of the color separation filter base material. was mentioned above.
この2層の保護層(16,18)をボンデインある。露
光時間は3kW水銀ランプを約10 amの距離で約5
分間とした。These two protective layers (16, 18) are bonded. Exposure time is approximately 500 ms using a 3kW mercury lamp at a distance of approximately 10 am.
It was set as 1 minute.
次に1色フィルタ母材の層を形成し、マスク露光法で露
光し、現像を施こし、第2色目のフィルタ部分19を形
成、所定の分光特性を有する染料で染色する。更に透明
な中間層20を被膜する。Next, a layer of a one-color filter base material is formed, exposed by a mask exposure method, and developed to form a second color filter portion 19, which is dyed with a dye having predetermined spectral characteristics. Furthermore, a transparent intermediate layer 20 is applied.
次いで保@膜20を前述と同様に所望部分除去の加工を
施こす。露光時間は約30秒である。Next, the protective film 20 is processed to remove a desired portion in the same manner as described above. Exposure time is about 30 seconds.
なお、中間層、保護膜もポジ型の放射線感応性有機高分
子材料を用いる。Note that the intermediate layer and the protective film are also made of a positive radiation-sensitive organic polymer material.
以上の工程で色分解フィルタが形成される。A color separation filter is formed through the above steps.
なお1色フィルタ形成のための染色は従来法に従って、
染料の調合、コンテント、染色液の温度染色時間を決め
れば良い。In addition, dyeing for forming a one-color filter was carried out according to the conventional method.
All you have to do is decide on the dye formulation, content, dyeing solution temperature and dyeing time.
本件で第1色目にはシアンとし、たとえばチパ・クロム
ターキシプル(商品名)で染色、第2色目はカヤノール
イエローNsGで黄色に染色した。こうしてボンディン
グ・バット部等が開孔される。第5図はカラー用固体撮
像素子の平面図である。シリコンチップ基板内に図のよ
うに光検知部14と光検知部を駆動する回路15および
ボンディング部11が配置されている0光検知部には前
記の方法によシモザイク状等の色フィルタが形成されて
いる。ボンディング部のフィルタ材は前記の方法で除去
し、ボンディング・バットは4出させである。次にAu
、又はAl−8i(Si含有量0.5〜1wt%)をボ
ンディング・バットに超音波ボンドする。あるいはAu
−8n(Au含有量10wt%)をAu製ボンディング
・バットに熱圧着でも良い。In this case, the first color was cyan, for example, dyed with Chipa Chrome Taxiple (trade name), and the second color was dyed yellow with Kayanol Yellow NsG. In this way, the bonding butt portion and the like are opened. FIG. 5 is a plan view of the color solid-state image sensor. As shown in the figure, a photodetector 14, a circuit 15 for driving the photodetector, and a bonding section 11 are arranged in the silicon chip substrate.A color filter such as a mosaic pattern is formed in the photodetector by the method described above. has been done. The filter material in the bonding part was removed by the method described above, and the bonding butt was made to have 4 holes. Next, Au
, or Al-8i (Si content 0.5 to 1 wt%) is ultrasonically bonded to a bonding bat. Or Au
-8n (Au content: 10 wt%) may be thermocompression bonded to an Au bonding bat.
こうしてカラー用固体盪像系子が完成する。In this way, a color solid-state imaging system is completed.
本例の如く、フィルタの中間層、保護膜としてポジ型の
放射線有機高分子材料を用い、且2層を越えない積層数
でこれを加工することによって次の如き欠点を除き得る
。As in this example, the following drawbacks can be eliminated by using a positive radiation organic polymer material as the intermediate layer and protective film of the filter, and by processing it with a laminated number of no more than two layers.
例えば(1)色フィルタ層を形成するときにフィルタの
母材となっているゼラチンがごく薄く通常単分子膜位と
薄い被膜が保護層間に介在して露光時の吸収層となって
露光を防害したり現像時では現像液の下層への浸透防害
層となるため加工困難となってくる。また(2)ゼラチ
ンと保護層との接着性を改善したり、保護層の表面の水
に対するぬれ住改善を行うと保護層の表面が変質し、変
質層がゼラチンの薄い膜と同様に防害する。色フイルタ
加工にともなって、次第に保護膜は加工困難となってく
る。(3)3〜5層となると露光時間が長くなり。For example, (1) when forming a color filter layer, gelatin, which is the base material of the filter, is very thin and usually has a monomolecular layer, and a thin film is interposed between the protective layers and acts as an absorbing layer during exposure to prevent light exposure. It becomes difficult to process because it becomes a damage prevention layer when the developing solution penetrates into the lower layer during development. In addition, (2) improving the adhesion between gelatin and the protective layer or improving the wettability of the surface of the protective layer against water will cause the surface of the protective layer to change in quality, and the damaged layer will act as a protection against damage in the same way as a thin film of gelatin. . As color filters are processed, it becomes increasingly difficult to process the protective film. (3) When there are 3 to 5 layers, the exposure time becomes long.
通常の経済的な露光時間内におさまらなくなる。The exposure time will not subside within normal economical exposure times.
露光光源強度を大入くシたり、現像中に超音波を作用し
たりする方法があるが、超音波の方法ではフィルタにク
ラック等の欠陥が発生する。光源強度upではランプの
容量upをはかる必要があるが、遠紫外成分の割合が小
さいので熱線放出等が問題となシ、光源強度のupはむ
ずかしい。There are methods such as increasing the intensity of the exposure light source or applying ultrasonic waves during development, but the ultrasonic method causes defects such as cracks in the filter. In order to increase the light source intensity, it is necessary to increase the capacity of the lamp, but since the proportion of far ultraviolet components is small, heat ray emission is a problem, and it is difficult to increase the light source intensity.
本発明は保護層の変質に対処し、ポジ型の放射線感応性
の保護層の特性を生かし、経済的である。The present invention addresses the deterioration of the protective layer, takes advantage of the properties of the positive radiation-sensitive protective layer, and is economical.
本実施例は補色型で2色タイプのため、保護膜は3層で
あり、2層重ね露光と単層の露光加工の組合せによって
、ボンディング部分の保護膜の除去を行った例である。Since this example is a complementary color type and a two-color type, the protective film is three layers, and this is an example in which the protective film at the bonding portion was removed by a combination of two-layer overlapping exposure and single-layer exposure processing.
本実施例以外では、はじめに保護膜16を加工し、Cy
an、Yellow等の色フィルタを形成し。In cases other than this embodiment, the protective film 16 is first processed and the Cy
A color filter of an, yellow, etc. is formed.
最終保護膜20を形成して、保護膜18.20の2層を
同時に加工する方法もある。There is also a method of forming the final protective film 20 and processing the two layers of protective films 18 and 20 at the same time.
またRGB型やCyan、Yellow、 Black
型などのよシ多層色フィルタの場合には保護膜の層数も
多くなり1色々の組合せの加工が考えられ、また組合せ
によって加工が可能となる。Also, RGB type, Cyan, Yellow, Black
In the case of multilayer color filters such as molds, the number of layers of the protective film increases, and various combinations of processing can be considered, and processing becomes possible depending on the combination.
また保護膜16のような撮像素子の表面の保護層を省略
する場合もあるが、このような場合にも組合せによって
保護層の加工が容易となってくる。Further, there are cases where a protective layer such as the protective film 16 on the surface of the image sensor is omitted, but even in such a case, the processing of the protective layer becomes easier depending on the combination.
第1表にフィルタ母材および中間層および保護層の他の
具体例を示す。Table 1 shows other specific examples of the filter base material, intermediate layer, and protective layer.
なお、保護膜はポジ型がよい。これは加工において強い
紫外線によって色フィルタが変質する材料のものがあり
、紫外線を照射しないポジ型はその点心配がない〇
〔発明の効果〕
以上の如く1本発明の固体撮像素子は、作業性に優れた
ものである。Note that the protective film is preferably of positive type. Some materials are made of materials whose color filters are altered by strong ultraviolet rays during processing, but there is no need to worry about this with positive types that are not irradiated with ultraviolet rays. [Effects of the Invention] As described above, the solid-state image sensor of the present invention has the advantage of workability. It is excellent.
第1図より第4図は本発明のカラー用固体撮像素子の製
造方法を示す素子断飢図、第5図はカラー用固体撮像素
子の平面図である。
1・・・・・・固体撮像素子基板、16・・・・・・保
護膜、17.19・・・・・・色フイルタ部、18・・
・・・・中間層、20・・・・・保護膜。
第 1 図
/i
第 3 図
第 5 図
/ /1 to 4 are device diagrams showing a method of manufacturing a color solid-state image sensor according to the present invention, and FIG. 5 is a plan view of the color solid-state image sensor. 1...Solid-state image sensor substrate, 16...Protective film, 17.19...Color filter section, 18...
...Intermediate layer, 20...Protective film. Figure 1/i Figure 3 Figure 5//
Claims (1)
基体の上部に、この光検知要素に対応して色分解用フィ
ルター部が設けられ、前記色分解用フィルター部は所望
形状且所定の分光特性を有するフィルター層および透光
性のポジ型放射線感応性有機高分子材料層が所定の数だ
け順次積層されてなることを特徴とする固体撮像素子0A color separation filter section is provided on the top of a semiconductor substrate having a photodetection section in which a plurality of photodetection elements are arranged, and the color separation filter section has a desired shape and a predetermined spectral distribution. A solid-state imaging device 0 characterized in that a predetermined number of filter layers having specific characteristics and transparent positive radiation-sensitive organic polymer material layers are sequentially laminated.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59135128A JPS6041004A (en) | 1984-07-02 | 1984-07-02 | Solid-state image pickup element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59135128A JPS6041004A (en) | 1984-07-02 | 1984-07-02 | Solid-state image pickup element |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6041004A true JPS6041004A (en) | 1985-03-04 |
Family
ID=15144464
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59135128A Pending JPS6041004A (en) | 1984-07-02 | 1984-07-02 | Solid-state image pickup element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6041004A (en) |
-
1984
- 1984-07-02 JP JP59135128A patent/JPS6041004A/en active Pending
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