JPS604009A - Slicing device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION This invention relates to an apparatus for cutting a cylindrical ingot of silicon or the like into thin pieces to make wafers in a semiconductor manufacturing process.

Generally, a method for cutting an ingot is to rotate a rotating body at high speed, which is equipped with a thin annular blade having a cutting edge on the inner periphery, and to press the ingot against the inner periphery of the blade to cut out wafers. The main mechanism is that the main shaft is installed vertically, and the annular blade is installed horizontally and rotates.
A vertical method of cutting ingots has been adopted.

A horizontal method has also been used in which an annular blade is attached vertically to a main shaft provided in the horizontal direction and the ingot is set horizontally for cutting. In either case, in the conventional method, the ingot holding and moving mechanism is located on the opposite side of the main shaft from the blade attachment part, which is disadvantageous in terms of ensuring rigidity, and when replacing or adjusting the blade, the ingot and its holding and moving mechanism are located on the opposite side of the main shaft. This has the disadvantage that it gets in the way and impairs operability. Furthermore, there is a problem in that the cut wafer must be removed from the central hole of the blade. Furthermore, in recent years, there has been a trend for ingots to become larger in diameter and longer, but this has caused problems such as difficulty in maintaining the vibration rigidity of the ingot holding and moving mechanism.

The present invention fundamentally reconsiders the conventional structure and provides a slicing device with a novel mechanical configuration that solves the above-mentioned problems. As previously mentioned, the structure was such that the ingot was fed into the annular blade from the opposite side of the spindle to cut it, but in the present invention, the ingot was cut from the spindle side.
In other words, it is configured to be fed through a hollow main shaft,
The structure ensures sufficient stroke necessary to cut the ingot, and allows for the angle adjustment (normally about ±7 degrees) necessary to align the cutting direction of the ingot with its crystal axis without any problems. It is.

FIG. 1 shows a conventional vertical type slicing device,
The ingot 1 is held by a support moving part 3 and cut by an inner circumferential edge of an annular blade 2 stretched horizontally on a bowl-shaped rotating body 4 provided at the upper end of the main shaft. In contrast to this conventional method, The vertical system of the present invention is shown in the figure, and the rotating body 5 with the annular blade 2 stretched on its upper surface has a ring-shaped structure, and is attached and fixed to the main shaft portion 6. The rotating body 5 is rotated integrally with the main shaft by appropriate means. Here, the ingot holding and moving part 3 is provided on the fixed bed 10 side so that the ingot 1 is fed from the side opposite to the blade attachment part of the rotating body 5 (lower side in FIG. 2). Then, the ingot 1 is pressed against the blade 2, and the wafer is sliced by a movement of cutting and feeding (horizontal direction interlocking) and intermittent upward movement at a predetermined pitch.

By adopting such a structure, the ingot can be reliably attached to the large fixed bed 10 at the bottom of the apparatus with strong rigidity. There is no ingot or its holding/moving mechanism above the blade, and there is a large space above the blade, so the equipment for collecting the cut ingots, the management equipment for the cutting surface of the ingot and the annular blade, the coolant equipment, etc. can be moved freely. In particular, there is an advantage that a simple mechanism can be used as a wafer recovery device. In addition, it is convenient for operations such as blade replacement and adjustment, and work efficiency is greatly improved.

FIG. 3 shows a horizontal conventional system, in which the ingot 1 is held horizontally by a holding and moving section 3, and moves and cuts toward an annular blade 2 mounted vertically on a rotating section.

In this case too, people cannot stand in front of the blade and work.
It was difficult to replace and adjust the blade, and in order to improve operability, it was necessary to create a structure that allows the ingot holding and moving part to escape, making it difficult to ensure dynamic rigidity.

An annular blade 2 is attached, and a holding and moving part 3 for an ingot 1 is provided on the left side thereof, that is, on the opposite side to the attachment part of the blade. In this structure, the front of the blade is wide (empty), so the operability is very good, and the bed 11 to which the holding and moving part 3 of the ingot 1 is attached can be a fixed part integrated with the main shaft part 8. As a result, high rigidity can be obtained, and generation of a process-affected layer on the wafer due to vibration can be prevented or minimized.Furthermore, it is extremely easy to provide the various accessory devices described above, including the wafer recovery device.

In the above description, the rotating body is ring-shaped, but this means that the ingot is placed inside the rotating body, and that the inclination angle of this can be adjusted to about ±7° to align the crystal axis. Since it is necessary to have an inner diameter dimension that can secure a cutting stroke, it is of course possible to appropriately select a shape within a range where this is possible in a preferred example.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram of the structure of a conventional vertical slicing device, FIG. 2 is an explanatory diagram of the structure of the vertical slicing device of the present invention, FIG. 3 is an explanatory diagram of the conventional horizontal structure, and FIG. 4 is an explanatory diagram of the horizontal structure of the present invention. 1: Ingot 2: Annular blade 3: Ingot holding and moving part 5: Rotating body 6.8: Main shaft part 10.11: Fixed bed patent applicant Tokyo Seimitsu Co., Ltd.

Claims (1)

[Claims] In an internal blade type slicing device for cutting silicon ingots into wafers, a ring-shaped rotating body with an annular blade attached to one side of the main shaft is provided, and an ingot holding and moving part is provided on the opposite side of the attachment part of the annular blade. A slicing device comprising: