JPH04321226A - Wafer manufacturing apparatus - Google Patents

Abstract

PURPOSE:To further enhance the degree of smoothness on the edge of an ingot by a method wherein a means to turn the ingot performs a grinding operation according to an in-feed system in conjunction with a means to turn an abrasive wheel. CONSTITUTION:An ingot 1 is turned to the direction of B by a rotation means connected to an ingot fixation part 2. A blade 4 is attached to the upper part of a hollow spindle 3 provided at the lower part of the ingot fixation part 2. The blade 4 is provided, at its inside, with a blade 4a used to slice the ingot. The blade 4 is turned at high speed as the hollow spindle 3 is turned. A cup abrasive wheel 6 is fixed to the upper part of a holding shaft arranged in the central part of the hollow spindle 3. A rotation means is connected to the holding shaft; the holding shaft 5 and the cup abrasive wheel 6 which is fixed to the holding shaft are turned to the direction of C by the rotation means. Thereby, the tip face 1b of the ingot 1 is grounded.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer manufacturing apparatus for manufacturing wafers such as silicon wafers by slicing columnar ingots.

0002

[Prior Art] Conventionally, in order to manufacture wafers by slicing a columnar ingot of silicon or the like, a hole in the center of a donut-shaped blade that rotates at high speed and has a blade on the inner periphery is used to cut the ingot to the thickness of the slice. A wafer manufacturing apparatus is used that slices the ingot into wafers by inserting the ingot into wafers and pressing the ingot directly against a blade.

0003

Problem to be Solved by the Invention The conventional wafer manufacturing apparatus described above has a problem of poor flatness due to residual slicing. Particularly in recent years, the diameter of ingots (wafers) has increased, and this has resulted in increasingly poor flatness. In order to solve this problem, a method has been proposed in which a grindstone is provided and the sliced end face of the ingot is ground (see Japanese Patent Laid-Open No. 106207/1983).
.

However, the method described in JP-A-61-106207 uses a so-called creep feed method in which the end face of the ingot is ground by moving the rotating cup grindstone and the ingot relatively linearly. Since it involves grinding, the grinding resistance is large, and the grinding also leaves a problem that the flatness cannot be increased significantly even after grinding.

SUMMARY OF THE INVENTION In view of the above circumstances, it is an object of the present invention to provide a wafer manufacturing apparatus equipped with a grinding means that can further improve the flatness of the ingot end face.

[0006]

[Means for Solving the Problems] A wafer manufacturing apparatus of the present invention that achieves the above object includes an ingot fixing part for fixing a columnar ingot, and a cutting blade for slicing the ingot fixed to the ingot fixing part into wafers. a grindstone for grinding the end surface of the ingot fixed to the ingot fixing part sliced by the cutting blade; a first rotation means for rotating the grindstone; and a first rotation means that cooperates with the first rotation means. The present invention is characterized in that it includes a second rotating means for rotating the ingot fixing part, which performs in-feed type grinding.

[0007]

[Operation] The wafer manufacturing apparatus of the present invention rotates the ingot fixed to the ingot fixing part by the second rotating means, thereby enabling infeed grinding. Since the in-feed method can reduce the grinding speed, the grinding resistance of the wafer is lower than that of the creep-feed method, and the ground surface of the wafer is more stable.It is also structurally less susceptible to changes in mechanical accuracy than the creep-feed method, so it can produce a flat surface. degree will improve. By performing this in-feed grinding at the time of slicing, the flatness of one side of the wafer can be finished with higher precision than creep-feed grinding.

[0008]

Embodiments Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a mechanical explanatory diagram of a wafer manufacturing apparatus according to an embodiment of the present invention, and FIG. 2 is a bottom view taken along the line XX' shown in FIG. An upper surface 1 a of a cylindrical ingot 1 made of silicon, for example, is fixed to an ingot fixing part 2 . This ingot fixing part 2 is configured to be moved in the vertical direction and the horizontal direction in FIG. 1 by a moving means (not shown). Further, a rotating means (not shown) is also connected to this ingot fixing part 2, whereby the ingot 1 fixed to the ingot fixing part 2 is rotated in the direction of arrow B. Further, a hollow spindle 3 is provided below the ingot fixing part 2, and a blade 4 is attached to the upper part of the hollow spindle 3. This blade 4
has a donut shape as a whole and is provided with a blade 4a for slicing the ingot inside. Since this blade 4 is attached to the hollow spindle 3, it rotates at high speed as the hollow spindle 3 rotates. Further, a holding shaft 5 is arranged at the center of the hollow spindle 3, and a cup grindstone 6 is fixed to the upper part of the holding shaft 5. A rotating means (not shown) is connected to the holding shaft 5, and the holding shaft 5 and the cup grindstone 6 fixed to the holding shaft 5 are rotated in the direction of arrow C by this rotating means.

In the wafer manufacturing apparatus configured as described above, when slicing the ingot 1 into wafers, the ingot fixing part 2 is lowered while the blade 4 is rotating at high speed, and the tip of the ingot 1 is sliced into one wafer. An amount corresponding to the wafer is inserted into the central opening of the blade 4, and then the ingot 1 is moved in the direction shown by arrow A. As a result, the tip of the ingot 1 is sliced into wafers of a predetermined thickness.

Thereafter, the ingot fixing portion 2 and the ingot 1 return to the position shown in FIG. 1, and further descend until the tip end surface 1b of the ingot 1 and the upper surface 6a of the cup grindstone 6 come into contact (see FIG. 2). In this state, the ingot fixing part 2 rotates in the direction of arrow B, and the holding shaft 5 rotates in the direction of arrow C, thereby grinding the tip surface 1b of the ingot 1. This grinding is an infeed grinding method in which grinding is performed by rotating both the ingot 1 and the cup grindstone 6 in the state shown in FIG. ingot 1
The flatness of the tip end surface 1b, and thus one side of the wafer, can be finished with high precision. Since the other side of the wafer is finished with high precision, the flatness can be increased by, for example, fixing this side to a flat surface with an air suction function and grinding the other side. .

In the above embodiment, a hollow spindle 3 is provided to fix and rotate the blade 4, but if this spindle is not hollow, a grindstone 6 may be placed next to the blade 4, and the ingot fixing part 2 The present invention is not limited to the above-mentioned embodiments, but may be modified in various ways, such as increasing the movement stroke of.

0012

As explained above, the wafer manufacturing apparatus of the present invention includes a second rotation means for rotating an ingot, and performs infeed type grinding in cooperation with the first rotation means for rotating a grindstone. Since this is carried out, the flatness of the end face of the ingot, and thus one side of the wafer, can be finished with high precision.

[Brief explanation of drawings]

FIG. 1 is an explanatory diagram of a mechanism of a wafer manufacturing apparatus according to an embodiment of the present invention.

FIG. 2 is a bottom view taken along the line X-X' shown in FIG. 1;

[Explanation of symbols]

1 ingot
2 Ingot fixing part 3 Hollow spindle
4 Blade 4a Blade
5
Holding shaft 6 Cup grindstone

Claims (1)

[Claims] 1. An ingot fixing part for fixing a columnar ingot, a cutting blade for slicing the ingot fixed to the ingot fixing part into wafers, and a cutting blade for slicing the ingot fixed to the ingot fixing part by the cutting blade. a grindstone for grinding the ingot end face, a first rotation means for rotating the grindstone, and a second rotation means for rotating the ingot fixing part, which performs infeed type grinding in cooperation with the first rotation means. A wafer manufacturing apparatus characterized by comprising a rotating means.