JP3624441B2 - Ingot grooving device - Google Patents

Description

[0001]
[Industrial application fields]
The present invention relates to an ingot grooving device such as silicon.
[0002]
[Prior art]
A wafer is usually cut out by slicing a silicon ingot formed in a cylindrical shape to an appropriate thickness with a wire saw. In this cutting, the silicon ingot is fixed and the wire saw is rotated along the circumferential direction so as to be cut at a constant pitch.
[0003]
[Problems to be solved by the invention]
However, according to the cutting method as described above, the position of the wire saw may be displaced or the bending of the wire saw may occur. Also, if the silicon ingot has a misalignment of the axis, the crystal orientation is deviated and a low-quality wafer is cut out. There's a problem.
The present invention has been made to solve such a conventional problem, so that when the silicon ingot is cut by the wire saw, the position of the wire saw is not shifted or the bending of the cutting is not caused, and the crystal orientation of the silicon ingot is not shifted. Another object of the present invention is to provide an ingot grooving device in which a guide groove for cutting is attached to the outer periphery of a silicon ingot prior to cutting a wire saw.
[0004]
[Means for Solving the Problems]
As means for technically solving the above problems, the present invention provides a holding table for holding an ingot, a position adjusting means for adjusting the position of the holding table holding the ingot, and a table rotating means for rotating the holding table. And at least groove forming means for forming a groove on the outer periphery of the ingot, and position indexing means for determining the position of the groove forming means,
The position adjusting means includes an angle adjusting unit that adjusts an upper surface angle of the holding table, an X-axis adjusting unit that moves the holding table in the X-axis direction, and a Y-axis adjusting unit that moves in the Y-axis direction,
The angle adjustment unit includes a plurality of height adjustment members provided in a circumferential direction between the X-axis movement table constituting the X-axis adjustment unit and the holding table.
The rotary table that rotates the holding table with the position adjusting means provided thereon is rotated by a base including the table rotating means provided at the lower part.
The gist of the ingot grooving apparatus is to align the axis of the ingot held on the holding table with the central axis of the rotary table.
Further, the gist of the position indexing means is that the groove forming means is indexed in the Z-axis direction, and the groove forming means advances and retracts the blade.
[0005]
[Operation]
Prior to cutting the silicon ingot with a wire saw, a cutting guide groove is provided along the circumferential direction of the silicon ingot, so that there is no position shift or bending of the wire saw, and the crystal due to the inclination of the axis of the ingot. It is possible to cut out a high-quality wafer by adjusting the position of the holding table by the position adjusting means so as not to cause a deviation in orientation.
[0006]
【Example】
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
In FIG. 1, reference numeral 1 denotes a holding table for holding an ingot such as a silicon ingot 2, and the silicon ingot 2 is fixed in a vertical state by, for example, wax down.
[0007]
Reference numeral 3 denotes a position adjusting means for adjusting the position of the holding table 1, an angle adjusting unit 3a for adjusting the upper surface angle of the holding table 1, and an X-axis adjusting unit 3b for moving the holding table 1 in the X-axis direction. And a Y-axis adjusting portion 3c that moves in the Y-axis direction.
[0008]
The angle adjusting unit 3a is composed of, for example, height adjusting members such as piezoelectric elements and screws provided between the X-axis moving table 4 and the holding table 1 at a predetermined interval in the circumferential direction. The upper surface angle of the holding table 1 can be easily changed by appropriately adjusting the height adjusting member.
[0009]
The X-axis adjusting unit 3b is configured by an X-axis moving mechanism 5 such as a ball screw provided on the X-axis moving table 4 and the Y-axis moving table 6, and the Y-axis adjusting unit 3c is the Y-axis moving table 6. And a Y-axis moving mechanism 7 such as a ball screw provided on the rotary table 8.
[0010]
Further, the rotary table 8 is rotated by a base 9 including a table rotating means provided in the lower portion thereof, and the holding table 1 can be rotated via the position adjusting means 3 by this table rotating means (not shown). It is.
[0011]
Reference numeral 10 denotes a position indexing means, which is erected on the side of the base 9 so that the groove forming means 11 can be moved in the Z-axis direction so that the position to be grooved on the outer periphery of the silicon ingot 2 can be determined.
[0012]
The groove forming means 11 includes a Z-axis moving body 11a that is moved by, for example, a ball screw of the position indexing means 10, a spindle unit 11b that moves forward and backward with respect to the Z-axis moving body 11a, and a tip portion of the spindle unit 11b. The spindle 11c is attached downward, and the rotary blade 12 is attached to the lower end of the spindle 11c.
[0013]
The ingot grooving apparatus according to the present invention is configured as described above, and as described above, the silicon ingot 2 is fixed vertically on the holding table 1 by wax down or the like, and the rotating blade is rotated while the holding table 1 is rotated. 12, guide grooves 13 can be formed on the outer periphery of the silicon ingot 2 at a constant pitch.
[0014]
At this time, if the axis of the silicon ingot 2 and the rotation center of the holding table 1 are deviated, the silicon ingot 2 causes a circular motion, but the X-axis moving table 4 and the Y-axis moving table 6 are appropriately moved. If the axis of the silicon ingot 2 is aligned with the rotation center of the rotary table 8, the silicon ingot 2 can be rotated around the axis by the rotation of the rotary table 8.
[0015]
Further, if the axis of the silicon ingot 2 is not vertical, a circular motion due to a shake will occur, but the axis of the silicon ingot 2 is made vertical by adjusting the upper surface angle of the holding table 1 by the angle adjusting unit 3a. If the adjustment is performed, the silicon ingot 2 can be rotated around the axis without causing the center shake.
[0016]
Accordingly, when the silicon ingot 2 is fixed on the holding table 1 by wax-down or the like, it is fixed in a substantially vertical state at the substantially central portion of the holding table 1 and after the fixing, the position adjusting means 3 is operated as described above. The ingot 2 can be adjusted to an appropriate position with respect to the rotary table 8. That is, since it is not necessary to strictly position the silicon ingot 2 with respect to the holding table 1 from the beginning, the operation becomes extremely easy.
[0017]
Thereafter, the position indexing means 10 determines the position to be grooved in the silicon ingot 2, and the rotating blade 12 cuts the guide groove 13 along the outer periphery of the silicon ingot 2 while lowering the Z-axis moving body 11a at a predetermined pitch. Set up. The cutting depth of the guide groove 13 can be set in advance to a predetermined depth by moving the spindle unit 11b back and forth.
[0018]
Thus, if the guide groove 13 is formed in the outer periphery of the silicon ingot 2 prior to cutting with a wire saw (not shown), the wire saw is guided by the guide groove 13 so that the wire It is possible to cut out a high-quality wafer without causing the saw position to slip or bend, and without causing a crystal orientation shift due to the inclination of the axis of the silicon ingot 2.
[0019]
【The invention's effect】
As described above, according to the present invention, prior to forming a wafer by cutting a silicon ingot with a wire saw, a guide groove is attached to the outer periphery of the silicon ingot in advance by a grooving device. It is possible to prevent misalignment and cutting bend in advance, and it is possible to cut out a high-quality wafer without deviation in crystal orientation, and to achieve excellent effects such as facilitating the cutting operation.
In addition, the grooving apparatus according to the present invention adjusts the holding table of the silicon ingot with the position adjusting means so that the axis of the silicon ingot can be easily aligned with the central axis of the rotary table and can be held vertically. The operation of fixing the silicon ingot to the holding table by wax down or the like may be relatively rough, and the operation is remarkably simplified.
[Brief description of the drawings]
FIG. 1 is a schematic perspective view showing an embodiment of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Holding table 2 ... Silicon ingot 3 ... Position adjustment means 3a ... Angle adjustment part 3b ... X-axis adjustment part 3c ... Y-axis adjustment part 4 ... X-axis movement table 5 ... X-axis movement mechanism 6 ... Y-axis movement table 7 ... Y-axis moving mechanism 8 ... rotary table 9 ... base 10 ... position indexing means 11 ... groove forming means 11a ... Z-axis moving body 11b ... spindle unit 11c ... spindle 12 ... rotating blade 13 ... guide groove

Claims (2)

A holding table for holding the ingot; a position adjusting means for adjusting the position of the holding table holding the ingot; a table rotating means for rotating the holding table; a groove forming means for forming a groove on the outer periphery of the ingot; and the groove And at least position indexing means for determining the position of the forming means,
The position adjusting means includes an angle adjusting unit that adjusts an upper surface angle of the holding table, an X-axis adjusting unit that moves the holding table in the X-axis direction, and a Y-axis adjusting unit that moves in the Y-axis direction,
The angle adjustment unit includes a plurality of height adjustment members provided in a circumferential direction between the X-axis movement table constituting the X-axis adjustment unit and the holding table.
The rotary table that rotates the holding table with the position adjusting means provided thereon is rotated by a base including the table rotating means provided at the lower part.
An ingot grooving device for aligning an axis of an ingot held on the holding table with a central axis of the rotary table . 2. The ingot grooving apparatus according to claim 1 , wherein the position indexing means indexes the groove forming means in the Z-axis direction, and the groove forming means advances and retracts the blade .

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