JPS6039891A - Method of producing conductor circuit for printed circuit - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a conductive circuit for a printed circuit, and more particularly to a method for manufacturing a conductive circuit for a printed circuit using a fully additive method in which a circuit pattern is formed by electroplating.

In recent years, as a method of manufacturing conductor circuits for printed circuits, instead of using a copper-clad laminate as a starting material, a method has been adopted in which the surface of the metal plate is masked with a resist material except for the part that will become the circuit pattern.
Metals such as copper are deposited on non-mask areas by electroplating and transferred onto the polymer material, or adhesive is applied to the polymer material, the surface other than the circuit pattern is masked with a two-stroke stripping agent, A method of forming a circuit pattern by electroless plating has been put into practical use.

By the way, forming a circuit pattern using the above-mentioned electroless meshing method is inefficient because it is necessary to mask the surface other than the circuit pattern with a resist material for each circuit board. The electric Mevki method described above has the advantage that once a single plating base jig is made, it can be used many times. As a metsukiresist, it has strong adhesion to metal plates, itI acidity, and wear resistance.

Heat resistance and non-stick properties are required. These requirements can be met by coating a resist material such as epoxy resin, modified polyamide resin, or polyimide resin with a continuous resin, silicone resin, or molybdenum disulfide. However, since the method of applying these resins to only necessary areas using a mask is carried out by screen printing, the pattern accuracy is limited to about 100 microns, and the overall pattern accuracy becomes worse as the plating is deposited. Some polyimide resins are cured by ultraviolet rays, and their use makes it possible to print paper patterns with high accuracy, but they have low adhesion to metal plates and lack durability.

The present invention has been made to eliminate these drawbacks, and makes it possible to manufacture highly accurate conductor circuits for printed circuits by a fully additive method. Embodiments of the present invention will be described in detail below with reference to the drawings.

Figure 1 shows the conventional electroplating method.
This is a schematic diagram showing a cross section of a metal plate 2 coated with a non-adhesive material 3, and then copper plated 4. FIG.
2 is a schematic diagram showing a cross section of copper plating 41 on titanium nitride 51 of FIG. FIG. 3 is a schematic cross-sectional view of the circuit board manufacturing paste jig after the copper plating 4, 1 shown in Figure 2 has been transferred.

〔Example〕

Put the titanium powder in an evaporation heater equipped with vacuum ionization plating, place the aluminum base plate 11 on the cathode part, and
After creating a high vacuum of "" Torr, nine elemental gases are introduced and a DC voltage is applied to evaporate the titanium powder while discharging it, and a titanium nitride film is deposited on the aluminum base plate 11 that has been set on the cathode. Coated to a thickness of 2 microns. Nitrogen gas is difficult to see because there is little difference in color tone from the aluminum primary plate 11 if only a titanium film is used, so titanium nitride was introduced to make it easier to understand the color tone. Next, a UV-curable resist agent is applied to the surface of the attached titanium nitride film using a roll coater, etc., followed by pre-baking and UV irradiation.

After the development and post-baking steps, the portion of the titanium nitride 51 that would become the circuit pattern was masked with a resist agent. Next, add 10 parts of sulfuric acid, 2 parts of aluminum sulfate, and immerse the aluminum base plate 11 in sulfuric acid of pure water.
1 was used as an anode, a pure aluminum plate was installed as a cathode, both camellia plates were placed facing each other, and current was applied for 10 minutes while applying a current of 3 A/dm,'. Within a few minutes, the titanium anhydride in the non-resist area dissolves, and the aluminum underlying it is oxidized, forming the passivation layer 1.
2 was formed. After sufficiently forming the passivation layer 12, the aluminum base plate 11 is washed with water, and then the aluminum base plate 1 is placed in a pure water tank.
1 was immersed in a pure water bath of 95 to 9 q"cK and held for 15 to 20 minutes to seal the anodized and passivated 1ii12. After the sealing process, the resist mask was peeled off using a special stripping agent. , washing with water 2, placing the aluminum base plate 11 in a copper sulfate aqueous solution as a cathode, and using pure copper as a positive brush, %5 A
/dm' for 10 minutes to form a copper plating 41 with a thickness of 7 to 8 microns on the titanium 9ide 51 of the aluminum base plate 11. The top of the passivation treatment layer 12 is made perforated, and screen printing is performed using a see-through grease mask using a solution containing a mixture of connecting resin and adhesive as a printing liquid, and the adhesive is heated and cured to make it non-conductive. After coating with the adhesive material 61, the silk plating 41 was peeled off with an adhesive tape to create a paste jig for manufacturing a circuit board having the cross section shown in FIG. 3.

This is because when the copper plating 41 is applied during screen printing, even if ink flows on the titanium nitride 51 due to printing misalignment, the ink will adhere to the copper plating 41 and prevent the ink from adhering to the pattern of the titanium nitride 51. , is unnecessary if there is no ink flow and no printing misalignment. A pace jig for manufacturing circuit boards (hereinafter referred to as a pace jig) was completed through the following two steps.

Next, the Beichiko jig was immersed in the copper sulfate solution, and the L base jig was used as the cathode, and the copper plate was connected to the positive electrode [7, so that the two poles faced each other,
5 A/dm” for 3 minutes, 1o A/drn, 15 minutes
Electricity was applied for a minute to deposit 1 tokki 41 on titanium nitride 51 to a thickness of 30 microns, resulting in the cross-sectional state shown in Figure ff12.

Apply a drying adhesive mainly composed of epoxy to a 100 micron polyimide film to make it into a B stage, and apply the adhesive surface to the copper metal of the pace jig. When the polyimide film and the pace jig are peeled off, the copper plating 41 is transferred to the polyimide film via the adhesive, and the pace jig is then heated and pressed again as shown in Fig. 3. That's it.

Thereafter, copper plating 41 was applied to the paste jig in the same manner, and the polyimide film VC copper plating 41 was transferred using an adhesive to manufacture a circuit board.

Since the present invention is manufactured as described in detail above, according to the conventional manufacturing method, the durability of the metskily resist mask is inferior due to the use of a polymer material for the metskily resist mask, but in the present invention, the durability of the metskily resist mask is inferior.・As a resist mask, it has the advantage of improving durability because the metal can be made into a non-conductor without removing the insulating part.

[Brief explanation of the drawing]

Figure 1 shows the conventional full-additive method.
Mizuko schematically shows a cross section of a pace jig with This is a schematic diagram showing the cross section of the pace jig.
This is a schematic diagram showing the cross section of the pace jig in the state where it has been peeled off.
Ru. 1...Metal base plate 2...Methochyrecyst 5...Non-adhesive material 4...Copper plating 11...Aluminum base plate 12 ...... Passivation layer 31 ... Non-adhesive material 41 ... Copper plating 51 ... Titanium 9ide or higher

Claims (1)

[Claims] In the production of conductor circuits for printed circuits in which circuit patterns are formed by plating, there is a process of attaching at least one type of stainless steel, nickel, chromium, titanium, etc. to a base plate of aluminum or its alloy. A step in which a part of the aluminum or metal that has been etched is removed by etching, leaving the alloy or metal attached only in the part that will form one circuit pattern, and the surface of the aluminum or its alloy that has been removed by etching is treated to become nonconductive. , a process of coating a non-adhesive material such as a continuous resin only on the surface that has been made non-conductive, and depositing a metal such as copper using an electroplating method on the surface of the attached alloy or metal pattern. 1. A method for manufacturing a conductor circuit for a printed circuit, which comprises transferring the metal onto a polymeric material serving as the base of a circuit board via an adhesive to form a circuit pattern on the polymeric material.