JPS6039855A - 液冷モジユ−ル - Google Patents
液冷モジユ−ルInfo
- Publication number
- JPS6039855A JPS6039855A JP58147777A JP14777783A JPS6039855A JP S6039855 A JPS6039855 A JP S6039855A JP 58147777 A JP58147777 A JP 58147777A JP 14777783 A JP14777783 A JP 14777783A JP S6039855 A JPS6039855 A JP S6039855A
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- refrigerant
- substrates
- cooling plate
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W40/73—
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58147777A JPS6039855A (ja) | 1983-08-12 | 1983-08-12 | 液冷モジユ−ル |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58147777A JPS6039855A (ja) | 1983-08-12 | 1983-08-12 | 液冷モジユ−ル |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6039855A true JPS6039855A (ja) | 1985-03-01 |
| JPH0342511B2 JPH0342511B2 (enExample) | 1991-06-27 |
Family
ID=15437945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58147777A Granted JPS6039855A (ja) | 1983-08-12 | 1983-08-12 | 液冷モジユ−ル |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6039855A (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5006925A (en) * | 1989-11-22 | 1991-04-09 | International Business Machines Corporation | Three dimensional microelectric packaging |
| JPH06169039A (ja) * | 1992-12-01 | 1994-06-14 | Kofu Nippon Denki Kk | 浸漬dc−dcコンバータ冷却器 |
| JP2018018857A (ja) * | 2016-07-25 | 2018-02-01 | 富士通株式会社 | 液浸冷却装置、液浸冷却システム、及び液浸冷却装置の制御方法 |
| CN117840459A (zh) * | 2024-03-06 | 2024-04-09 | 东北大学 | 一种配备冷却系统的激光定向能量沉积系统 |
-
1983
- 1983-08-12 JP JP58147777A patent/JPS6039855A/ja active Granted
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5006925A (en) * | 1989-11-22 | 1991-04-09 | International Business Machines Corporation | Three dimensional microelectric packaging |
| JPH06169039A (ja) * | 1992-12-01 | 1994-06-14 | Kofu Nippon Denki Kk | 浸漬dc−dcコンバータ冷却器 |
| JP2018018857A (ja) * | 2016-07-25 | 2018-02-01 | 富士通株式会社 | 液浸冷却装置、液浸冷却システム、及び液浸冷却装置の制御方法 |
| CN117840459A (zh) * | 2024-03-06 | 2024-04-09 | 东北大学 | 一种配备冷却系统的激光定向能量沉积系统 |
| CN117840459B (zh) * | 2024-03-06 | 2024-06-11 | 东北大学 | 一种配备冷却系统的激光定向能量沉积系统 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0342511B2 (enExample) | 1991-06-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6690314B2 (ja) | 電子機器 | |
| US4449580A (en) | Vertical wall elevated pressure heat dissipation system | |
| JP6790855B2 (ja) | 液浸冷却装置、液浸冷却システム及び電子装置の冷却方法 | |
| US4619316A (en) | Heat transfer apparatus | |
| JP5590128B2 (ja) | 冷却機器、冷却機器を有する電子機器及び発熱体の冷却方法 | |
| KR20060135928A (ko) | 컴퓨터 및 다른 전자 기기를 위한 써모싸이펀에 기반을 둔낮은 프로파일의 냉각 시스템 | |
| CN114828548B (zh) | 机箱、电子设备和机箱排气方法 | |
| US20240142513A1 (en) | Liquid cooled test system for testing semiconductor integrated circuit chips | |
| JPH05335454A (ja) | 電子機器の冷却装置 | |
| CN114846915A (zh) | 冷却模块 | |
| JPS6039855A (ja) | 液冷モジユ−ル | |
| TWI895742B (zh) | 用於電子系統之液體浸入式冷卻系統及電子系統之液體浸入式冷卻之方法 | |
| TWI837731B (zh) | 流體浸沒式冷卻系統及冷卻電子系統的方法 | |
| Ristic-Smith et al. | Compact two-phase immersion cooling with dielectric fluid for PCB-based power electronics | |
| JPH04372159A (ja) | 半導体装置の冷却装置及び冷却方法 | |
| JP5018555B2 (ja) | 冷却モジュール及び複合実装基板 | |
| JPS6154654A (ja) | 液冷装置 | |
| JPH04226057A (ja) | 浸漬液冷用冷媒及びこれを用いた沸騰液冷式電子機器 | |
| US5860583A (en) | Evaporative cooling vessel for controlling the temperature of a portion of an electronic part during solder reflow | |
| KR20090061397A (ko) | 인쇄회로기판 냉각장치 | |
| CN115315135A (zh) | 具有浸没式冷却系统的电子设备及其操作方法 | |
| JPS61131553A (ja) | 浸漬液冷装置 | |
| JPS60102759A (ja) | 浸漬沸騰冷却装置 | |
| JPH02305000A (ja) | 集積回路素子の浸漬冷却装置 | |
| JPS6285448A (ja) | 半導体装置の冷却構造 |