JPS6039288U - 電子回路のパツケ−ジ - Google Patents

電子回路のパツケ−ジ

Info

Publication number
JPS6039288U
JPS6039288U JP13058783U JP13058783U JPS6039288U JP S6039288 U JPS6039288 U JP S6039288U JP 13058783 U JP13058783 U JP 13058783U JP 13058783 U JP13058783 U JP 13058783U JP S6039288 U JPS6039288 U JP S6039288U
Authority
JP
Japan
Prior art keywords
electronic circuit
package
circuit package
lead wire
guide hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13058783U
Other languages
English (en)
Japanese (ja)
Other versions
JPH021899Y2 (enrdf_load_stackoverflow
Inventor
池内　正之
才田　敏和
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP13058783U priority Critical patent/JPS6039288U/ja
Publication of JPS6039288U publication Critical patent/JPS6039288U/ja
Application granted granted Critical
Publication of JPH021899Y2 publication Critical patent/JPH021899Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
JP13058783U 1983-08-23 1983-08-23 電子回路のパツケ−ジ Granted JPS6039288U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13058783U JPS6039288U (ja) 1983-08-23 1983-08-23 電子回路のパツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13058783U JPS6039288U (ja) 1983-08-23 1983-08-23 電子回路のパツケ−ジ

Publications (2)

Publication Number Publication Date
JPS6039288U true JPS6039288U (ja) 1985-03-19
JPH021899Y2 JPH021899Y2 (enrdf_load_stackoverflow) 1990-01-17

Family

ID=30295513

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13058783U Granted JPS6039288U (ja) 1983-08-23 1983-08-23 電子回路のパツケ−ジ

Country Status (1)

Country Link
JP (1) JPS6039288U (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPH021899Y2 (enrdf_load_stackoverflow) 1990-01-17

Similar Documents

Publication Publication Date Title
JPS6039288U (ja) 電子回路のパツケ−ジ
JPS6083232U (ja) チツプ部品
JPS5851497U (ja) シ−ルド装置
JPS5985672U (ja) はんだごて
JPS6076026U (ja) チツプ部品
JPS5933254U (ja) 半導体装置
JPS60181051U (ja) リ−ドフレ−ムの構造
JPS606242U (ja) 混成集積回路
JPS59171350U (ja) 半導体素子の実装構造
JPS58134873U (ja) プリント配線板
JPS5977780U (ja) プリント基板のコ−ド接続構造
JPS6016581U (ja) プリント配線基板
JPS5860967U (ja) 配線基板と電子部品との結合構造
JPS5977781U (ja) プリント基板のコ−ド接続構造
JPS5829845U (ja) セラミツク多層配線板のリ−ドピン形状
JPS58191651U (ja) 集積回路
JPS5890684U (ja) 圧接接続構造
JPS61251U (ja) 電子部品
JPS609226U (ja) 半導体の実装用パツケ−ジ
JPS6078141U (ja) 電子部品の実装構造
JPS60113609U (ja) ボビン構造
JPS5860968U (ja) 配線基板と電子部品との結合構造
JPS5883171U (ja) 部品取付基板
JPS58118749U (ja) Ｉｃパツケ−ジの実装構造
JPS58173240U (ja) 位置合せ用パタ−ンを備えた半導体チツプ