JPS6037270U - Thick film multilayer structure - Google Patents
Thick film multilayer structureInfo
- Publication number
- JPS6037270U JPS6037270U JP12865183U JP12865183U JPS6037270U JP S6037270 U JPS6037270 U JP S6037270U JP 12865183 U JP12865183 U JP 12865183U JP 12865183 U JP12865183 U JP 12865183U JP S6037270 U JPS6037270 U JP S6037270U
- Authority
- JP
- Japan
- Prior art keywords
- conductor layer
- thick film
- multilayer structure
- layer
- film multilayer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Non-Adjustable Resistors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
) 第1図から第4図は従来の厚膜多層構造の製作:
工程を示す区であって、それぞれAは平面図、B(は
b−b線にそう拡大断面図であり、第5図からち 第8
図はこの考案による厚膜多層構造の製作工程【 を示す
図であって、それぞれAは平面図、Bはb”>
b線にそう拡大断面図である。
1・・・・・・第1の導体層、2・・・・・・第2の導
体層、4・・・・・・絶縁体層、5・・・・・・抵抗体
層。) Figures 1 to 4 show the conventional production of thick film multilayer structures:
Sections showing the process, A is a plan view, B (is an enlarged sectional view taken along line bb), and from Fig. 5 to Fig. 8.
The figure shows the manufacturing process of the thick film multilayer structure according to this invention, where A is a plan view and B is a plan view.
It is an enlarged sectional view taken along line b. 1... First conductor layer, 2... Second conductor layer, 4... Insulator layer, 5... Resistor layer.
Claims (1)
れ、少なくともこの重なり部分においχ第1の導体層と
第2の導体層との間に絶縁体層力形成されているものに
おいて、第1の導体層と終縁体層との間に少な(とも第
1の導体層の上記1なり部分を覆うように抵抗体層が形
成されていイことを特徴とする厚膜多層構造。The first conductor layer and the second conductor layer are provided in a vertically overlapping manner, and an insulating layer is formed between the first conductor layer and the second conductor layer at least in this overlapping portion. A thick film characterized in that a resistor layer is formed between the first conductor layer and the termination layer so as to cover the above-mentioned portion of the first conductor layer. Multilayer structure.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12865183U JPS6037270U (en) | 1983-08-19 | 1983-08-19 | Thick film multilayer structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12865183U JPS6037270U (en) | 1983-08-19 | 1983-08-19 | Thick film multilayer structure |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6037270U true JPS6037270U (en) | 1985-03-14 |
Family
ID=30291778
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12865183U Pending JPS6037270U (en) | 1983-08-19 | 1983-08-19 | Thick film multilayer structure |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6037270U (en) |
-
1983
- 1983-08-19 JP JP12865183U patent/JPS6037270U/en active Pending
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