JPS6037270U - Thick film multilayer structure - Google Patents

Thick film multilayer structure

Info

Publication number
JPS6037270U
JPS6037270U JP12865183U JP12865183U JPS6037270U JP S6037270 U JPS6037270 U JP S6037270U JP 12865183 U JP12865183 U JP 12865183U JP 12865183 U JP12865183 U JP 12865183U JP S6037270 U JPS6037270 U JP S6037270U
Authority
JP
Japan
Prior art keywords
conductor layer
thick film
multilayer structure
layer
film multilayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12865183U
Other languages
Japanese (ja)
Inventor
棚橋　万起
八段　英明
弘幸 中野
純夫 堀池
Original Assignee
オムロン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by オムロン株式会社 filed Critical オムロン株式会社
Priority to JP12865183U priority Critical patent/JPS6037270U/en
Publication of JPS6037270U publication Critical patent/JPS6037270U/en
Pending legal-status Critical Current

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  • Parts Printed On Printed Circuit Boards (AREA)
  • Non-Adjustable Resistors (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

）　　第１図から第４図は従来の厚膜多層構造の製作：
　工程を示す区であって、それぞれＡは平面図、Ｂ（は
ｂ−ｂ線にそう拡大断面図であり、第５図からち　第８
図はこの考案による厚膜多層構造の製作工程【　を示す
図であって、それぞれＡは平面図、Ｂはｂ”＞　　　　
ｂ線にそう拡大断面図である。 １・・・・・・第１の導体層、２・・・・・・第２の導
体層、４・・・・・・絶縁体層、５・・・・・・抵抗体
層。) Figures 1 to 4 show the conventional production of thick film multilayer structures:
Sections showing the process, A is a plan view, B (is an enlarged sectional view taken along line bb), and from Fig. 5 to Fig. 8.
The figure shows the manufacturing process of the thick film multilayer structure according to this invention, where A is a plan view and B is a plan view.
It is an enlarged sectional view taken along line b. 1... First conductor layer, 2... Second conductor layer, 4... Insulator layer, 5... Resistor layer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 第１の導体層と第２の導体層とが上下に重なてて設けら
れ、少なくともこの重なり部分においχ第１の導体層と
第２の導体層との間に絶縁体層力形成されているものに
おいて、第１の導体層と終縁体層との間に少な（とも第
１の導体層の上記１なり部分を覆うように抵抗体層が形
成されていイことを特徴とする厚膜多層構造。The first conductor layer and the second conductor layer are provided in a vertically overlapping manner, and an insulating layer is formed between the first conductor layer and the second conductor layer at least in this overlapping portion. A thick film characterized in that a resistor layer is formed between the first conductor layer and the termination layer so as to cover the above-mentioned portion of the first conductor layer. Multilayer structure.
JP12865183U 1983-08-19 1983-08-19 Thick film multilayer structure Pending JPS6037270U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12865183U JPS6037270U (en) 1983-08-19 1983-08-19 Thick film multilayer structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12865183U JPS6037270U (en) 1983-08-19 1983-08-19 Thick film multilayer structure

Publications (1)

Publication Number Publication Date
JPS6037270U true JPS6037270U (en) 1985-03-14

Family

ID=30291778

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12865183U Pending JPS6037270U (en) 1983-08-19 1983-08-19 Thick film multilayer structure

Country Status (1)

Country Link
JP (1) JPS6037270U (en)

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