JPS6025173U - thick film circuit - Google Patents
thick film circuitInfo
- Publication number
- JPS6025173U JPS6025173U JP11647683U JP11647683U JPS6025173U JP S6025173 U JPS6025173 U JP S6025173U JP 11647683 U JP11647683 U JP 11647683U JP 11647683 U JP11647683 U JP 11647683U JP S6025173 U JPS6025173 U JP S6025173U
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- film circuit
- layer conductor
- upper layer
- dielectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図はクロスオーバを有する従来の厚膜回路の模式的
な正面図、第2図は第1図のA−A線断面図、第3図は
従来の厚膜回路の断面図、第4図は本考案の一実施例に
係る厚膜回路の断面図、第5図は同正面図である。
1・・・・・・絶縁基板、2・・・・・・下層導体、3
・・・・・・誘電体層、3c・・・・・・下層誘電体、
3d・・・・・・上層誘電体、4・・・・・・上層導体
。FIG. 1 is a schematic front view of a conventional thick film circuit with a crossover, FIG. 2 is a sectional view taken along line A-A in FIG. The figure is a sectional view of a thick film circuit according to an embodiment of the present invention, and FIG. 5 is a front view thereof. 1...Insulating substrate, 2...Lower conductor, 3
...Dielectric layer, 3c...Lower dielectric,
3d...Upper layer dielectric, 4...Upper layer conductor.
Claims (1)
成し、さらにその上に上層導体を設けて、クロスオーバ
またはコンデンサを形成する厚膜回路において、前記誘
電体層はパターンの大きさがほぼ等しい複数の誘電体層
を前記上層導体の経路方向に沿って相互にずらして重ね
た多層構造としたことを特徴とする厚膜回路。In a thick film circuit in which a lower layer conductor is formed on an insulating substrate, a dielectric layer is formed on it, and an upper layer conductor is further provided on top of that to form a crossover or a capacitor, the dielectric layer is 1. A thick film circuit characterized in that it has a multilayer structure in which a plurality of dielectric layers having substantially equal heights are stacked and shifted from each other along the path direction of the upper layer conductor.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11647683U JPS6025173U (en) | 1983-07-28 | 1983-07-28 | thick film circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11647683U JPS6025173U (en) | 1983-07-28 | 1983-07-28 | thick film circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6025173U true JPS6025173U (en) | 1985-02-20 |
Family
ID=30268485
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11647683U Pending JPS6025173U (en) | 1983-07-28 | 1983-07-28 | thick film circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6025173U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61296798A (en) * | 1985-06-26 | 1986-12-27 | 沖電気工業株式会社 | Manufacture of thick film printed wiring board |
-
1983
- 1983-07-28 JP JP11647683U patent/JPS6025173U/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61296798A (en) * | 1985-06-26 | 1986-12-27 | 沖電気工業株式会社 | Manufacture of thick film printed wiring board |
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