JPS6033594B2 - Laser cutting method - Google Patents
Laser cutting methodInfo
- Publication number
- JPS6033594B2 JPS6033594B2 JP58013735A JP1373583A JPS6033594B2 JP S6033594 B2 JPS6033594 B2 JP S6033594B2 JP 58013735 A JP58013735 A JP 58013735A JP 1373583 A JP1373583 A JP 1373583A JP S6033594 B2 JPS6033594 B2 JP S6033594B2
- Authority
- JP
- Japan
- Prior art keywords
- laser beam
- cutting
- spiral
- cutting method
- laser cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明はしーザ切断方法に係り特に螺旋状物体（以下ス
パイラル物体と称す）の切断を好適に行う方法に関する
。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a scissor cutting method, and particularly to a method for suitably cutting a spiral object (hereinafter referred to as a spiral object).
一例にマグネトロンチューブのカソード電極を挙げて説
明する。An example will be explained using the cathode electrode of a magnetron tube.
このカソード電極はタングステンを主成分とする太さ約
０．６肋の針金が直径４肋のスパイラル状に数十仇の長
さにわたって巻かれたものを約１伽程度の長さに切断し
これをチューブ内に組込んだ構造になっている。この切
断には機械的にはニッパなどを使って行っているが、功
断後非能率的なばり取り作業が必要であった。また、切
断にはしーザ光を利用する方法も試みられているが、切
断部以外の部分に付着する溶融スプラツシュの除去が困
難である問題が残っている。〔発明の目的〕スパイラル
状に形成された物体を変形することなくまた、ばり取り
作業を必要としない切断する方法を提供するにある。This cathode electrode is made by cutting a tungsten-based wire with a thickness of about 0.6 ribs into a spiral shape with a diameter of 4 ribs over a length of several tens of meters, and then cutting it into a length of about 1 inch. It has a structure that incorporates it inside the tube. This cutting is done mechanically using nippers, but after successful cutting, an inefficient deburring process is required. Furthermore, attempts have been made to use laser light for cutting, but the problem remains that it is difficult to remove molten splash that adheres to areas other than the cut portion. [Object of the Invention] It is an object of the invention to provide a method for cutting a spirally formed object without deforming it and without requiring deburring.
スパイラル状の物体をレーザ光で切断するに当り、レー
ザ光で照射される部分を間にし少なくともスパイラル状
の物体の１ピッチの距離で対時するように遮閉板を介在
させるとともに上記照射される部分に集光点が形成され
ないようにレーザ光を照射するようにして切断すること
を特徴とするものである。When cutting a spiral-shaped object with a laser beam, a shielding plate is interposed so that the part irradiated with the laser beam is spaced at a distance of at least one pitch of the spiral-shaped object, and the irradiation is performed as described above. This method is characterized in that cutting is performed by irradiating a laser beam so that a focal point is not formed in the portion.
第１図は本発明の第１の実施例を示す。 FIG. 1 shows a first embodiment of the invention.
第１図において、１は出力１５Ｊ／Ｐ以上、パルス幅０
．８ｈＳのノーマルパルスレーザを出力するレーザ発振
器で、このレーザ発振器１から出力されたレーザ光Ｌは
反射鏡２によって集光レンズ３に導びかれ、タングステ
ンからなり線径０．６豚のスパイラル状物体４を照射す
るようになっている。スパイラル状物体４はＶブロック
５上を回転送り袷具６によって集光レンズ３を透過した
レーザ光Ｌと交差する方向に移動されるようになってい
る。またＶブロックの一部、すなわちレーザ光Ｌを透過
させるために切欠き７が形成されている。．上記におい
て、スパイラル状物体４の外面側がレーザ光Ｌの入射面
となる場合、集東点Ｐは切断部８の奥の方に位置するよ
うに集光レンズ３と切断部８との間が相対的に調節され
る。ここで、スパイラル状物体４の織部９から所定長さ
になる切断部８を切欠き７の位置に設定する。また、同
時に、切断部８を間にして１ピッチの間隔で銅製からな
る一対の遮閉板１０ａ，１０ｂがスパイラル状物体４に
置かれる。以上のように設定した後、集東点Ｐの集光パ
ワー密度を約１０７Ｗ／地以上にしてレーザ光Ｌを照射
すると、１パルスで切断部８が瞬時に蒸発し飛散する。
この蒸発において、レーザ光Ｌの入射方向からそれて水
平方向に飛散した物体は遮閉板１０ａ，１０ｂに付着し
、スパイラル状物体４への付着は防止される。このよう
に切断部が瞬時に蒸発させるヱネルギ密度と、集束レー
ザ光Ｌａが切断部８以外の部分をそれるようにして照射
させることにより、切断部８に不必要なばりを生ずるこ
とになり切断が行える。第２図は本発明の第２の実施例
で、レーザ光Ｌをスパイラル状物体４の内面側から入射
させて切断する場合の例を示す。In Figure 1, 1 indicates an output of 15 J/P or more and a pulse width of 0.
．． This is a laser oscillator that outputs a normal pulse laser of 8 hS. The laser beam L output from this laser oscillator 1 is guided by a reflecting mirror 2 to a condensing lens 3, and is formed into a spiral object made of tungsten and having a wire diameter of 0.6 mm. It is designed to irradiate 4. The spiral object 4 is moved on the V block 5 by a rotating feeder 6 in a direction intersecting the laser beam L transmitted through the condenser lens 3. Further, a notch 7 is formed to transmit a part of the V block, that is, the laser beam L. ．． In the above, when the outer surface side of the spiral object 4 becomes the incident surface of the laser beam L, the condensing lens 3 and the cutting part 8 are relative to each other so that the east convergence point P is located at the back of the cutting part 8. adjusted accordingly. Here, a cut portion 8 having a predetermined length from the weaving part 9 of the spiral-shaped object 4 is set at the position of the notch 7. At the same time, a pair of shielding plates 10a and 10b made of copper are placed on the spiral-shaped object 4 at an interval of one pitch with the cut portion 8 in between. After setting as described above, when the laser beam L is irradiated with the condensing power density at the convergence point P set to about 107 W/ground or higher, the cut portion 8 instantly evaporates and scatters with one pulse.
During this evaporation, objects scattered in the horizontal direction away from the incident direction of the laser beam L adhere to the shielding plates 10a and 10b, and are prevented from adhering to the spiral-shaped object 4. In this way, the energy density that instantly evaporates the cutting part and the focused laser beam La irradiating the parts other than the cutting part 8 in such a way that unnecessary burrs are generated in the cutting part 8, making it difficult to cut can be done. FIG. 2 shows a second embodiment of the present invention, in which the laser beam L is incident on the inner surface of the spiral-shaped object 4 to cut the object.
この場合、レーザ光Ｌの集東点Ｐは切断部８の手前に位
置するように調節される。なお、切断部８を間にして１
ピッチの間隔で飛散物付着防止用に一対の遮閉板１１ａ
，ｌｌｂが設けられる。第３図は切断部８のみを露出さ
せ、他の大部分をとりかこむようにスパイラル状物体４
のピッチと同様のピッチになるパイプ状の遮閉体１２を
設けて切断する第３の実施例を示す。In this case, the focusing point P of the laser beam L is adjusted to be located in front of the cutting section 8. In addition, 1 with the cutting part 8 in between.
A pair of shielding plates 11a are provided at pitch intervals to prevent adhesion of flying objects.
,llb are provided. FIG. 3 shows a spiral object 4 that exposes only the cut portion 8 and surrounds most of the other parts.
A third embodiment is shown in which a pipe-shaped shielding body 12 having a pitch similar to that of is provided and cut is performed.
上記の遮閉体１２で切断時に発生する飛散物の切断部以
外への付着はより好適に防止される。〔発明の効果〕
以上述べたように螺旋状物体をレーザ光で切断するに当
りレーザ光の集東点を切断部から外し切断部を通過する
レーザ光が切断部以外の部分に照射されないように投光
するとともに、切断部以外の部分に切断時に発生する飛
散物が付着しないように遮閉板を設けて切断加工するよ
うにしたので、切断時を瞬時に蒸発させるェネルギの照
射が可能となり、ばりを発生せずに良好に切断ができ、
しかも切断後のばり除去、飛散物除去等の後工程が不要
となり、切断工程の能率および歩留りを向上することが
できた。The above-mentioned shielding body 12 can more preferably prevent flying debris generated during cutting from adhering to areas other than the cut portion. [Effects of the Invention] As described above, when cutting a spiral object with a laser beam, the focusing point of the laser beam is removed from the cutting part so that the laser beam passing through the cutting part does not irradiate parts other than the cutting part. In addition to projecting light, a shielding plate was installed to prevent flying debris generated during cutting from adhering to parts other than the cutting part, making it possible to irradiate energy that instantly evaporates the cutting process. Cuts well without creating burrs,
Moreover, post-processes such as removing burrs and removing scattered objects after cutting are no longer necessary, and the efficiency and yield of the cutting process can be improved.
第１図は本発明の第１の実施例を示す概要図、第２図は
本発明の第２の実施例を示す要部概要図、第３図は本発
明の第３の実施例を示す要部概要図である。
１…・・・レーザ発振器、３・・・・・・集光レンズ、
４・・・・・・スパイラル状物体、１０ａ，１０ｂ・・
・・・・遮閉板。
多’図
弊２図
解３図Fig. 1 is a schematic diagram showing a first embodiment of the present invention, Fig. 2 is a schematic diagram of main parts showing a second embodiment of the invention, and Fig. 3 is a schematic diagram showing a third embodiment of the invention. It is a schematic diagram of the main parts. 1... Laser oscillator, 3... Condensing lens,
4...Spiral-shaped object, 10a, 10b...
...Blocking plate. Many illustrations 2 illustrations 3 illustrations
Claims (1)
るレーザ切断方法において、照射される部分を間にし少
なくとも上記螺旋物体の１ピツチの距離で対峙するよう
に遮閉板を介在させるとともに上記照射される部分に集
光点が形成されないようにレーザ光を照射することを特
徴とするレーザ切断方法。 ２ レーザ光の集光点はレーザ光が螺旋物体の外面側へ
の入光時には螺旋物体を越える側になり螺旋物体の内面
側に入光時には螺旋物体を越えない側になることを特徴
とする特許請求の範囲第１項記載のレーザ切断方法。[Scope of Claims] 1. In a laser cutting method in which a portion of a spiral object is irradiated with a laser beam for cutting, shielding is provided so that the irradiated portion is in between and faces each other at a distance of at least one pitch of the spiral object. A laser cutting method characterized in that a closing plate is interposed and the laser beam is irradiated so that a focal point is not formed in the irradiated portion. 2. The focal point of the laser beam is on the side that crosses the spiral object when the laser beam enters the outer surface of the spiral object, and on the side that does not cross the spiral object when the laser beam enters the inner surface of the spiral object. A laser cutting method according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58013735A JPS6033594B2 (en) | 1983-02-01 | 1983-02-01 | Laser cutting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58013735A JPS6033594B2 (en) | 1983-02-01 | 1983-02-01 | Laser cutting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59150682A JPS59150682A (en) | 1984-08-28 |
| JPS6033594B2 true JPS6033594B2 (en) | 1985-08-03 |
Family
ID=11841506
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58013735A Expired JPS6033594B2 (en) | 1983-02-01 | 1983-02-01 | Laser cutting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6033594B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS631891U (en) * | 1986-06-23 | 1988-01-08 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5015820A (en) * | 1990-05-25 | 1991-05-14 | Industrial Technology Research Institute | Method of making spring washer with laser beam |
| US20100147814A1 (en) * | 2007-03-16 | 2010-06-17 | Sharp Kabushiki Kaisha | Method of cutting plastic substrate and apparatus for cutting plastic substrate |
-
1983
- 1983-02-01 JP JP58013735A patent/JPS6033594B2/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS631891U (en) * | 1986-06-23 | 1988-01-08 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59150682A (en) | 1984-08-28 |
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