JPS6032351B2 - Resin sealing method for semiconductor devices - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a resin sealing method for a semiconductor device.

In a resin-sealed semiconductor device, the quality of the resin-sealed portion largely determines the quality and performance of the semiconductor device itself.

Resin sealing is the process of replacing the air in the mold cavity with resin, and it is important that this replacement with resin is achieved sufficiently and evenly, and that excess resin does not eat up from the gaps in the mold. It is important not to let it out. With conventional manufacturing methods, both of the above two items are not fully satisfied.
The resin sealing conditions (resin sealing temperature,
Usually, the pressure, time, etc.) are set and the work is carried out.

For this reason, air bubbles may be present in the resin part of the semiconductor device, or
Defects that are undesirable in terms of semiconductor device performance, quality, and manufacturing yield, such as abnormalities in the appearance of the resin part, poor adhesion between the lead conductor part and the resin part, and increased processing time due to burrs. occurs. This invention eliminates the various defects mentioned above and improves the performance, quality, and quality of resin-sealed semiconductor devices.
The object of the present invention is to provide a resin sealing method that improves manufacturing yield.

This invention will be explained below with reference to the drawings.

FIG. 1 is a sectional view showing an embodiment of the resin sealing device used in the present invention. In the figure, 1 is a runner portion which is a passage for introduction of resin into the mold, and 2 is a runner portion for resin-sealing a semiconductor device. 3 is a type of chamber that houses the entire mold in order to depressurize the inside and outside of the mold, and 4 is a decompression port provided in chamber 3 for depressurizing the inside of chamber 3. , 5 is a pressure detection device in the chamber 3, 6 is a resin injection port provided in the chamber 3, 7 is a pressure sensor for detecting the pressure in the cavity portion 2, 8 is a pressurization device provided in the chamber 3, 9 is a pressure sensor provided in the chamber 3. The upper mold 1 and the lower mold 11 are semiconductor devices. In this invention, before the resin is injected into the mold cavity, the space in the mold to be filled with resin (runner part 1 and cavity part 2 in FIG. 1) is
is in a reduced pressure state. As a concrete measure, the mold is housed in a type of chamber 3 as shown in FIG. 1, and the pressure of the chamber 3 is reduced. That is, first, the semiconductor device 11 is placed in the cavity portion 2 of a mold consisting of an upper mold 9 and a lower mold 1, and the entire mold is pushed into the chamber 3.

Next, the inside of the chamber 3 is depressurized through the decompression port 4, thereby bringing the mold internal cavity portion 2 and the external peripheral portion into a depressurized state. After detecting the reduced pressure state in the chamber 3 by the detection device 5, finger cooling for resin injection is started, and resin injection is started from the resin injection port 6. Resin is injected and filled into each cavity part 2 through a runner part 1 in the mold. When it is confirmed by the pressure sensor 7 attached to the cavity part 2 that the inside of the cavity part 2 is filled with resin, the inside of the chamber 3 is turned into a pressurized state by the pressurizing device 8. The magnitude of the pressurizing pressure is such that the resin does not leak out from the gap in the mold.
Resin-sealed semiconductor devices that are resin-sealed using the above method have no extra air bubbles in the resin part, no appearance defects, and the resin part and the lead conductor part are in close contact with each other, which affects moisture resistance. It has good properties and the generation of paris is sufficiently suppressed, so the number of processing steps after resin sealing can be greatly reduced.

As explained above, according to the present invention, it is possible to obtain a resin-sealed semiconductor device in which the performance and quality of the resin-sealed part are improved, there are few appearance defects, and the number of processing steps after sealing can be reduced. There is.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing one embodiment of a resin-sealed package used in the present invention. In the figure, 1 is a runner part, 2 is a cavity part, 3 is a chamber, 4 is a pressure reduction port, 5 is a pressure detection device, 6 is a resin injection port, 7 is a pressure sensor, 8 is a pressure device, 9 is an upper mold, 10
11 is a lower mold, and 11 is a semiconductor device. Figure 1

Claims (1)

[Claims] 1. In the resin encapsulation of semiconductor devices, the inside and outside of the resin encapsulation mold are in a reduced pressure state, and the resin is injected into each of the internal cavities of the mold, and the resin is filled into each of the internal cavities of the mold. A method for resin-sealing a semiconductor device, comprising the step of simultaneously pressurizing the outside periphery of the mold.