JPS602868U - Printed board - Google Patents
Printed boardInfo
- Publication number
- JPS602868U JPS602868U JP1983094559U JP9455983U JPS602868U JP S602868 U JPS602868 U JP S602868U JP 1983094559 U JP1983094559 U JP 1983094559U JP 9455983 U JP9455983 U JP 9455983U JP S602868 U JPS602868 U JP S602868U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- view
- prevention part
- chip resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Non-Adjustable Resistors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図はチップ型抵抗器の一例を示す平面図、第2図は
同じく縦断面図、第3図および第4図は従来例を示し、
第3図はチップ型抵抗器を備えた基板の平面図、第4図
は第3図IV−IV断面図、第5図および第6図は本考
案の第1実施例を示し、第5図はチップ型抵抗器を備え
た基板の平面図、第6図は第5図Vl−VI断面図、第
7図および第8図は第2実施例を示し、第7図はチップ
型抵抗器を備えた基板の平面図、第8図は第7図■−■
断面図、第9図および第10図は第3実施例を示し、第
9図はチップ型抵抗器を備えた基板の平面図、第10図
は第9図X−X断面図、第11図は第4実施例を示すチ
ップ型抵抗器を備えた基板の平面図、第12図および第
13図は第5実施例を示し、第12図はチップ型抵抗器
を備えた基板の平面図、第13図は第12図xm−xm
断面図、第14図は第6実施例を示すチップ型抵抗器を
備えた基板の縦断面図、第15図および第16図は第7
実施例を示し、第15図はチップ型抵抗器の平面図、第
16図はチップ型抵抗器を備えた基板の平面図、第17
図および第18図は第8実施例を示し、第17図はチッ
プ型抵抗器を備えた基板の平面図、第18図は部分回路
図、第19図は第9実施例を示すチップ型抵抗器を備え
た基板の平面図である。
1・・・・・・チップ型抵抗器、11・・・・・・セラ
ミック板、12・・・・・・内部電極、13・・・・・
・抵抗体、14・・・・・・ガラスコー′ト保護膜、1
5・・・・・・外部電極、2・・・・・・基板、3・・
・・・・配線パターン、31・・・・・・端子、32・
・・・・・ハンダ、4・・・・・・ベッド、41・・・
・・・逆げ溝、a・・・・・・起動位置、al・・・・
・・助走区間、22.23゜24・・・・・・透孔(焼
損防止部)、33・・・・・・保護体(焼損防止部)、
5・・・・・・接着剤(焼損防止部)。FIG. 1 is a plan view showing an example of a chip resistor, FIG. 2 is a vertical cross-sectional view, and FIGS. 3 and 4 are conventional examples.
3 is a plan view of a board equipped with a chip resistor, FIG. 4 is a sectional view taken along line IV-IV in FIG. 3, FIGS. 5 and 6 show a first embodiment of the present invention, and FIG. 6 is a plan view of a board equipped with a chip resistor, FIG. 6 is a sectional view taken along line Vl-VI in FIG. The plan view of the equipped board, Fig. 8, is the same as Fig. 7 ■-■
9 and 10 show the third embodiment, FIG. 9 is a plan view of a board equipped with a chip resistor, and FIG. 10 is a sectional view taken along line XX in FIG. 9, and FIG. 12 and 13 show a fifth embodiment, and FIG. 12 is a plan view of a board equipped with a chip resistor, showing the fourth embodiment. Figure 13 is from Figure 12 xm-xm
14 is a longitudinal sectional view of a board equipped with a chip resistor showing the sixth embodiment, and FIGS. 15 and 16 are the seventh embodiment.
Examples are shown, FIG. 15 is a plan view of a chip resistor, FIG. 16 is a plan view of a substrate equipped with a chip resistor, and FIG. 17 is a plan view of a chip resistor.
The figure and FIG. 18 show the eighth embodiment, FIG. 17 is a plan view of a board equipped with a chip resistor, FIG. 18 is a partial circuit diagram, and FIG. 19 is a chip resistor showing a ninth embodiment. FIG. 1... Chip type resistor, 11... Ceramic plate, 12... Internal electrode, 13...
・Resistor, 14...Glass coated protective film, 1
5...External electrode, 2...Substrate, 3...
...Wiring pattern, 31...Terminal, 32.
...Solder, 4...Bed, 41...
... Reverse groove, a... Starting position, al...
... Run-up section, 22.23° 24 ... Through hole (burnout prevention part), 33 ... Protector (burnout prevention part),
5...Adhesive (burnout prevention part).
Claims (3)
形成した端子間に架設されたプリント基板において、 前記抵抗器をレーザートリミングする際のレーザービー
ムの走査線の軌跡上に焼損防止部を設けたことを特徴と
するプリント基板。(1) In a printed circuit board in which a chip resistor is installed between terminals formed in the wiring pattern of the printed circuit board, a burnout prevention part is provided on the locus of the scanning line of the laser beam when laser trimming the resistor. A printed circuit board characterized by:
囲第1項記載のプリント基板。(2) The printed circuit board according to claim 1, wherein the burnout prevention part is a through hole bored in the board.
範囲第1項記載のプリント基板。(3) The printed circuit board according to claim 1, wherein the burnout prevention part is a protector extending from the board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1983094559U JPS602868U (en) | 1983-06-20 | 1983-06-20 | Printed board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1983094559U JPS602868U (en) | 1983-06-20 | 1983-06-20 | Printed board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS602868U true JPS602868U (en) | 1985-01-10 |
JPH027482Y2 JPH027482Y2 (en) | 1990-02-22 |
Family
ID=30226292
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1983094559U Granted JPS602868U (en) | 1983-06-20 | 1983-06-20 | Printed board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS602868U (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5849472U (en) * | 1981-09-29 | 1983-04-04 | 株式会社東芝 | printed wiring board |
JPS5863704U (en) * | 1981-10-23 | 1983-04-28 | 三菱電機株式会社 | chip resistor |
JPS58111952U (en) * | 1982-01-25 | 1983-07-30 | オムロン株式会社 | hybrid integrated circuit |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5849472B2 (en) * | 1975-10-03 | 1983-11-04 | 帝人株式会社 | Shijiyoukiyuinhouhou |
-
1983
- 1983-06-20 JP JP1983094559U patent/JPS602868U/en active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5849472U (en) * | 1981-09-29 | 1983-04-04 | 株式会社東芝 | printed wiring board |
JPS5863704U (en) * | 1981-10-23 | 1983-04-28 | 三菱電機株式会社 | chip resistor |
JPS58111952U (en) * | 1982-01-25 | 1983-07-30 | オムロン株式会社 | hybrid integrated circuit |
Also Published As
Publication number | Publication date |
---|---|
JPH027482Y2 (en) | 1990-02-22 |
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