JPS602845U - Hybrid IC lead frame - Google Patents
Hybrid IC lead frameInfo
- Publication number
- JPS602845U JPS602845U JP9390683U JP9390683U JPS602845U JP S602845 U JPS602845 U JP S602845U JP 9390683 U JP9390683 U JP 9390683U JP 9390683 U JP9390683 U JP 9390683U JP S602845 U JPS602845 U JP S602845U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- hybrid
- substrate
- tongue
- tongue piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のリードフレームの斜視図であり、第２図
イ１ロ、ハは第１図のリードフレームをハイブリッドＩ
Ｃに取り付けた状態を示す正面図、平面図、右側面図で
ある。第３図は本考案を実施したリードフレームの斜視
図、第４図は第３図のリードフレームをハイブリッドＩ
Ｃの基板に取り付けた状態の要部斜視図、第５図イ１ロ
、ハは第４図に関する正面図、平面図、右側面図である
。
第６図は第３図のリードフレームの展開図である。
１・・・リードフレーム、３・・・第１舌片、４・・
・第２舌片、５・・・基板、６・・・半田。FIG. 1 is a perspective view of a conventional lead frame, and FIG.
FIG. 3 is a front view, a top view, and a right side view showing the state in which it is attached to C. Fig. 3 is a perspective view of a lead frame implementing the present invention, and Fig. 4 shows the lead frame of Fig. 3 as a hybrid I
C is a perspective view of the main part in a state where it is attached to a board, and FIGS. FIG. 6 is a developed view of the lead frame shown in FIG. 3.
1... Lead frame, 3... First tongue piece, 4...
- Second tongue piece, 5... board, 6... solder.
Claims (1)
と他方の面に位置する複数の第２舌片とを有し、これら
第１、第２舌片により基板を挾持する如く基板の電極に
半田付は固定されるリードフレームであって、前記第１
、第２舌片を前記基板に対し垂直に当接する垂直面をも
つように形成したことを特徴とするハイブリッドＩＣの
リードフレーム。The substrate of the hybrid IC has a first tongue piece located on one surface and a plurality of second tongue pieces located on the other surface, and the electrodes of the substrate are sandwiched between the first and second tongue pieces. The lead frame is soldered to the first lead frame.
A lead frame for a hybrid IC, characterized in that the second tongue piece is formed to have a vertical surface that contacts the substrate perpendicularly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9390683U JPS602845U (en) | 1983-06-17 | 1983-06-17 | Hybrid IC lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9390683U JPS602845U (en) | 1983-06-17 | 1983-06-17 | Hybrid IC lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS602845U true JPS602845U (en) | 1985-01-10 |
Family
ID=30225053
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9390683U Pending JPS602845U (en) | 1983-06-17 | 1983-06-17 | Hybrid IC lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS602845U (en) |
-
1983
- 1983-06-17 JP JP9390683U patent/JPS602845U/en active Pending
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