JPS5985672U - soldering iron - Google Patents
soldering ironInfo
- Publication number
- JPS5985672U JPS5985672U JP17899982U JP17899982U JPS5985672U JP S5985672 U JPS5985672 U JP S5985672U JP 17899982 U JP17899982 U JP 17899982U JP 17899982 U JP17899982 U JP 17899982U JP S5985672 U JPS5985672 U JP S5985672U
- Authority
- JP
- Japan
- Prior art keywords
- soldering iron
- soldering
- mentioned
- tip
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図はフラットパックICの正面図、第2図−は同じ
く第1図の■−■線に沿った断面図、第3図は従来のは
んだごてのチップの正面図、第4図゛、 は同じく側面
図、第5図は本考案の一実施例の要; 部斜視図、第
6図は同じく要部を断面して示す正三 面図である。
1:本体、2:リード、3:はんだ付は部、11:チッ
プ、21a、 22a、 23a、 24a:尚
接面、35:配線基板。Figure 1 is a front view of a flat pack IC, Figure 2- is a cross-sectional view taken along the line ■-■ in Figure 1, Figure 3 is a front view of a conventional soldering iron chip, and Figure 4 is a front view of a conventional soldering iron chip. , are side views, FIG. 5 is a partial perspective view of an embodiment of the present invention, and FIG. 6 is a trihedral view showing the main parts in section. 1: Main body, 2: Lead, 3: Soldering part, 11: Chip, 21a, 22a, 23a, 24a: Contact surface, 35: Wiring board.
Claims (1)
トバックICの上記リードのはんだ付U部に当接するチ
ップを有しこれにより上記リードを配線基板にはんだ付
けするはんだごてにおいて上記チップはすべての上記リ
ードのはんだ付は冴を覆って当接する平坦な当接面を有
することを特徴とするはんだこて。The above-mentioned soldering iron has a tip that comes into contact with the soldering U part of the above-mentioned lead of a flat back IC formed by protruding a plurality of leads from the side of the main body, and thereby solders the above-mentioned lead to a wiring board. A soldering iron characterized in that the tip has a flat abutment surface that covers and abuts the soldering surface of all the above-mentioned leads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17899982U JPS5985672U (en) | 1982-11-29 | 1982-11-29 | soldering iron |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17899982U JPS5985672U (en) | 1982-11-29 | 1982-11-29 | soldering iron |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5985672U true JPS5985672U (en) | 1984-06-09 |
Family
ID=30388474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17899982U Pending JPS5985672U (en) | 1982-11-29 | 1982-11-29 | soldering iron |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5985672U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61266761A (en) * | 1985-05-17 | 1986-11-26 | 元旦ビユーティ工業株式会社 | Traverse shingled roof panel |
| JPS61271818A (en) * | 1985-05-27 | 1986-12-02 | Toshiba Mach Co Ltd | Vapor growth apparatus |
| JPS6215864U (en) * | 1985-07-09 | 1987-01-30 |
-
1982
- 1982-11-29 JP JP17899982U patent/JPS5985672U/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61266761A (en) * | 1985-05-17 | 1986-11-26 | 元旦ビユーティ工業株式会社 | Traverse shingled roof panel |
| JPS61271818A (en) * | 1985-05-27 | 1986-12-02 | Toshiba Mach Co Ltd | Vapor growth apparatus |
| JPS6215864U (en) * | 1985-07-09 | 1987-01-30 |
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