JPS60260140A - Chopper controller - Google Patents

Chopper controller

Info

Publication number
JPS60260140A
JPS60260140A JP11460084A JP11460084A JPS60260140A JP S60260140 A JPS60260140 A JP S60260140A JP 11460084 A JP11460084 A JP 11460084A JP 11460084 A JP11460084 A JP 11460084A JP S60260140 A JPS60260140 A JP S60260140A
Authority
JP
Japan
Prior art keywords
cooler
cooling system
gate driving
driving part
gto thyristor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11460084A
Other languages
Japanese (ja)
Inventor
Masataka Onoe
尾上 正孝
Hiroshi Itahana
板鼻 博
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Hitachi Plant Technologies Ltd
Original Assignee
Hitachi Techno Engineering Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Techno Engineering Co Ltd, Hitachi Ltd filed Critical Hitachi Techno Engineering Co Ltd
Priority to JP11460084A priority Critical patent/JPS60260140A/en
Publication of JPS60260140A publication Critical patent/JPS60260140A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To contrive to form a chopper controller in a small type by a method wherein a gate driving part equipped to a cooler is arranged in an airtight chamber provided penetrating a part of a box frame constructed in the condition accommodating the cooler. CONSTITUTION:A cooling system 10 has an airtight vessel 2 at the lower part of a cooler 3, and a gate driving part 4 positioning at the side thereof. The gate driving part 4 thereof has a cover 11, accommodated enabling to be inspected and detached from the car side in an airtight chamber constructed in the condition equipped with the cooling system 10 to a main frame, and integrated in one body with the cooling system 10. Accordingly, because the gate driving part 4 can be arranged close to the bushing 5 side of the airtight vessel 2 built in with a semiconductor containing a GTO thyristor, a gate wiring 11 can be shortened to the utmost, erroneous triggering of the GTO thyristor can be checked, and safety of action of the GTO thyristor can be secured also. Moreover, even when capacity of the cooler 3 is enlarged, a countermeasure of some extent can be devised by enlarging size in the sectional direction of the cooler 3 without changing size in the lengthwise direction and the sectional direction of a chopper controller.

Description

【発明の詳細な説明】 〔発明の利用分野〕 本発明はGTOより構成されるチョッパ制御装置に係り
、特に、冷却系のコンパクト化と装置の小形化に好適な
チョッパ制御装置に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a chopper control device composed of a GTO, and particularly to a chopper control device suitable for downsizing a cooling system and downsizing the device.

〔発明の目的〕[Purpose of the invention]

本発明の目的は、GTCI応用したチョッパ制御装置の
実装スペースの有効利用および特性上からの機器配置、
取扱い等をも考慮して小形化?図ったチョッパ制御装置
金提供するにある。
The purpose of the present invention is to effectively utilize the mounting space of a chopper control device using GTCI, and to improve the equipment arrangement based on its characteristics.
Is it downsized considering handling etc.? The intended chopper control device is to provide gold.

〔発明の概要〕[Summary of the invention]

GTOvf一応用するチョッパ制御装置では、GTO自
身が自己消弧機能ケもつため逆導通サイリスタ等のオフ
機能4備えていない転流回路rもつチョッパ制御装置と
は、その収納機器ケ異にする。
In the chopper control device to which the GTOvf is applied, since the GTO itself has a self-extinguishing function, the storage equipment is different from a chopper control device having a commutation circuit r that does not have an off function such as a reverse conduction thyristor.

さらに、GT(l特性限界まで使用するためには、ゲー
ト駆動部、スナバ回路部品等の機器構成上の制約があり
、取扱いケ含めての小形化を図る必要がある。
Furthermore, in order to use the GT (I) characteristic to the limit, there are restrictions on the equipment configuration such as the gate drive section and snubber circuit components, and it is necessary to reduce the size including handling.

主回路電流を制御する主回路チョッパ制御装置では、保
守上のメリット等を考えてフロン冷却方式が多く採用さ
れている。
In main circuit chopper control devices that control the main circuit current, a Freon cooling system is often adopted due to its maintenance benefits.

このため、発明者らは従来の逆導通サイリスタを採用し
たチョッパ制御装置の構造、主に、冷却系の構造?極力
生かしてGTO応用のチョッパ制御装置にも適合でき、
小形化可能とするための機器構成全考案した。
For this reason, the inventors investigated the structure of a chopper control device using a conventional reverse conduction thyristor, mainly the structure of the cooling system. By making the best use of it, it can also be adapted to chopper control equipment for GTO applications.
The entire equipment configuration was devised to enable miniaturization.

〔発明の実施例〕[Embodiments of the invention]

以下、本発明の一実施例金弟1図、第2図により説明す
る。第1図はチョッパ制御装置のゲート駆動部4を含む
断面図ケ示す。GTO’に含む半導体および冷媒ケ内蔵
した密閉容器2と半導体の発生する熱を冷媒の気化−凝
縮のサイクルにより放熱するだめのクーラー3が接続さ
れて冷却系lOヶ構成している(第3図参照)。
Hereinafter, one embodiment of the present invention will be explained with reference to FIGS. 1 and 2. FIG. 1 shows a cross-sectional view including the gate drive section 4 of the chopper control device. A closed container 2 containing the semiconductor and refrigerant contained in the GTO' is connected to a cooler 3 that radiates heat generated by the semiconductor through the refrigerant's vaporization-condensation cycle to form a cooling system (Fig. 3). reference).

冷却系lOは主枠lの車側側と車体中心側との仕切り板
に設けられたパツキンに押しつけられて上下各々二本の
ボルトで主枠lに取付けられている。
The cooling system IO is pressed against a gasket provided on a partition plate between the vehicle side and the center side of the main frame 1, and is attached to the main frame 1 with two bolts each on the upper and lower sides.

この車側1u+1はクーラー3の冷却効果の向上ケ図る
ために、西気室とし、走行風孕利用E〜ようとクーラー
3孕車側側に飛び出した構造としている。
In order to improve the cooling effect of the cooler 3, the vehicle side 1u+1 is designed as a west air chamber, and has a structure in which the cooler 3 protrudes toward the vehicle side in order to utilize the running wind.

ここで、冷却系lOはクーラー3の下部に密閉容器2と
、その側面に位置するゲート駆動部4をもっている。こ
のゲート駆動部4はカバーlxiもち、主枠lに冷却系
10が取付けられた状態で構成される密閉室に車側側よ
り点検、着脱できるように収納され、冷却系10と一体
化されている。
Here, the cooling system IO has a closed container 2 below a cooler 3, and a gate drive section 4 located on the side surface of the closed container 2. The gate drive unit 4 is housed in a sealed chamber with a cover lxi and a cooling system 10 attached to the main frame l so that it can be inspected and removed from the vehicle side, and is integrated with the cooling system 10. There is.

即ち、第4図のチョッパ装置の裏面図で示されるように
、冷却系10.l、−よび主枠l共に切欠き?設けてお
き、冷却系lOが主枠1に収納された状態で密閉室とな
るように主枠lにパツキンを設けている。このパツキン
は逆に冷却系IOに設けても同様である。
That is, as shown in the back view of the chopper device in FIG. 4, the cooling system 10. Is there a notch in both l, - and main frame l? A gasket is provided on the main frame 1 so that the cooling system 10 is housed in the main frame 1 to form a sealed chamber. The same effect can be obtained even if this gasket is provided in the cooling system IO.

このチョッパ装置は自冷であるため、クーラー3の効果
ケ損なわない範囲でクーラー3の下部に飛び出している
密閉室音大きく確保できる。
Since this chopper device is self-cooled, it is possible to ensure a large amount of noise in the closed room protruding from the lower part of the cooler 3 without impairing the effectiveness of the cooler 3.

このゲート駆動部4の熱の発生は少ないため、クーラー
3に影響?及ぼすこともない。
Since the gate drive unit 4 generates less heat, does it affect the cooler 3? It has no effect.

さらに、このゲート駆動部4と共にゲート駆動用電源金
も一体とすれば、配線等も少なくなりより小形化が期待
でき、それだけ保守?含めた取扱いも容易となる。
Furthermore, if the gate drive power supply is integrated with the gate drive unit 4, there will be fewer wirings and more compactness can be expected, making maintenance easier. It also makes handling easier.

このような構造とすることにより、GTOを含む半導体
が内蔵された密閉容器2のブッシング5側の近くにゲー
ト駆動部4孕配置できるため、ゲート配線11は極力短
かくすることができ、GTOの誤点弧ケも防止でき、G
TOの動作の安全性も確保できる。
With this structure, the gate drive section 4 can be placed near the bushing 5 side of the sealed container 2 in which the semiconductor including the GTO is built, so the gate wiring 11 can be made as short as possible, and the GTO It also prevents erroneous firing, and G
The safety of TO operation can also be ensured.

さらに、クーラー3の容量が太きくなっても、チョッパ
制御装置の長手方向および断面方向の寸法4戎えること
なく、クーラー3の断面方向寸法ケ大きくすることにエ
リ、ある程度の対応が可能となる。換盲すれば、主とし
てクーラー3と密閉容器2、およびゲート駆動部4J:
す’Fl成される冷却系JOが主枠lに取付けられた時
、従来に比(7て特別な熱的問題ケ生じることなく、有
効なスペースの活用によりチョッパ制御装置とし小形化
が図られる。
Furthermore, even if the capacity of the cooler 3 becomes larger, it is possible to cope with increasing the cross-sectional dimensions of the cooler 3 to a certain extent without reducing the longitudinal and cross-sectional dimensions of the chopper control device. . If replaced, the main components will be the cooler 3, the sealed container 2, and the gate drive unit 4J:
When the cooling system JO is installed on the main frame, it does not cause any special thermal problems compared to the conventional method, and it can be made smaller as a chopper control device by making effective use of space. .

本実施例によれば、何ら新たな問題ケ生じることなく、
冷却系10の下部に冷却系lOと一体化されたゲート駆
動部4ケ設置するので、クーラー3の大きさケ断面方向
のみで調整でき、冷却系lOのスペース効率の向上が図
れるのでチョッパ制御装置の小形化が図れる。
According to this embodiment, no new problems arise;
Since four gate drive units integrated with the cooling system 10 are installed at the bottom of the cooling system 10, the size of the cooler 3 can be adjusted only in the cross-sectional direction, and the space efficiency of the cooling system 10 can be improved. can be made smaller.

しかも、ゲート畠動部4けGTOを制御するための機器
であり、一体化することにより取扱い等も容易になるこ
とが期待できる。
In addition, it is a device for controlling the four-gate GTO, and by integrating it, it can be expected that handling will become easier.

なお、図中6はスナバコンデンサ、8け電線押え、9け
制御回路用キャノンである。
In addition, 6 in the figure is a snubber capacitor, an 8-wire wire holder, and a 9-wire control circuit cannon.

〔発明の効果〕〔Effect of the invention〕

本発明によれば、クーラーの容量変化に対してもクーラ
ーの断面寸法のみで対応でき、冷却系の機器構成のスペ
ース効率向上が図れ、冷却系のコンパクト化、ひいては
チョッパ装置金小形化できる。
According to the present invention, changes in the capacity of the cooler can be dealt with only by changing the cross-sectional dimensions of the cooler, the space efficiency of the equipment configuration of the cooling system can be improved, the cooling system can be made more compact, and the size of the chopper device can be made smaller.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明によるチョッパ制御装置の断面図、第2
図は本発明による冷却系の正面図、第3図は第2図の右
側面図、第4図は本発明によるチョッパ制御装置の裏面
図である。 2・・・密閉容器、3・・・クーラー、4・・・ゲー)
[動部、代理人 弁理士 高橋明夫 茅10 4 茅2目 /n
FIG. 1 is a sectional view of a chopper control device according to the present invention, and FIG.
3 is a front view of the cooling system according to the present invention, FIG. 3 is a right side view of FIG. 2, and FIG. 4 is a back view of the chopper control device according to the present invention. 2...airtight container, 3...cooler, 4...game)
[Modobu, Agent Patent Attorney Akio Takahashi Kaya 10 4 Kaya 2 eyes/n

Claims (1)

【特許請求の範囲】 1、 0TOt−含む半導体及び冷媒?内蔵する密閉容
器と、前記半導体から発生する熱?前記冷媒の気化・凝
縮のサイクルにエリ放熱させるための凝縮器とが接続さ
れた冷却装置と、ゲート駆動部とからなるチョッパ制御
装置において、 前記冷却装置が収納された状態で構成される箱枠の一部
金貫通した密閉室に前記冷却装置に取付けられたゲート
駆動部全配置したこと全特徴とするチョッパ制御装置。
[Claims] 1. 0TOt-containing semiconductor and refrigerant? The built-in airtight container and the heat generated from the semiconductor? A chopper control device comprising a cooling device connected to a condenser for dissipating heat in the vaporization/condensation cycle of the refrigerant, and a gate drive section, wherein the box frame is configured in which the cooling device is housed. A chopper control device characterized in that a gate drive unit attached to the cooling device is entirely disposed in a sealed chamber through which a part of the metal passes through.
JP11460084A 1984-06-06 1984-06-06 Chopper controller Pending JPS60260140A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11460084A JPS60260140A (en) 1984-06-06 1984-06-06 Chopper controller

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11460084A JPS60260140A (en) 1984-06-06 1984-06-06 Chopper controller

Publications (1)

Publication Number Publication Date
JPS60260140A true JPS60260140A (en) 1985-12-23

Family

ID=14641911

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11460084A Pending JPS60260140A (en) 1984-06-06 1984-06-06 Chopper controller

Country Status (1)

Country Link
JP (1) JPS60260140A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2232150A (en) * 1988-09-07 1990-12-05 Nihon Cement Process for producing beta-sialon powder

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2232150A (en) * 1988-09-07 1990-12-05 Nihon Cement Process for producing beta-sialon powder

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