JPS5852686Y2 - forced cooling stack - Google Patents
forced cooling stackInfo
- Publication number
- JPS5852686Y2 JPS5852686Y2 JP6169079U JP6169079U JPS5852686Y2 JP S5852686 Y2 JPS5852686 Y2 JP S5852686Y2 JP 6169079 U JP6169079 U JP 6169079U JP 6169079 U JP6169079 U JP 6169079U JP S5852686 Y2 JPS5852686 Y2 JP S5852686Y2
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- stack
- forced
- fixed
- air cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Rectifiers (AREA)
Description
【考案の詳細な説明】
本考案は強制冷却スタック、特に冷却効果のすぐれた強
制冷却スタックに関するものである。[Detailed Description of the Invention] The present invention relates to a forced cooling stack, particularly a forced cooling stack with excellent cooling effects.
電子部品特に大電力を制御するサイリスタあるいはトラ
ンジスタ等の電子部品を所定位置に取付け、電子部品の
発熱を効果的に放熱するために冷却スタックが設けられ
ているが、従来のスタックは自然放熱型であったため電
子部品の発熱量が大きい場合には装置の過熱現象が生じ
るという問題があった。Cooling stacks are installed to mount electronic components, especially electronic components such as thyristors or transistors that control large amounts of power, in predetermined positions and effectively dissipate the heat generated by the electronic components, but conventional stacks are of a natural heat dissipation type. Therefore, if the electronic components generate a large amount of heat, there is a problem that the device may overheat.
第１図及び第２図には従来の冷却スタックが示され、冷
却スタックはサイリスタ等の電子部品１０が固定された
アルミフ゛ロック１２と、アルミフ゛ロック１２に絶縁
性接着材１４にて強固に接着固定された冷却フィン１６
とを含む。1 and 2 show a conventional cooling stack, which consists of an aluminum block 12 to which an electronic component 10 such as a thyristor is fixed, and which is firmly adhesively fixed to the aluminum block 12 with an insulating adhesive 14. cooling fins 16
including.
従来装置では、電子部品１０の発熱はアルミブロック１
２及び接着材１４を介して冷却フィン１６に伝達され、
冷却フィン１６の自然空冷により放熱されていた。In the conventional device, the heat generated by the electronic component 10 is generated by the aluminum block 1.
2 and is transmitted to the cooling fins 16 via the adhesive 14,
Heat was radiated by natural air cooling of the cooling fins 16.
従って、従来装置では、冷却フィン１６の大きさ及び形
状によりその放熱量が制約され、これに伴ない取付可能
な電子部品１０の熱容量が定まり、この熱容量に比して
冷却スタックの大きさが大きいという欠点があった。Therefore, in the conventional device, the amount of heat dissipated is restricted by the size and shape of the cooling fins 16, and accordingly, the heat capacity of the attachable electronic component 10 is determined, and the size of the cooling stack is large compared to this heat capacity. There was a drawback.
本考案は上記従来の課題に鑑みなされたものであり、そ
の目的は、冷却効果の高い小型軽量の冷却スタックを提
供することにある。The present invention was devised in view of the above-mentioned conventional problems, and its purpose is to provide a small and lightweight cooling stack with high cooling effect.
上記目的を達成するために、本考案は、冷却フィンに強
制空冷ファンを埋込固定したことを特徴とする。In order to achieve the above object, the present invention is characterized in that a forced air cooling fan is embedded and fixed in the cooling fins.
以下図面に基づいて本考案の好適な実施例を説明する。Preferred embodiments of the present invention will be described below based on the drawings.
第３図、第４図及び第５図には本考案の実施例が示され
、第１．２図の従来装置と同一部材には同一符号を付し
て説明を省略する。Embodiments of the present invention are shown in FIGS. 3, 4, and 5, and the same members as those in the conventional apparatus shown in FIGS. 1 and 2 are given the same reference numerals, and their explanations will be omitted.
本考案において特徴的なことは、冷却フィン部に強制空
冷ファンが埋込固定されていることであり、実施例にお
いて、冷却フィン１６の一部を切欠いた収納部１８に強
制空冷ファン２０が固定設置されている。A characteristic feature of the present invention is that a forced air cooling fan is embedded and fixed in the cooling fin portion. is set up.
強制空冷ファン２０は、第６図及び第７図に詳細に示さ
れ、固定枠２２の中央部に固定されたファンモータ２４
にファン２６が軸支されている。The forced air cooling fan 20 is shown in detail in FIGS. 6 and 7, and includes a fan motor 24 fixed to the center of the fixed frame 22.
A fan 26 is pivotally supported.
強制空冷ファン２０は第３．４．５図に示されるように
収納部１８に固定され、第４図の矢印で示されるよ、う
にファン２６の回転により冷却フィン１６の間には外部
空気が強制通風され、電子部品１０から冷却フィン１６
へ伝達された熱が急速に冷却されることとなる。The forced air cooling fan 20 is fixed to the housing part 18 as shown in FIG. Forced ventilation is applied to the cooling fins 16 from the electronic components 10.
The heat transferred to is rapidly cooled down.
実施例において、強制空冷ファン２６は、第５図から明
らかなように、各冷却フィン１６の長手方向に対して送
風方向が直角となるように固定され、この結果、前述し
た効率のよい冷却風流が得られるとともに、冷却フィン
部の大きさを増加させることなく冷却効率を改善させる
ことが可能となる。In the embodiment, the forced air cooling fan 26 is fixed so that the air blowing direction is perpendicular to the longitudinal direction of each cooling fin 16, as is clear from FIG. In addition, it becomes possible to improve the cooling efficiency without increasing the size of the cooling fin portion.
以上説明したように、本考案によれば、従来の自然空冷
型スタックに対して、強制空冷ファンによる強制空冷を
行なうことができるので、冷却能力を著しく増加し、小
型でかつ大容量の電子部品に好適な冷却スタックを得る
ことができ、空冷ファンは冷却フィン部に埋込固定され
ているため、装置の大きさを増加させることなく前述し
た良好な冷却効果を得るこが可能となる。As explained above, according to the present invention, it is possible to perform forced air cooling using a forced air cooling fan for a conventional natural air cooling type stack. Since the air cooling fan is embedded and fixed in the cooling fin portion, it is possible to obtain the above-mentioned good cooling effect without increasing the size of the device.
第１図は従来の冷却スタックを示す正面図、第２図は第
１図の側面図、第３図は本考案に係る強制冷却スタック
の好適な実施例を示す正面図、第４図は第３図の側面図
、第５図は第３図の底面図、第６図は第３図の実施例に
おける強制空冷ファンの正面図、第７図は第６図のＶｌ
ｌ−Ｖｌｌ断面図である。
各図を通し同一部材には同一符号を付し、１０は電子部
品、１６は冷却フィン、２０は強制空冷ファンである。FIG. 1 is a front view showing a conventional cooling stack, FIG. 2 is a side view of FIG. 1, FIG. 3 is a front view showing a preferred embodiment of the forced cooling stack according to the present invention, and FIG. 3 is a side view, FIG. 5 is a bottom view of FIG. 3, FIG. 6 is a front view of the forced air cooling fan in the embodiment of FIG. 3, and FIG. 7 is a side view of FIG.
It is a 1-Vll sectional view. The same members are denoted by the same reference numerals throughout the figures; 10 is an electronic component, 16 is a cooling fin, and 20 is a forced air cooling fan.
Claims (1)
埋込固定した電子部品の取付及び冷却用の強制冷却スタ
ック。A forced cooling stack for mounting and cooling electronic components, in which a forced air cooling fan is embedded and fixed in a storage space with a part of the cooling fin cut out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6169079U JPS5852686Y2 (en) | 1979-05-09 | 1979-05-09 | forced cooling stack |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6169079U JPS5852686Y2 (en) | 1979-05-09 | 1979-05-09 | forced cooling stack |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55162954U JPS55162954U (en) | 1980-11-22 |
| JPS5852686Y2 true JPS5852686Y2 (en) | 1983-12-01 |
Family
ID=29295660
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6169079U Expired JPS5852686Y2 (en) | 1979-05-09 | 1979-05-09 | forced cooling stack |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5852686Y2 (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2548124B2 (en) * | 1985-08-29 | 1996-10-30 | 松下電器産業株式会社 | Heat sink device |
| JPH0754876B2 (en) * | 1985-09-04 | 1995-06-07 | 松下電器産業株式会社 | Heat sink device |
| JP2934493B2 (en) * | 1990-10-24 | 1999-08-16 | 株式会社日立製作所 | Electronic equipment cooling device |
| JP2713554B2 (en) * | 1994-11-01 | 1998-02-16 | 松下電器産業株式会社 | Heat sink device |
| JP2584200B2 (en) * | 1994-11-01 | 1997-02-19 | 松下電器産業株式会社 | Electronic equipment |
| JP2677266B2 (en) * | 1996-07-18 | 1997-11-17 | 松下電器産業株式会社 | Heat sink device |
| JP2677265B2 (en) * | 1996-07-18 | 1997-11-17 | 松下電器産業株式会社 | Heat sink device |
| JP6413570B2 (en) * | 2014-09-30 | 2018-10-31 | 東芝ライテック株式会社 | Light source device |
-
1979
- 1979-05-09 JP JP6169079U patent/JPS5852686Y2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55162954U (en) | 1980-11-22 |
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