JP2713554B2 - Heat sink device - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat sink device used for cooling a heating element such as a power transistor. Conventionally, heat sinks have been used to radiate heat generated by heating elements such as power transistors, power ICs, cement resistors, etc., and to prevent an excessive rise in temperature of these elements. FIG. 4 is a perspective view of a heat sink to which a heat generating element is attached. In FIG. 4, reference numeral 11 denotes a heat generating element such as a power transistor, and 12 denotes a heat conductive material such as aluminum. And a plurality of fins 12
a is a heat sink integrally formed. By the way, it is known that when the heating element such as the power transistor described above is continuously energized and the whole temperature reaches an equilibrium state, the temperature of the heating element follows the following equation. (T−t) ∝Q / (k * A) where T: heating element temperature t: ambient temperature Q: total heating value of the heating element mounted on the heat sink k: heat dissipation efficiency A: heat sink surface area In order to further reduce the temperature of the heat generating element by the heat sink, a means such as increasing the surface area of the heat sink or using a cooling fan in combination to increase the heat radiation efficiency is used. [0006] However, in the former method using no cooling fan, heat is mainly released by natural convection, the heat radiation efficiency is poor, and the surface area of the heat sink becomes large in order to obtain a sufficient cooling capacity. It is a big problem in space. When the cooling fan is used together as in the latter case, the cooling fan 13 is connected to the main body 1 as shown in FIG.
4 and an arrangement in which a heating element and a cooling fan are arranged close to each other inside the apparatus main body 14 as shown in FIG. 6. In the arrangement in which the cooling fan is attached to the outer box, Depending on the mounting position, the distance from the heat sink 12 is large, and the wind from the fan is diffused, and the heat sink 1
In some cases, the amount of air blown to the air outlet 2 is reduced and the cooling effect is deteriorated. In the case where the cooling fan and the heat sink are arranged close to each other inside the device main body 14, the amount of air blown to the heat sink is sufficient. However, since the cooling fan 13 occupies the space inside the device main body 14, However, there is a problem that the mounting of other components is very restricted. Accordingly, an object of the present invention is to solve the above-mentioned various problems, and to improve the cooling capacity of the heat sink and save space. [0009] In order to solve the above problems, a heat sink device according to the present invention comprises a substantially quadrilateral heat sink.
The outer ends of the sink base and the heat sink base are connected to the heat sink.
Boards extending to the end of the heat sink base
Fins and the heat sink base fins
And a drive for rotating the fan
Means, wherein the plurality of fins have different lengths.
And the inner end contour is circular.
To release air from each side of the heat sink base.
It is something that has been done . With the above-described structure, the heat sink device of the present invention can increase the length of the heat sink when the size of the heat sink substrate is the same, thereby increasing the area of the heat sink. Therefore, the cooling capacity can be improved without increasing the size of the heat sink device, and the space can be saved when the heat sink device is mounted inside the device. Embodiments of the present invention will be described below with reference to the drawings. FIGS. 1 to 3 show a first embodiment of a heat sink device according to the present invention. In the figure, reference numeral 1 denotes a heat sink substrate, and a motor 2a of a cooling fan device 2 is fixed to one side surface of the heat sink substrate 1 by a fixing method such as mounting, screwing, press-fitting, and the other side surface. Heating element 3
Can be attached. Further, a plurality of fins 1a protruding from the heat sink base are arranged so as to surround a fan 2b fixed to the rotating shaft of the motor 2a, and the fins 1a also serve as a fan casing of the fan 2b. . In the heat sink device of the present embodiment configured as described above, the heat generated from the heating element 3 is diffused by heat conduction to the entire heat sink base 1 including the fins 1a. The wind induced by the fan 2b takes heat while flowing along the outer wall of the fin 1a and flows out of the heat sink base as indicated by the arrows in FIGS. In this embodiment, since the heat sink and the cooling fan device are integrally formed, the wind of the fan 2b can be directly and effectively applied to the fin 1a, and the heat radiation efficiency from the fin 1a can be improved. Can be dramatically increased. Therefore, when the cooling capacity of the heat sink is the same, the shape of the heat sink can be reduced in size. Further, since the fan casing of the fan 2b is constituted by the fins 1a, the overall size does not change much even though the heat sink base 1 and the cooling fan device are integrated. Therefore, even if the present heat sink device is disposed inside the apparatus main body, there is no restriction on mounting of other components, and a large space saving can be realized in combination with the above-mentioned downsizing of the heat sink. Equipment can be made smaller and thinner. It is needless to say that the type of fan to be used may be any of axial flow, centrifugal flow, diagonal flow, and cross flow type. As apparent from the above description,
The heat sink device of the present invention has a substantially quadrangular heat sink.
The outer end of the heat sink base is
A plurality of plate-shaped erects extending to the end of the sink base
The fin and the side on which the fin of the heat sink base is erected
And a driving means for rotating the fan
Wherein the plurality of fins include fins having different lengths.
And the inner end contour is circular, and
So that air is released from each side of the heat sink base
As a result, the surface area of the fins can be increased, the cooling efficiency is excellent, and an excellent effect that significant space saving can be achieved.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a front view of a heat sink device according to an embodiment of the present invention. FIG. 2 is a cross-sectional view of the heat sink device of the embodiment. FIG. 3 is a rear view of the heat sink device of the embodiment. FIG. 4 is a perspective view of a conventional heat sink. FIG. 5 is a view showing a state in which a cooling fan is mounted on an outer case of the device. FIG. 6 is a view showing a state in which the cooling fan is arranged inside the device so as to face the heat sink. Description: 1 heat sink base 1a fin 2 cooling fan 2a motor 2b fan 3 heating element

   ────────────────────────────────────────────────── ─── Continuation of front page    (56) References JP-A-62-49700 (JP, A)                 JP 62-55000 (JP, A)                 Shokai 55-162954 (JP, U)

Claims (1)

(57) [Claims] An approximately quadrilateral heat sink base and the heat sink
Outer end extends to the end of the heat sink base
A plurality of plate-shaped fins standing upright
The fan provided on the side where the fins
Driving means for rotating the fan.
The fins include fins of different lengths and
Guo shape is circular, and each of the heat sink bases
A heat sink device for discharging air from a side .