JPS60258496A - Continuous electroplating device - Google Patents

Abstract

PURPOSE:To prevent the generation of an overcoat by providing an expandable and contractable shielding body in a plating tank equipped with an electrode whose width is larger than the width of a steel strip so that the end part of the steel plate may be shielded. CONSTITUTION:A plating tank 4 is constituted of an upper and a lower insoluble electrode 2 whose width are larger than the width of a steel strip 1 and an insulating side plate 3, and the steel strip 1 is electroplated by charging a plating soln. A hollow shielding body 13 (an insulating material such as rubber), which can be moved in the plating soln. from the outside through a rod 8 in correspondence with the width of the steel strip 1 and can be expanded and contracted by the supply and discharge of compressed air from an air supply tube 12, is provided in the plating tank 4. By said constitution, the shielding body 13 is expanded to an imaginary line in correspondence with the width of the steel strip 1, and the outer surface is pressed against the upper and the lower electrode 2. Under said conditions, the plating is carried out. Accordingly, since a clearance 10 is eliminated, the electric current is not leaked to the steel strip 1 side from a space 11, and the generation of an overcoat at the end part of the steel strip is prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a continuous electroplating device for electroplating a continuously moving copper strip.

[Conventional technology]

As an apparatus for continuously electroplating a copper strip at high speed, a system as shown in FIGS. 5 and 6 has been known. That is, a plating bath 4 is constituted by upper and lower insoluble electrodes 2, 2, which are wider than the plate width of the steel strip 1, and a side plate 3.3 made of an insulating material, and the steel strip 1 is fed from an inlet 5, and the steel strip 1 is fed from the outlet 5. Apply the plating solution to the steel strip 1 from the plating solution spewing nozzle 7.7 installed in 6.
It is designed to be sent in a countercurrent to the flow and circulated.

In such conventional continuous electroplating equipment, steel strip 1
Completely excluding inlet 5 and outlet 6. It has a sealed structure, and the flow path for the plating solution is tubular with a rectangular cross section, so even if the plating solution is blown out at high speed, a uniform flow can be obtained in the width direction, and the flow direction is also constant. However, there were problems in that an overcoat occurred on one end of the copper strip and that current flow ran from the thicker to the thinner side in differential thickness plating.

Therefore, conventionally, as shown by the imaginary line in FIG. 6, a U-shaped insulating mask is moved into the plating bath 4 from outside the tank via a rod 8 in accordance with the width of the steel strip 1 in the plating solution. 9
, 9 are provided and the ends of the steel strip 1 are shaded by the masks 9, 9.

According to such a conventional method, uniform thickness plating on both sides with the same amount of coating on both sides prevents overcoating at the end of the copper strip 1, and uniform plating is possible. When this is done, there is a leakage current from the thicker coating side to the thinner coating side, and the plate end of the thinner coating side of the steel strip 1 is plated several times the target coating amount. That is, this phenomenon is caused by the mask 9,
Since there is a gap 10 between the side plate 3 and the electrodes 2, 2, the gap 10 between the side plate 3 and the mask 9 is removed from the electrode 2 corresponding to the thick side surface through the gap 10 through the plating solution. This is because a leakage current flows, which causes electrodeposition to occur on the light weight side surface of the steel strip 1 through the entire surface of the electrode 2 corresponding to the light weight surface.

[Problem that the invention seeks to solve]

The present invention is a continuous electroplating device having an electrode wider than the width of the steel strip, and is capable of overcoating the end of the copper strip and preventing current from flowing from the thick side to the thin side in differential thickness plating. It is possible to perform both equal-thickness plating on both sides and differential-thickness plating with different deposit amounts on the front and back sides on the same line.

[Means for solving problems]

The continuous electroplating apparatus of the present invention has a structure in which an expandable and contractible shield is disposed in a plating bath having an electrode wider than the width of the copper strip so as to shield the edge of the steel strip.

〔Example〕

Hereinafter, the present invention will be described in detail with reference to the drawings.

FIG. 1 shows a cutaway front view of the continuous electroplating apparatus of the present invention. In the apparatus shown in FIGS. A hollow shield 13.13 is provided which can be moved in the liquid according to the width of the steel strip 1 and can be expanded and contracted by supplying and discharging compressed air from the air supply pipe 12.

The shielding body 13.13 is made of rubber or rubber with a cored metal,
Or, it is formed of an insulating material such as vinyl with a metal core, and when it is expanded by being supplied with air from the air supply pipe 12,
The size is such that it comes into pressure contact with the upper and lower electrodes 2, 2.

In the above configuration, the shield 13.13 was expanded at a position corresponding to the width of the steel strip 1, as shown by the imaginary line in FIG. 1, and its outer surface was pressed against the upper and lower electrodes 2.2. If the work is carried out in this condition, the gap 1o shown in FIG. 6 disappears, so there is no current flowing from the gap 11 to the steel strip 1 side, and overcoating of the ends of the steel strip 1 is also prevented.

Therefore, both equal-thickness plating on both sides and differential-thickness plating with different coating amounts on the front and back sides can be performed stably and with high precision on the same line.

Incidentally, the shielding body 13.13 may be formed in a U-shape as shown in FIG.

Also, as noted in fnl, when the shield 13.13 is expanded, a seal is created between the shield 13.13 and the electrodes 2, 2, so as shown in FIGS. Board 3,3
The method can also be applied to an open type plating tank 4' that does not have a plating tank 4'.

It should be noted that the present invention is not limited only to the embodiment described in (1), and it goes without saying that various changes can be made without departing from the gist of the present invention.

(Effects of the Invention J As explained above, the continuous electroplating apparatus of the present invention prevents the overcoating of the ends of the steel strip and the current flow from the thicker to the thinner side in differential thickness plating. Therefore, it is possible to achieve the excellent effect of being able to perform both equal-thickness plating on both sides and differential-thickness plating with different adhesion amounts on the front and back sides with high precision and stability on the same line.

[Brief explanation of drawings]

FIG. 1 is a schematic cutaway front view of a continuous electroplating device of the present invention, FIGS. 2 to 4 are explanatory diagrams showing other embodiments of the present invention, and FIG. 5 is a schematic cutaway side view of a conventional device. Figure, 6th
The figure is a view taken along the line A-A in FIG. 5. 1 is a copper strip, 2 is an electrode, 4 and 4' are plating baths, 12 is an air supply pipe, and 13 is a shield. Patent Application Person Ishikawajimaban MW Kogyo Co., Ltd. Patent Applicant Agent Patent Applicant Agent

Claims (1)

[Scope of Claims] 1) A continuous method characterized in that an expandable and contractible shield is disposed in a plating bath having an electrode wider than the width of the copper strip so as to shield the edge of the steel strip. Type electroplating device. 2) Claim 1) in which the shield is formed in a U-shape
Continuous electroplating equipment as described in . 3] Continuous electroplating apparatus according to claim 1) or 2), in which the plating tank is a closed type; 4) Claim 1) or 2), in which the plating tank is an open type. Continuous electroplating equipment described in section