JPS60258273A - Electrically conductive coating composition - Google Patents

Electrically conductive coating composition

Info

Publication number
JPS60258273A
JPS60258273A JP11252284A JP11252284A JPS60258273A JP S60258273 A JPS60258273 A JP S60258273A JP 11252284 A JP11252284 A JP 11252284A JP 11252284 A JP11252284 A JP 11252284A JP S60258273 A JPS60258273 A JP S60258273A
Authority
JP
Japan
Prior art keywords
copper powder
acid
organic carboxylic
carboxylic acid
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11252284A
Other languages
Japanese (ja)
Inventor
Shoji Yamaguchi
祥司 山口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Petrochemical Co Ltd
Original Assignee
Mitsubishi Petrochemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Petrochemical Co Ltd filed Critical Mitsubishi Petrochemical Co Ltd
Priority to JP11252284A priority Critical patent/JPS60258273A/en
Publication of JPS60258273A publication Critical patent/JPS60258273A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To provide the titled composition having excellent electrical conductivity, and useful for the formation of layer for shielding the electromagnetic wave emission of a computer, etc., by treating electrolytic copper powder with an organic carboxylic acid, and compounding the product as the electrically conductive filler with a binder resin and an organic solvent. CONSTITUTION:The objective composition can be prepared by compounding (A) an electrically conductive filler obtained by washing (i) electrolytic copper powder having a particle size distribution characterized in that >=80wt% of the copper powder passes through the 350 mesh sieve, and having an apparent density of 0.5-1.5g/cm<3> and a specific surface area of >=2,000cm<3>/g (by sub-sieve sizing method) with (ii) an organic carboxylic acid (preferably citric acid), and drying the product, with (B) a binder resin (e.g. acrylic resin) and (C) an organic solvent (e.g. xylene, etc.).

Description

【発明の詳細な説明】 〔発明の目的〕 本発明は、高導電性を有する銅微粉を用いた導電性塗料
に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] The present invention relates to a conductive paint using fine copper powder having high conductivity.

〔産業上の利用分野〕[Industrial application field]

導電塗料は、ビデオゲーム、パーソナルコンピューター
、プリンター等のパルス、タイミング信号の電磁波を発
生する、もしくは利用するコンピュータ機器、デジタル
機器、事務機器等のプラスチックハウジングの電磁波シ
ールド層の形成に用いられる。
Conductive paints are used to form electromagnetic shielding layers for plastic housings of computer equipment, digital equipment, office equipment, etc. that generate or utilize electromagnetic waves such as pulses and timing signals for video games, personal computers, printers, etc.

〔従来技術〕[Prior art]

導電性塗料は、導電性フィラ微粉末、・例えば金、銀、
銅、ニッケル、モリブデン、タングステン等の金属粒子
もしくはこれらの誘導体や、カーボンブラック、グラフ
ァイト等の炭素系微粉末をポリフェニレンエーテル、ア
クリル系もしくはセルロース系熱可塑性樹脂又はエポキ
シ系、フェノール系熱硬化性樹脂の溶液に分散したもの
で、回路用ペースト、導電性産着剤、電磁波シールド剤
等として多くの用途に用いられている(特公昭50−1
8894号、同55−39083号)。
The conductive paint is made of conductive filler fine powder, such as gold, silver,
Metal particles such as copper, nickel, molybdenum, and tungsten or their derivatives, and carbon-based fine powders such as carbon black and graphite are mixed with polyphenylene ether, acrylic or cellulose thermoplastic resin, or epoxy or phenolic thermosetting resin. It is dispersed in a solution and is used for many purposes such as circuit paste, conductive adhesive, electromagnetic shielding agent, etc.
No. 8894, No. 55-39083).

上記金属粉としては、ニッケル粉が主に用いられている
が、銀は高価であり、ニッケルは、銀に比べ導電性が一
歩劣るといった欠点があった。そこで、銀とほぼ同等で
、ニッケルの約4倍の導電性を有する銅を用いた導電性
塗料の開発がさかんに行なわれている。
Nickel powder is mainly used as the metal powder, but silver is expensive and nickel has the disadvantage that its conductivity is one step inferior to that of silver. Therefore, efforts are being made to develop conductive paints using copper, which has approximately the same conductivity as silver and about four times as much conductivity as nickel.

銅系導電塗料に用いる銅粉としては、粉末冶金や電刷子
に用いられる電解銅粉や、インキ顔料に用いられるどう
砕銅粉が用いられているが、これらは導電塗料用に開発
されたものではなく、銀に比べ導電性が今−歩劣ってい
るのが実情である。
The copper powder used in copper-based conductive paints includes electrolytic copper powder used in powder metallurgy and electric brushes, and crushed copper powder used in ink pigments, but these were developed for use in conductive paints. However, the reality is that its conductivity is inferior to that of silver.

〔発明の構成〕[Structure of the invention]

本発明者らは鋭意研究の結果、350メツシユ以下(J
IS篩規格)80%以上の粒度分布をもち、比表面積2
000d/を以上(pishev社サブシープすイザー
法)、見掛密度が0.5〜1.52/d1の粉末特性を
有する電解銅粉を、有機カルボン酸処理することにより
表面の酸化層を除去した電解銅粉を用いる導電塗料が銀
塗料並の導電性を有することを見い出し、本発明に成す
るに至った。
As a result of intensive research, the present inventors found that 350 meshes or less (J
IS sieve standard) has a particle size distribution of 80% or more, and a specific surface area of 2
Electrolytic copper powder having powder properties of 0.000 d/d/ or more (Pishev's Subseep Iiser method) and an apparent density of 0.5 to 1.52/d1 was treated with an organic carboxylic acid to remove the oxide layer on the surface. It was discovered that a conductive paint using electrolytic copper powder has conductivity comparable to that of a silver paint, and the present invention was achieved.

〔銅粉〕 銅粉は、製法によりその形状及び粉末特性が表1に示す
ように異なるが、塗料に使用する銅粉は、粒径が数ミク
ロン−数十ミクロンであることが必要なため主に電解銅
粉やとう砕銅粉が用いられる。とり砕銅粉は、とう砕時
に、ステアリン酸等の脂肪酸を滑剤として用いるだめ、
これを除去しなければ導電性が発現しない上、比表面積
が犬きいため酸化防止処理がむずかしいといりだ欠点が
あるため好ましくない。一方、電解銅粉は、樹枝状に発
達した形状をもち、純度も高いため、高導電性が得やす
く導電性塗料用銅粉としては最も好ましい。電解銅粉の
中でも特に導電性塗料用に適しているのは、350メツ
シユ(JIS規格)の篩を通過する銅粉が80重量%以
上である粒度分布をもち、見掛密度がo、s 〜1.5
 y /l:tAで、サブシーブサイザー法で測定した
比表面積が2000、−d/f以上のものがすぐれた導
電性能を示す。 1これらの電解銅粉を、有機カルボン
酸(モノカルボン酸、ポリカルボン酸またはヒドロキシ
カルボン酸)溶液に浸せき、攪拌することにより銅粉表
面の酸化層を除去した後、銅粉を沖過、分離後、乾燥し
たσちに導電フィラーとして用いる。
[Copper powder] The shape and powder characteristics of copper powder vary depending on the manufacturing method, as shown in Table 1, but copper powder used in paints is mainly used because the particle size must be from several microns to several tens of microns. Electrolytic copper powder and crushed copper powder are used for this purpose. Crushed copper powder is made by using fatty acids such as stearic acid as a lubricant during crushing.
Unless this is removed, conductivity will not develop, and the specific surface area is extremely large, making anti-oxidation treatment difficult, which is undesirable. On the other hand, electrolytic copper powder has a developed dendritic shape and is highly pure, so it is easy to obtain high conductivity and is most preferred as copper powder for conductive paints. Among electrolytic copper powders, those particularly suitable for use in conductive paints have a particle size distribution in which the copper powder that passes through a 350 mesh (JIS standard) sieve accounts for 80% by weight or more, and has an apparent density of o, s ~ 1.5
y/l:tA, the specific surface area measured by the subsieve sizer method is 2000, -d/f or more, and exhibits excellent conductive performance. 1 These electrolytic copper powders are soaked in an organic carboxylic acid (monocarboxylic acid, polycarboxylic acid, or hydroxycarboxylic acid) solution and stirred to remove the oxidized layer on the surface of the copper powder, and then the copper powder is filtered and separated. After that, it is used as a conductive filler after drying.

表面処理に用いる有機カルボン酸としては、たとえば、
乳酸、酒石酸、グリセリン酸、リンゴ酸、クエン酸、グ
ルコン酸、トロバ酸、ベンジル酸、マンデル酸、タルト
ロン酸、アトロラクチン酸及びグリコール酸等のヒドロ
キシカルボン酸類;酢酸、グロピオン酸等のモノ・カル
ボン酸類、コハク酸、イタコン酸、トリカルバリル酸、
エチレンジアミン四酢酸等のポリカルボン酸類があげら
れる。
Examples of organic carboxylic acids used for surface treatment include:
Hydroxycarboxylic acids such as lactic acid, tartaric acid, glyceric acid, malic acid, citric acid, gluconic acid, trobic acid, benzylic acid, mandelic acid, tartronic acid, atrolactic acid and glycolic acid; monocarboxylic acids such as acetic acid and glopionic acid , succinic acid, itaconic acid, tricarballylic acid,
Examples include polycarboxylic acids such as ethylenediaminetetraacetic acid.

これら有機カルボン酸の中でも特に好ましいものはヒド
ロキシカルボン酸類である。これらの有機カルボン酸を
適当な溶剤に溶解した溶液に、銅粉末を加えて一定時間
浸漬して放置するか、又は攪拌すれば銅粉末の表面酸化
層は容易に除去される。
Particularly preferred among these organic carboxylic acids are hydroxycarboxylic acids. The surface oxidation layer of the copper powder can be easily removed by adding copper powder to a solution in which these organic carboxylic acids are dissolved in a suitable solvent, immersing the solution for a certain period of time, and leaving it to stand, or stirring it.

この銅粉の還元減量は0.2重量%以下である。The reduction loss of this copper powder is 0.2% by weight or less.

有機カルボン酸を溶解せしめる溶剤としては、水及び各
種の有機溶剤があるが、銅イオンの溶媒和能力の大きい
点を考慮して、水及びメタノール、エタノール、プロパ
ツール等のアルコール類が好ましい。
As the solvent for dissolving the organic carboxylic acid, there are water and various organic solvents, but water and alcohols such as methanol, ethanol, propatool, etc. are preferable in view of their high ability to solvate copper ions.

〔塗料成分〕[Paint components]

有機カルボン酸処理して表面:゛俊化層を除いた銅粉末
(以下これを「有機カルボン酸処理銅粉末」ということ
がある。)は、本発明の導゛覗塗料組成物の導4性フィ
ラーとして樹脂バインダー、有機溶剤とともに塗料成分
中に配合されるが、その銅粉の配合割合は、塗料組成分
中の10〜90重量%、好ましくは30〜70重寸%で
ある。塗料の樹脂成分としてはアクリル系有脂、ポリ塩
化ビニル、エチルセルロース系高分子等の熱可塑性樹脂
や、エポキシ系樹脂、フェノール系樹脂、ウレタン系樹
脂、尿素系樹脂等の熱硬化PE樹脂及びこれらの混合物
が利用できる。又、塗料組成物の粘度を低下させるのに
使用される溶剤としては、使用方法(吹き付は塗装、デ
ィッピング、スクリーン印刷等)被塗物(プラスチック
、木材等)によっテ異ナルカ、ヘンゼン、トルエン、キ
シレン等の炭化水素類;エチルアルコール、プロビルア
ルコール等のアルコール類;メチルエチルケトン、メチ
ルインブチルケトン等のケトン類:酢酸エチル、酢酸ブ
チル等のエステル類;エチルセロンルプ、ブチルセロソ
ルブ等のエーテル類等があげられる。
Copper powder treated with an organic carboxylic acid to remove the abrasive layer (hereinafter sometimes referred to as "copper powder treated with an organic carboxylic acid") has a conductive property of the conductive paint composition of the present invention. Copper powder is blended as a filler into the coating composition together with a resin binder and an organic solvent, and the blending ratio of the copper powder is 10 to 90% by weight, preferably 30 to 70% by weight of the coating composition. The resin components of the paint include thermoplastic resins such as acrylic fats, polyvinyl chloride, and ethyl cellulose polymers, and thermosetting PE resins such as epoxy resins, phenolic resins, urethane resins, and urea resins. Mixtures are available. In addition, solvents used to reduce the viscosity of coating compositions may vary depending on the method of use (spraying: painting, dipping, screen printing, etc.) and the material to be coated (plastic, wood, etc.). Hydrocarbons such as toluene and xylene; Alcohols such as ethyl alcohol and probyl alcohol; Ketones such as methyl ethyl ketone and methyl imbutyl ketone; Esters such as ethyl acetate and butyl acetate; Ethers such as ethyl selonup and butyl cellosolve etc. can be mentioned.

これら溶剤は、バインダー樹脂の種類等に応じて適宜に
選択して使用される。溶剤は一種類を単独使用してもよ
いし、また、2種以上を併用してもよい。
These solvents are appropriately selected and used depending on the type of binder resin. One type of solvent may be used alone, or two or more types may be used in combination.

これらを成分とする導電性塗料の配合組成は、使用する
塗装方法、用途によって異なるが、例として上げると電
磁波シールド用で吹きつけ塗装、有機カルボン酸処理銅
粉 40〜60重量%溶 剤 20〜55重量% 本発明の導電塗料組成物には、上記成分のほかに、必要
に応じて種々の添加剤を配合することができる。
The composition of conductive paints containing these components varies depending on the coating method and application used, but examples include spray coating for electromagnetic shielding, organic carboxylic acid treated copper powder 40-60% by weight solvent 20- 55% by weight In addition to the above-mentioned components, various additives can be added to the conductive coating composition of the present invention as required.

特に銅粉の沈降防止のだめの、各種界面活性剤、沈降防
止剤、増粘剤、チクソトロピック剤111分散剤や塗膜
の平滑性を出すだめの各種レベリング剤、長期に渡り導
電性を維持するだめの防錆剤、酸化防止剤その他必要に
応じて難燃剤等も導電性、塗膜物性をそこなわない範囲
で添加することができる。
In particular, various surfactants, anti-settling agents, thickeners, thixotropic agents, 111 dispersants, which are used to prevent settling of copper powder, and various leveling agents, which are used to make the coating smooth, and maintain conductivity over a long period of time. Rust preventive agents, antioxidants, and flame retardants may be added as necessary to the extent that conductivity and physical properties of the coating film are not impaired.

本発明の導電塗料組成物を調製は、上記バインダー樹脂
、有機カルボン酸処理銅粉、溶剤及び必要に応じて配合
する各種の添加剤等を混合し、通常の塗料の調製におい
て使用される様な分散手段(たとえば、ディスパー、ボ
ールミル、サンドミル、アトライター、三本ロール、フ
ーバーマーラー等)を用いて塗料化すればよい。かくし
て得られる本発明の9帯塗料組成物は、スプレー、・・
ケ塗り、ディッピング、スクリーン印刷等の手段により
被塗物上に塗布又は印刷して使用される。
The conductive coating composition of the present invention is prepared by mixing the above-mentioned binder resin, organic carboxylic acid-treated copper powder, solvent, various additives to be added as necessary, etc. It may be made into a paint using a dispersing means (for example, a disper, a ball mill, a sand mill, an attritor, a three-roll mill, a Huber muller, etc.). The nine-band coating composition of the present invention thus obtained can be sprayed,...
It is used by coating or printing on the object to be coated by means such as coating, dipping, or screen printing.

以下に実施例を上げて本発明を説明する力瓢実施例中の
「部」は「重量部」を意味し、「%」は「重量%」を意
味する。
The present invention will be explained with reference to examples below. In the examples, "parts" means "parts by weight" and "%" means "% by weight."

え、。hboヵよ、□、。4□□エエ、。。ヵ )“法
により測定した。すなわち、第1図に示した様な、銅箔
部を両端から幅1.5傭残して他をエツチング除去した
長さ10儒、幅53の銅張り紙フェノール積層板(基板
上の両銅箔部2と2間の距離は7LMlである。)上に
、導電塗料を1m幅に塗布し、23℃、50%RHで2
4時間放置後、塗膜3の厚さをデジタルマイクロメータ
(株式会社三豊製作所製のデジマチックインジケータ5
43)で、又、その塗膜の電気抵抗をホイートストンブ
リッジ(横河電気袈作所製タイプ2755)で測定し、
次式によシ体積固有抵抗を算出した。
picture,. It's hbo, □. 4□□Eeee. . (c) "Measurement was carried out by the method. In other words, as shown in Figure 1, a copper-clad paper phenolic laminate with a length of 10 mm and a width of 53 mm was prepared by etching away the copper foil portions leaving a width of 1.5 mm from both ends. (The distance between both copper foil parts 2 and 2 on the board is 7LMl.) On top, conductive paint is applied to a width of 1 m, and
After leaving it for 4 hours, measure the thickness of the coating film 3 using a digital micrometer (Digimatic Indicator 5 manufactured by Mitoyo Seisakusho Co., Ltd.).
43), and the electrical resistance of the coating film was measured using a Wheatstone bridge (type 2755 manufactured by Yokogawa Electric Co., Ltd.).
The volume resistivity was calculated using the following formula.

測定抵抗値×厚さ 実施例1 表2に示す粉末特性を有する工業用電解銅粉100部に
、10%クエン酸水溶液400部を加え、攪拌機で15
時間攪拌後、濾過して銅粉を分離し、よく水洗し、乾燥
した。
Measured resistance value x thickness Example 1 400 parts of a 10% citric acid aqueous solution was added to 100 parts of industrial electrolytic copper powder having the powder characteristics shown in Table 2, and the mixture was mixed with a stirrer for 15 minutes.
After stirring for an hour, the copper powder was separated by filtration, thoroughly washed with water, and dried.

ついで、 上記クエン酸処理済銅粉 92部 ポリメチルメタクリレート(和光補薬試薬分子量約10
万)の40%トルエン溶液 63部 メチルエチルケトン 23部 キシレン 23部 の混合物を、高速ディスパー分散を行なわせ、導電塗料
組成物を調製した。この塗料組成物を第1図に示した基
板1上に、1crn巾で塗布し、23℃、50%RHの
条件下で24時間放置後、得た塗膜3の体積固有抵抗値
を測定したところ、7.4×1σ−Ω・側であった。
Next, 92 parts of the above-mentioned citric acid-treated copper powder
A conductive coating composition was prepared by dispersing a mixture of 40% toluene solution (63 parts, methyl ethyl ketone, 23 parts, xylene, 23 parts) by high-speed dispersion. This coating composition was applied to a width of 1 crn on the substrate 1 shown in FIG. 1, and after being left for 24 hours under conditions of 23° C. and 50% RH, the volume resistivity value of the obtained coating film 3 was measured. However, it was on the 7.4×1σ-Ω· side.

実施例2 実施例1のクエン酸のかわりに酒石酸を用いる他は実施
例1と同様にして表2の粉末特性を有する工業用電解銅
粉の表面酸化物を除去した。この銅粉の還元減量は0.
12重騎%であった。
Example 2 Surface oxides of industrial electrolytic copper powder having the powder properties shown in Table 2 were removed in the same manner as in Example 1, except that tartaric acid was used instead of citric acid. The reduction loss of this copper powder is 0.
It was 12 heavy horsemen%.

上記酒石酸処理電解@8 100部 エポキシ樹脂(エピコート+815) 50部(油fヒ
シエルエポキシ社) 硬化剤(エピキュア+3025) 25部(油化シェル
エポキシ化) 上記混合物をロール混練し、導電性ペーストを得た。こ
のものを200メツシユのテトロン製スクリーンを用い
て第1図に示した基板1上に、1−幅でスクリーン印刷
して塗膜を形成した。このものを23℃、50%RHで
24時間放置後の塗膜の体積固有抵抗値を測定したとこ
ろ、3.5X10 Ω・mであった。、 比較例1〜5 表2に示す市販されている電解銅粉で塗料に使用できそ
うな粒径をもつものについて、実施例1と同様のクエン
酸処理を行ない、かつ、同様の組成の塗料組成物を調製
し、実施例1と同一の条件で塗膜を形成させ、これの体
積固有抵抗を測定したところ、表2の様な結果が得られ
た。
The above tartaric acid treatment electrolysis@8 100 parts Epoxy resin (Epikoat +815) 50 parts (Oil F Hishiel Epoxy Co., Ltd.) Hardening agent (Epicure +3025) 25 parts (Oil shell epoxidation) The above mixture was roll-kneaded to form a conductive paste. Obtained. This product was screen printed with a 1-width width on the substrate 1 shown in FIG. 1 using a 200-mesh Tetron screen to form a coating film. The volume resistivity of the coating film was measured after being left at 23° C. and 50% RH for 24 hours, and found to be 3.5×10 Ω·m. , Comparative Examples 1 to 5 Commercially available electrolytic copper powders shown in Table 2 with particle sizes suitable for use in paints were treated with citric acid in the same manner as in Example 1, and paints with the same composition were prepared. A composition was prepared, a coating film was formed under the same conditions as in Example 1, and the volume resistivity of this was measured, and the results shown in Table 2 were obtained.

なお、比較例5で用いたクエン酸処理した銅粉の還元減
量は0.14重量%であった。
Note that the reduction loss of the citric acid-treated copper powder used in Comparative Example 5 was 0.14% by weight.

比較例− クエン酸処理銅粉のかわりにフレーク状銀粉を用いる以
外は、実施例1と同様にして、塗料組成物を調製し、ま
た、これを用いて塗膜を作成し、塗膜の体積固有抵抗値
を測定したところ、1.7X10−4ΩaCrnであっ
た。
Comparative Example - A coating composition was prepared in the same manner as in Example 1 except that flaky silver powder was used instead of citric acid-treated copper powder, and a coating film was created using the same, and the volume of the coating film was When the specific resistance value was measured, it was 1.7×10 −4 ΩaCrn.

比較例到僚 クエン酸処理銅粉のかわシに、カルボニルニッケル粉を
用い1以外は実施例1と同様にじて塗料組成物を調製し
、また、これを用いて塗膜を作成し、塗膜の体積固有抵
抗値を測定したところ、3.2×10−3Ω1ICrn
でちった。
Comparative Example A coating composition was prepared in the same manner as in Example 1 except for step 1, using carbonyl nickel powder as a substitute for citric acid-treated copper powder. When the volume resistivity value of the film was measured, it was found to be 3.2×10-3Ω1ICrn
It was made.

(以下余白) )。(Margin below) ).

【図面の簡単な説明】[Brief explanation of the drawing]

添付図面は塗料塗膜の体積固有抵抗の測定に用いた部分
銅張り積層板の斜視図であシ、図中の1は、紙フェノー
ル基板、2d銅箔部、3は塗膜をそれぞれ示す。 特許出願人 三菱油化株式会社 代理人 弁理士 古 川 秀 利 代理人 弁理士 長 谷 正 久 第1図
The attached drawing is a perspective view of a partially copper-clad laminate used for measuring the volume resistivity of a paint film. In the drawing, 1 represents a paper phenol substrate, 2d a copper foil portion, and 3 a paint film, respectively. Patent Applicant Mitsubishi Yuka Co., Ltd. Agent Patent Attorney Hidetoshi Furukawa Agent Patent Attorney Masahisa Hase Figure 1

Claims (1)

【特許請求の範囲】 1)、 (a) 3 s oメツシュの篩を通過する銅
粉が80重量%以上である粒度分布をもち、見掛密度が
o、s 〜t、s y /cwl、比表面積が2000
cd/を以上(サブシープサイザー法)の電解銅粉を有
機カルボン酸で洗浄し、乾燥したものを導電フィラーと
し、これに(b)バインダー樹脂と(c)有機溶剤を配
合してなる導電塗料組成物。 2)、有機カルボン酸がクエン酸であることを特徴とす
る特許請求の範囲第1項記載の導電塗料組成物。
[Claims] 1) (a) Copper powder passing through a 3s o mesh sieve has a particle size distribution of 80% by weight or more, and has an apparent density of o, s to t, s y /cwl, Specific surface area is 2000
A conductive paint made by washing the electrolytic copper powder of cd/ (sub-seep sizer method) with an organic carboxylic acid, drying it, using it as a conductive filler, and blending it with (b) a binder resin and (c) an organic solvent. Composition. 2) The conductive coating composition according to claim 1, wherein the organic carboxylic acid is citric acid.
JP11252284A 1984-06-01 1984-06-01 Electrically conductive coating composition Pending JPS60258273A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11252284A JPS60258273A (en) 1984-06-01 1984-06-01 Electrically conductive coating composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11252284A JPS60258273A (en) 1984-06-01 1984-06-01 Electrically conductive coating composition

Publications (1)

Publication Number Publication Date
JPS60258273A true JPS60258273A (en) 1985-12-20

Family

ID=14588745

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11252284A Pending JPS60258273A (en) 1984-06-01 1984-06-01 Electrically conductive coating composition

Country Status (1)

Country Link
JP (1) JPS60258273A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5372749A (en) * 1992-02-19 1994-12-13 Beijing Technology Of Printing Research Institute Chinese Method for surface treating conductive copper powder with a treating agent and coupler
KR20010035108A (en) * 2000-12-27 2001-05-07 마상만 Composition ingredients textile and cloth for shielding of electromagnetic wave, and manufacture method thereof
JP2002188031A (en) * 2000-12-19 2002-07-05 Dainippon Printing Co Ltd Ink composition for absorbing electromagnetic wave and absorber for electromagnetic wave
JP2013047365A (en) * 2011-08-29 2013-03-07 Hitachi Cable Ltd Copper fine particle dispersion and preparation method therefor, copper fine particle and preparation method therefor, copper paste containing copper fine particle, copper film and preparation method therefor

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5372749A (en) * 1992-02-19 1994-12-13 Beijing Technology Of Printing Research Institute Chinese Method for surface treating conductive copper powder with a treating agent and coupler
JP2002188031A (en) * 2000-12-19 2002-07-05 Dainippon Printing Co Ltd Ink composition for absorbing electromagnetic wave and absorber for electromagnetic wave
KR20010035108A (en) * 2000-12-27 2001-05-07 마상만 Composition ingredients textile and cloth for shielding of electromagnetic wave, and manufacture method thereof
JP2013047365A (en) * 2011-08-29 2013-03-07 Hitachi Cable Ltd Copper fine particle dispersion and preparation method therefor, copper fine particle and preparation method therefor, copper paste containing copper fine particle, copper film and preparation method therefor

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