JPS6025761U - Metal ion supply device for electroplating - Google Patents
Metal ion supply device for electroplatingInfo
- Publication number
- JPS6025761U JPS6025761U JP11519883U JP11519883U JPS6025761U JP S6025761 U JPS6025761 U JP S6025761U JP 11519883 U JP11519883 U JP 11519883U JP 11519883 U JP11519883 U JP 11519883U JP S6025761 U JPS6025761 U JP S6025761U
- Authority
- JP
- Japan
- Prior art keywords
- supply device
- metal ion
- ion supply
- rotating body
- electroplating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案による金属イオン供給装置の構成を示す
模式断面図、第２図は本考案装置におけるめっき液供給
装置の他の実施態様を示す模式断面図、第３図Ａ、 Ｂ
、 Ｃは本考案装置の中空回転体の実施態様を示す第１
図の■−■線矢視断面図、第４図は本考案装置を使用す
る場合と、従来のＡ方式、Ｂ方式を使用する場合の溶解
すべきめつき金属粒、金属小片サイズｄと一定イオン濃
度のめつき液を得る時間ｔとの関係を比較する線図、第
５図Ａ、 Ｂはそれぞれ第４図にて対比した従来あめつ
き金属粒、金属小片の溶解装置Ａ方式、Ｂ方式を示す模
式断面図である。
２・・・中空回転体、４・・・孔、８・・・回転駆動装
置、１０・・・中空軸、１２・・・ホッパー、１４・・
・金属粒、゛金属小片、１６・・・開閉器、１８・・・
架台、２０・・・架台、２２・・・めっき液、２４・・
・めっき液供給配管、２６・・・液槽、２８・・・シー
ル装置、３０・・・めっき液排出孔、３２・・・被覆部
、３６・・・ノズル。FIG. 1 is a schematic cross-sectional view showing the configuration of the metal ion supply device according to the present invention, FIG. 2 is a schematic cross-sectional view showing another embodiment of the plating solution supply device in the device of the present invention, and FIGS. 3 A and B.
, C is the first embodiment of the hollow rotating body of the device of the present invention.
Figure 4 is a sectional view taken along the line ■-■ in the figure, and Figure 4 shows the plated metal particles to be melted, the metal particle size d, and the constant ion when using the device of the present invention and when using the conventional methods A and B. Figures 5A and 5B are diagrams comparing the relationship between the time t and the time t for obtaining a concentrated plating solution, respectively. FIG. 2... Hollow rotating body, 4... Hole, 8... Rotation drive device, 10... Hollow shaft, 12... Hopper, 14...
・Metal particles, ゛Small metal pieces, 16... Switches, 18...
Frame, 20... Frame, 22... Plating solution, 24...
- Plating solution supply piping, 26...Liquid tank, 28...Seal device, 30...Plating solution discharge hole, 32...Coating portion, 36...Nozzle.
Claims (5)
ン供給装置において、回転自在に軸支され外周に多数の
孔を有する中空回転体と、前記中空回転体内にめっき金
属粒もしくは金属小片を供給する装置と、前記中空回転
体内にめっきに−使用されてめっき金属イオン濃度の減
少しためつき液を供給する装置と、前記中空回転体をめ
っき液中に浸漬収容する液槽と、前記液槽の底部に設け
られためつき金属イオン濃度の増大せるめつき液の排出
孔と、を有して成ることを特徴とする電気めっきにおけ
る金属イオン供給装置。(1) A metal ion supply device for electroplating using an insoluble anode, which comprises: a rotatably supported hollow rotary body having numerous holes on its outer periphery; and a device for supplying plated metal grains or metal pieces into the hollow rotary body. , a device for supplying a plating solution used for plating to reduce the concentration of plating metal ions into the hollow rotating body; a liquid tank for immersing the hollow rotating body in the plating solution; 1. A metal ion supply device for electroplating, comprising a plating solution discharge hole for increasing the plating metal ion concentration.
孔を有する金網もしくは多孔板より成る被・ 覆部を有
する、実用新案登録請求の範囲の第１項に記載の電気め
っきにおける金属イオン供給装置。(2) The metal in electroplating according to item 1 of the utility model registration claim, wherein the hollow rotating body has a covering made of a wire mesh or a perforated plate having holes smaller in diameter than the holes provided on the outer periphery. Ion supply device.
求の範囲の第１項もしくは第２項に記載の電気めつへに
おける金属イオン供給装置。(3) The metal ion supply device for electric glasses according to claim 1 or 2 of the utility model registration claim, wherein the hollow rotating body is a cylindrical body.
請求の範囲の第１項もしくは第２項に記載の電気めっき
における金属イオン供給装置。(4) The metal ion supply device for electroplating according to claim 1 or 2, wherein the hollow rotating body is a polygonal cylindrical body.
用新案登録請求の範囲の第１項から第４項までのいずれ
かの項に記載の電気めっきにおける金属イオン供給装置
。(5) The metal ion supply device for electroplating according to any one of claims 1 to 4 of the utility model registration claim, wherein the hollow rotating body has a large number of protrusions on its inner surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11519883U JPS6025761U (en) | 1983-07-25 | 1983-07-25 | Metal ion supply device for electroplating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11519883U JPS6025761U (en) | 1983-07-25 | 1983-07-25 | Metal ion supply device for electroplating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6025761U true JPS6025761U (en) | 1985-02-21 |
| JPS6145170Y2 JPS6145170Y2 (en) | 1986-12-19 |
Family
ID=30266006
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11519883U Granted JPS6025761U (en) | 1983-07-25 | 1983-07-25 | Metal ion supply device for electroplating |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6025761U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63401U (en) * | 1986-06-17 | 1988-01-05 | ||
| JPS63153401U (en) * | 1987-03-27 | 1988-10-07 | ||
| JP2015006682A (en) * | 2013-06-25 | 2015-01-15 | アイシン精機株式会社 | Water-soluble release agent, and method and device for producing the same |
-
1983
- 1983-07-25 JP JP11519883U patent/JPS6025761U/en active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63401U (en) * | 1986-06-17 | 1988-01-05 | ||
| JPS63153401U (en) * | 1987-03-27 | 1988-10-07 | ||
| JP2015006682A (en) * | 2013-06-25 | 2015-01-15 | アイシン精機株式会社 | Water-soluble release agent, and method and device for producing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6145170Y2 (en) | 1986-12-19 |
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